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Patent Searching and Data


Matches 151 - 200 out of 111,684

Document Document Title
WO/2022/224508A1
The present invention pertains to a polishing method and polishing device for polishing a substrate such as a wafer while also pressing the substrate up against a polishing surface of a polishing pad, and, in particular, to a polishing m...  
WO/2022/222298A1
A grinding liquid supply system (1), a grinding apparatus, an air discharging method, and a grinding method. The grinding liquid supply system comprises: a grinding liquid filter (10); a sensor (11) used for monitoring whether there are ...  
WO/2022/224357A1
One aspect of the present disclosure provides a CMP polishing liquid for polishing a polysilicon, the CMP polishing liquid containing abrasive grains and a cationic polymer that contains at least one polymer selected from the group consi...  
WO/2022/224064A1
Methods and related systems include applying a first fluid to a hard surface, grinding the hard surface using at least one structured-abrasive pad while removing the first fluid, applying a second fluid to the hard surface, and scrubbing...  
WO/2022/224356A1
A polishing liquid which contains: abrasive grains containing a hydroxide of a tetravalent metal element; a polymer that comprises a structural unit represented by formula (1); and a liquid medium. (In formula (1), * represents a bonding...  
WO/2022/223277A1
A surface treatment device for treating a surface of a substrate support, wherein the surface treatment device comprises a contacting surface that is configured to contact the surface of the substrate support. The contacting surface is c...  
WO/2022/223827A1
The present invention relates to a segment of a fixture, the fixture being comprised of a number of such segments arranged to form a fixture ring, the segment comprising a carrier segment and a cap segment.  
WO/2022/222280A1
A rotary ultrasonic grinding machine tool, comprising a rotary ultrasonic grinding spindle (1), an ultrasonic power transmission device (2), a spindle clamping and lifting device (3), and a part clamping and feeding device (4), wherein t...  
WO/2022/221132A1
A heat chamfering method for a glass panel includes bringing a heater into contact with an edge of a glass panel by causing the heater to approach a chamfering start point, heat-chamfering the edge by moving the heater from the chamferin...  
WO/2022/221003A1
A method of manufacturing is provided, including forming a metal frame of a head-mounted computing device shaped as a pair of eyeglasses. Forming the metal frame may include additively manufacturing the metal frame of the head-mounted co...  
WO/2022/220504A1
The present invention relates to a sander and more specifically to a sander capable of excellently suctioning putty dust that is generated and scattered to the outside during polishing work, and, when sanding a surface, enabling working ...  
WO/2022/219955A1
The present invention pertains to a method for manufacturing a semiconductor wafer, the method being characterized by comprising, at least, a chamfering step for polishing the circumferential edge of a wafer and forming a chamfered part ...  
WO/2022/219562A1
A grating device, for a conglomerated or crystalline payload substance, with combined grinding and stirring functions is described; a respective method of grating a conglomerated or crystalline payload substance, combined with grinding a...  
WO/2022/221646A1
A lineal aligned abrasive particle structure is presented. The structure includes a plurality of shaped abrasive particles. Each of the shaped abrasive particles comprises a perimeter and a thickness. The perimeter of each of the shaped ...  
WO/2022/221174A1
A belt sander for sanding a workpiece and defining a center of gravity within a first plane. The belt sander includes a housing, a handle defining a second plane, and a drive unit disposed within the housing. The drive unit includes a mo...  
WO/2022/220161A1
The present invention addresses the problem of providing a ferrule polishing material which is suitable for polishing a ferrule. This ferrule polishing material which solves the above problem includes: a binder comprising a resin mater...  
WO/2022/219228A1
The invention is a device (301 ) for inspecting the shape of the blade (1) of a skate (100), with the skate blade having blade alignment markings (11). The device comprises a rectangular straight plate (4) with a first edge (401 ) and a ...  
WO/2022/219507A1
Some methods for making a granular material comprise crushing demetallized slag particles with one or more crushers and screening the crushed demetallized slag particles with one or more screens to separate the demetallized slag particle...  
WO/2022/215370A1
The present invention is a wafer processing method characterized by surface-grinding a front surface of a wafer and a back surface opposite the front surface, with a grindstone with a grit number of 10000 or more, and double-side polishi...  
WO/2022/216554A1
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image ...  
WO/2022/215553A1
This lignin-modified novolac-type phenol resin has a weight-average molecular weight of 5,500 or more.  
WO/2022/214666A1
A system (50) for handling a structural member (44) of a blade (10) of a wind turbine (2), comprising a member support (52) configured for supporting the structural member (44), the member support (52) being configured to be mounted to a...  
WO/2022/217135A1
A belt sander for sanding a workpiece including a main housing, a motor having a motor shaft disposed within the main housing, a gear assembly driven by the motor shaft, and a drive assembly coupled to the gear assembly for driving a san...  
WO/2022/216179A1
The invention relates to cleaning surfaces of contaminants using particles of a solid cryogenic substance. A device comprises a casing, a rotating bladed array, a fixed bladed array secured on the casing, and a flat sieve array secured i...  
