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WO/2023/248951A1 |
The purpose of the present invention is to provide: silica particles which has excellent mechanical strength, polishing characteristics and storage stability; a silica sol; and a polishing composition. The present invention relates to si...
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WO/2023/244740A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization, comprising one or more acrylate urethane oligomers, one or more acrylate monomers and at least one photo-polymerization initi...
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WO/2023/243118A1 |
This honing device comprises: a honing tool (1); a rotary main shaft (2) to which the honing tool (1) is fixed; an axial-direction drive unit (4) that moves the rotary main shaft (2) in the Z-axis direction; a workpiece holder (3) that h...
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WO/2023/241411A1 |
A finishing device, comprising a thrust system (101), a sealing system (102), a conveying pipe system (103), and a recovery system (104), wherein the sealing system (102) comprises a piston (21) and a cylinder body (18) cooperating with ...
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WO/2023/242883A1 |
Position detection unit (10) for a sheet (200) having a perimeter edge (212), comprising a slider (11) and a detection device (13) provided with a detection member (14).
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WO/2023/242471A1 |
A knife sharpener (1), comprising a first grinding drum (2), a second grinding drum (7) and a motor (13) arranged to rotationally drive either or both of the first grinding drum (2) and the second grinding drum (7). A first grinding port...
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WO/2023/241412A2 |
The invention relates to a polishing apparatus, a polishing method and a sealing system. The sealing and polishing apparatus comprises a thrust system; a plurality of sealing systems, wherein each sealing system comprises a piston and a ...
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WO/2023/241408A1 |
A surface finishing method for a micro internal flow channel, a micro internal flow channel workpiece, and a finishing medium. The bore of the micro internal flow channel is less than or equal to 3 mm, and the length-to-diameter ratio of...
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WO/2023/241413A1 |
A pressurizing container, comprising the following segments sequentially distributed from upstream to downstream: a first straight line segment (11) having a length-to-diameter ratio of greater than 5; a second arc segment (12) that is a...
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/244739A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more ac...
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WO/2023/242729A1 |
A finishing station (1) configured for carrying out chamfers and/or slots on a block (5) of friction material of a brake pad (2) including a robotized articulated arm (8) provided with a head (11) rotating around a first axis (A) and car...
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WO/2023/239393A1 |
Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an elect...
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WO/2023/239421A1 |
A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move ...
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WO/2023/239419A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and th...
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WO/2023/240260A1 |
A chemical mechanical polishing (CMP) slurry can comprise a plurality of particles distributed in a carrier, wherein at least a portion of the particles of the plurality of particles can have a body including a core comprising zirconia a...
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WO/2023/238452A1 |
[Problem] To provide a grinding system in which the main body of a glass plate can be firmly fixed and which, when the peripheral edges of the main body of the glass plate are ground by pressing the lateral surface (cylindrical portion) ...
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WO/2023/239420A1 |
A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a...
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WO/2023/234595A1 |
According to one embodiment of the present invention, provided are a magnesium alloy molded product and a method for manufacturing same, the method comprising: a first step of extruding a magnesium alloy billet into a pipe with a predete...
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WO/2023/233681A1 |
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of l...
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WO/2023/230846A1 |
A dovetail grinding fixture for a machine tool comprises a bottom plate and a workpiece, one end of the bottom plate is provided with a baffle, the other end of the bottom plate is provided with a second clamping piece, and three fixing ...
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WO/2023/234555A1 |
Transparent ceramic glass for a cooktop, according to one embodiment, may comprise: a glass material including an uneven layer etched on the upper surface thereof; an upper print layer formed on the upper part of the uneven layer; and a ...
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WO/2023/231063A1 |
A grinding device and grinding method for the periphery of an output shaft. The grinding device comprises at least one grinding unit; the grinding unit comprises a mandrel assembling and disassembling mechanism, a grinding mechanism, and...
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WO/2023/234389A1 |
The present invention addresses the problem of providing a wood-cutting cutter which is used for the cutting processing of a woody material and that can be easily reground. The wood-cutting cutter has a hardened layer provided on a sur...
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WO/2023/234998A1 |
Methods and systems for thinning a device wafer to tens of micron, micron, or sub-micron thicknesses are disclosed. Device wafers are thinned by using a two-step grinding process and a chemical mechanical polish (CMP) process. One or mor...
