SUBSTRATE PROCESSING DEVICE

WIPO Patent Application WO/2003/050860

A1

A substrate processing device of a horizontal transfer type to horizontally transfer substrates to pass successively through a chemical liquid processing section and a water wash processing section, wherein the chemical liquid adhering to the lower surface of a substrate is efficiently removed, stably removed without resorting to inclination of the substrate and without producing splashes. For this purpose, the outlet portion of the chemical liquid processing section is provided with a noncontact type scraper (44) opposed to the lower surface of the substrate with a very small distance therebetween substantially throughout the width. A plurality of substrate support rollers (45) disposed transversely of the substrate are disposed upstream of the scraper (44) and adjacent the scraper (44). The disposition of the substrate support roller (45) avoids a situation in which the front end or rear end of the substrate, which is easily flexible, large in size and thin−walled, comes in contact with the scraper (44).

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TAUCHI HITOSHI (JP)

PCT/JP2001/010962

June 19, 2003

December 13, 2001

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SUMITOMO PRECISION PROD CO (JP)
TAUCHI HITOSHI (JP)

H01L21/00; (IPC1-7): H01L21/306

JPH09326342A	1997-12-16
JPH11145109A	1999-05-28

Ubukata, Motoshige (Kawaramachi 4-chome Chuo-ku Osaka-shi, Osaka, JP)

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