WO/2022/215628A1
The present invention suppresses a decrease in dimensional accuracy. This method for manufacturing a glass substrate supports a semiconductor device, and generates a glass mother plate, measures the thickness, thickness deviation, and wa...  
WO/2022/210744A1
[Problem] To provide a polishing composition that has a superior working force and that has good washability after polishing. [Solution] A polishing composition including: abrasive grains; water; and a hydrophobic dispersion medium. The ...  
WO/2022/207711A1
The present invention relates to a tool comprising a cemented carbide part and a steel part joined by brazing where the steel part has an average hardness of between 390 and 510 HV30. The braze joint comprises Ti and a TiC layer with a t...  
WO/2022/210165A1
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing...  
WO/2022/205656A1
A polishing device and polishing process for an indium phosphide substrate, which device and process belong to the technical field of indium phosphide polishing. The polishing device comprises an electrolytic cell, and also comprises an ...  
WO/2022/210676A1
This polishing pad has a polishing layer that comprises an isocyanate-terminated prepolymer and a polyurethane resin foam derived from a curing agent, wherein: the distance between hard segments in the polishing layer as measured by smal...  
WO/2022/211085A1
A belt processing device (10) moves a processing belt (34) relative to a workpiece (W) to process the workpiece. The belt processing device comprises a first roller (40) that is a processing roller, a second roller (32) that is a driven ...  
WO/2022/209389A1
The present invention relates to a polishing pad and a polishing device for use in polishing a substrate such as a wafer. Moreover, the present invention relates to a method of polishing a substrate such as a wafer. A polishing pad (30) ...  
WO/2022/210721A1
The present invention provides a machining apparatus and a machining method that make it possible to perform machining on a to-be-machined object at a high machining rate, with a rigidity equivalent to that of a conventional apparatus. T...  
WO/2022/209758A1
Provided is a polishing method whereby it becomes possible to reduce defects on the surface of an object to be polished. The polishing method comprises a polishing step for supplying a polishing composition S1 containing abrasive grains ...  
WO/2022/204758A1
An automated abrasive control system 100 is provided for controlling abrasive flow in a pneumatic abrasive blast pot 110 having at least one blast hose 116 (shown coupled to a blast nozzle 115). The pneumatic abrasive blast pot 110 is us...  
WO/2022/210264A1
This polishing pad includes: a polyurethane sheet serving as a polishing layer; and an end point detection window provided in an opening in the polyurethane sheet. In a dynamic viscoelasticity measurement of the end point detection windo...  
WO/2022/211714A1
The disclosure relates to a blast cabinet (100) for blasting at least one object by directing a flow of blasting media from a blasting nozzle (101) arranged within the blast cabinet (100) towards a point of blasting (102) of the at least...  
WO/2022/210037A1
Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous ph...  
WO/2022/210216A1
Provided is an adhesive tape processing method capable of easily separating a base material and an adhesive constituting an adhesive tape, at low cost. Also provided is an adhesive tape processing device for use with such an adhesive tap...  
WO/2022/209229A1
Provided is a polishing composition that can polish a resin-made object to be polished at high polishing speed and that can polish the surface of the resin-made object to be polished so as to be flat and smooth. This polishing compositio...  
WO/2022/209081A1
The present invention reduces the time required for alignment work and comprises: a rotatable cutting table 2A, 2B that holds a sealed substrate W that has an alignment mark AM provided thereupon; a cutting mechanism 4 that cuts the seal...  
WO/2022/205548A1
The present invention provides a cylindrical grinding machine, comprising: a frame, a machine body, a working table, a Z-axis guide rail assembly, an X-axis guide rail assembly, a B-axis rotary assembly, and a grinding frame. The frame i...  
WO/2022/205542A1
A negative-pressure adsorption static-pressure supporting guide rail of a machining machine tool, comprising a guide rail groove (1), a guide rail body, and a static pressure supporting assembly. The guide rail groove (1) is fixedly form...  
WO/2022/209150A1
[Problem] To provide a means which, when used for polishing works comprising polysilicon and silicon nitride, is effective in inhibiting both insufficient polishing and dishing. [Solution] A polishing composition which comprises abrasive...  
WO/2022/212161A1
Handheld trencher attachment assemblies are disclosed. In one embodiment, the assembly includes a base having digging bar and power cutter portions. The digging bar portion having opposed first and second sides and an opening that extend...  
WO/2022/201650A1
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a wor...  
WO/2022/201649A1
[Problem] To provide a processing apparatus that flattens a workpiece so as to have a desired thickness. [Solution] A processing apparatus 1 flattens a non-circular shape workpiece W with a grinding stone 21 and is provided with: a sucti...  
WO/2022/203881A1
Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The up...  
WO/2022/200722A1
The invention relates to a method for manufacturing a metal alloy part for an aircraft turbine engine, said method comprising the steps of: • a) producing a blank of the part by additive manufacturing by laser fusion on a powder bed, a...  
WO/2022/203781A1
A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. ...  

Matches 151 - 200 out of 111,684