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WO/2023/233035A1 |
The invention relates to a profiled grinding tool (7) for rotatingly machining workpieces, in particular gearwheels and/or gears, comprising a main body, which has at least one device, in the form of a preferably hollow-cylindrical shape...
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WO/2023/234152A1 |
This superabrasive wheel comprises: a polishing surface which is disposed on the grinding surface of the superabrasive wheel and has a polishing layer including superabrasives; and a dressing surface which is disposed on the grinding sur...
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WO/2023/234974A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/231061A1 |
A fully automatic machining system for an output shaft and a machining method therefor. The machining system comprises a feeding and screening mechanism, a first conveying mechanism, a bushing press-fitting mechanism, a second conveying ...
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WO/2023/235582A1 |
A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier h...
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WO/2023/234663A1 |
According to one embodiment of the present invention, provided are a magnesium alloy molded product and a processing device therefor, the device comprising: a support unit that rotatably supports an object to be processed; at least one h...
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WO/2023/235681A1 |
The subject application relates to a thin wheel with glass reinforcing member, in particular, an abrasive article with an abrasive portion and a reinforcing member. The abrasive portion can include abrasive particles and a bond material....
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WO/2023/234186A1 |
Provided is a working machine including a satisfactory illuminating device. In a grinder 10, illuminating devices 80 are provided in both left and right side portions of a rear end portion of a gear housing 27, and are disposed above a...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/231266A1 |
A heating and ventilation metal pipeline repair device, which comprises a housing (1). Four first rotating grooves (2) are provided at the upper end of the housing (1). A first fixing block (3) is fixedly arranged on each of the first ro...
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WO/2023/231316A1 |
A super-finishing method for a cemented carbide coating of a surface of revolution, comprises the following steps: spraying an outer spherical surface of a surface of revolution part with a cemented carbide coating by means of a spraying...
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WO/2023/234973A1 |
A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relati...
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WO/2023/228579A1 |
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which m...
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WO/2023/229009A1 |
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate. One aspect of the present disclosure pe...
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WO/2023/229660A1 |
The invention relates to a brake disc arrangement (86) having a brake disc (12) that has a friction ring (14) and a brake disc pot having an opening concentric to a central brake disc axis, which opening is delimited by a boundary which ...
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WO/2023/228787A1 |
The present invention provides a method for producing a ground wafer, wherein a ground wafer is produced by grinding a starting material wafer that has a first main surface and a second main surface, the method comprising: a first resin ...
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WO/2023/229658A1 |
A carrier head for chemical mechanical polishing includes a housing, a substrate mounting surface, and a retaining ring assembly. The retaining ring assembly includes an inner ring surrounding the substrate mounting surface and having an...
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WO/2023/228434A1 |
[Problem] To provide a tip dresser that is capable of, when performing resistance welding, applying appropriate electric current and voltage to a welding spot. [Solution] The present invention comprises: a rod-like member 10 which has ...
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WO/2023/228591A1 |
The present invention pertains to a cylinder grinding machine that comprises: first and second detection means for detecting, in a non-contact manner, proximity between one end or the other end of a crystal rod and a spindle or a counter...
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WO/2023/227980A1 |
The method comprises the following phases: - supply of one petal to be regenerated (1) comprising: - one hole (2) defining an axis of rotation (R1) around which the petal to be regenerated (1) is movable between an opening position, wher...
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WO/2023/226697A1 |
A cleaning device, comprising: a cleaning assembly (1), a driving control assembly (2), a bottom plate (3), and a diagnosis feedback assembly (4). The cleaning assembly (1) and the driving control assembly (2) are both fixed on the botto...
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WO/2023/228483A1 |
Provided are a roll grinder abnormal vibration predicting method and a roll grinder abnormal vibration predicting device capable of predicting abnormal vibration of a roll grinder corresponding to a natural frequency of an entire mechani...
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WO/2023/229661A1 |
A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing sy...
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WO/2023/220770A1 |
The present invention provides a process of forming a cutting tool comprising the steps of: additive deposition of a tool material comprising at least one of: tungsten carbide, TaNbC, a tungsten carbide containing alloy or composite, or ...
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WO/2023/223142A1 |
A drive assembly for an adapter assembly of a surgical device includes an input shaft, a middle shaft, and an output shaft. The input shaft includes a proximal portion configured for operable engagement with a drive member of a handle as...
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