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Title:
VACUUM VAPOR DEPOSITION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/076770
Kind Code:
A1
Abstract:
This vacuum vapor deposition apparatus is provided with: an evaporation source that is disposed to face the position where a target is disposed; an evaporation source cover, which surrounds the evaporation source, and which has a discharge port through which a deposition material is discharged; a deposition preventing board that is disposed around the evaporation source cover; a film thickness sensor that detects the thickness of a film formed of the deposition material discharged from the evaporation source; and a heat reflection suppressing means, which is disposed at a position where heat can be re-reflected and radiated to the film thickness sensor, and which suppresses heat that can be radiated to the film thickness sensor.

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Inventors:
SHIGEOKA NOBUYUKI (JP)
Application Number:
PCT/JP2012/079420
Publication Date:
May 22, 2014
Filing Date:
November 13, 2012
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C23C14/24
Foreign References:
JP2005325391A2005-11-24
JP2009064758A2009-03-26
JP2007297704A2007-11-15
JP2009120924A2009-06-04
JPH1025563A1998-01-27
JP2009120924A2009-06-04
JPS6093303A1985-05-25
Other References:
See also references of EP 2921571A4
Attorney, Agent or Firm:
MORI Ryuichirou et al. (JP)
Woods Ryuichiro (JP)
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