Title:
VEHICLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/062819
Kind Code:
A1
Abstract:
The present invention provides a vehicle circuit board that enables an improvement in heat dissipation properties. Provided is a circuit board (10) to be mounted on a vehicle, said circuit board (10) comprising: a substrate (20); a first electronic component (30) that is mounted on the substrate (20) and that has a heat source terminal (33); a second electronic component (40) that is mounted on the substrate (20) and that has at least one function from among a communication function, a storage function, and an information processing function; and a heat transmission path (50) that is provided to the substrate (20) and that connects the heat source terminal (33) and an open terminal (43) of the second electronic component (40).
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Inventors:
NISHIZUKA MAKIO (JP)
Application Number:
PCT/JP2023/029992
Publication Date:
March 28, 2024
Filing Date:
August 21, 2023
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K1/02; H05K3/46; H05K7/20
Domestic Patent References:
| WO2021152899A1 | 2021-08-05 |
Foreign References:
| JP2014207370A | 2014-10-30 | |||
| JP2011014758A | 2011-01-20 | |||
| JP2021068809A | 2021-04-30 | |||
| JP2021158208A | 2021-10-07 | |||
| JP2000298003A | 2000-10-24 | |||
| JP2014229829A | 2014-12-08 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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