SURFACE MICROSTRUCTURE MEASURING METHOD, SURFACE MICROSTRUCTURE MEASUREMENT DATA ANALYZING METHOD, AND X-RAY SCATTERING MEASURING DEVICE

WIPO Patent Application WO/2010/119844

A1

Disclosed are a surface microstructure measuring method enabling accurate measurement of the microstructure of a surface and evaluation of the three-dimensional structural features, a surface microstructure measuring program, and an X-ray scattering intensity measuring device. According to the surface microstructure measuring method, X-rays are made to strike the surface of a sample at a very small incident angle, the scattering intensity is measured, a sample model in which one or more layers are formed in the direction perpendicular to the surface and unit structures are arrayed periodically in the layers in the direction parallel to the surface is tentatively made on the basis of the surface microstructure, the scattering intensity of X-rays scattered by the microstructure is calculated in consideration of the effects of the refraction and reflection caused by the layers, the X-ray scattering intensity calculated using the sample model is fitted in the measured scattering intensity, and an optimum value of a parameter specifying the shape of the unit structure is determined according to the result of the fitting. With this, the microstructure can be measured accurately.

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OMOTE KAZUHIKO (JP)
ITO YOSHIYASU (JP)

PCT/JP2010/056542

October 21, 2010

April 12, 2010

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RIGAKU DENKI CO LTD (JP)
OMOTE KAZUHIKO (JP)
ITO YOSHIYASU (JP)

G01B15/04; G01N23/201

JP2007285923A	2007-11-01
JPH1130511A	1999-02-02
JPH06229950A	1994-08-19
JPH06160312A	1994-06-07
JP2006170791A	2006-06-29
JP2005523581A	2005-08-04
JP2008177567A	2008-07-31
JP2007527531A	2007-09-27
JP2005121613A	2005-05-12
JP2005214712A	2005-08-11

FUKUCHI TAKEO (JP)
Fukuchi Takeo (JP)

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