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JP2023178295A |
To provide a polishing apparatus for consumable part monitoring.A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with the polishing pad at the polishing station, a ...
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JP7394712B2 |
A cutting device is equipped with a spindle part, a control part, and a measuring device. The spindle part can adjust the height position, and the blade is installed therein. The measuring device is configured to measure the height posit...
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JP2023170074A |
To provide a vertical rotation type ELID processing device and the like which can properly perform dressing of a blade with an electrolyte even in a case where the rotational speed of the blade is fast.An ELID processing device comprises...
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JP7386636B2 |
One objective of the present invention is to provide a dress method capable of suppressing time required for a flat dress. The dress method includes: a position detection step (ST4) of photographing a dress board held on a holding table ...
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JP2023167965A |
To provide an improved device capable of shortening a time for stopping polishing operation of a polishing device for exchanging polishing pads and of improving productivity of the polishing device.A processing system includes: a polishi...
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JP7385985B2 |
To provide a blade processing device that can stably and highly accurately perform cutting process even for a work constituted of a brittle material in a ductile mode without generating a crack or breakage, and to provide a blade process...
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JP7380119B2 |
To provide a chatter evaluation system that evaluates amounts of chatter of a surface of a work-piece with good accuracy, in an in-process of grinding.A chatter evaluation system 1 comprises: an axial directional movement calculation dev...
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JP7380107B2 |
To provide a quality prediction system that is superb in versatility.A quality prediction system 1 includes a model production unit 73 that regards as an explanatory variable a feature quantity of condition data detected by a first detec...
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JP7378944B2 |
To provide a grinding device capable of measuring accurately a dress amount of a grinding wheel.A grinding device 1 includes a whetstone spindle 22 provided with a grinding wheel 21 on a lower end, for rotating the grinding wheel 21 by d...
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JP7378890B2 |
The purpose of the present invention is to provide a dressing board, which is capable of restraining generation of a processing defect. The dressing board for dressing of a cutting blade by enabling a cutting blade cutting a workpiece to...
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JP2023164098A |
To provide a dressing device configured so that flatness of a polishing pad can be improved and cut amounts of the polishing pad can be made uniform during dressing.A dressing device 1 is provided with a dresser 3 that performs dressing ...
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JP2023162110A |
To provide a surface quality measurement system which can accurately measure the surface quality of a polishing pad without damaging the polishing pad and reducing the throughput of the entire polishing processing.A surface quality measu...
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JP7374542B1 |
An electrolytic dressing device and an electrolytic dressing method suitable for cylindrical grinding of steel rolls are provided. A grinding wheel used for cylindrical grinding of a steel roll for rolling, an electrode facing the grindi...
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JP7374793B2 |
To provide a dressing board and a dressing method which enable a cutting device that cuts a work-piece under a dry-type environment to execute wet-type dressing, while maintaining the dry-type environment.A dressing method, which is perf...
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JP7374126B2 |
Described are abrasive surfaces and pad conditioners that contain high precision shaped surfaces, including pad conditioners useful for conditioning a chemical-mechanical processing (CMP) pad, and related methods.
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JP2023160532A |
To provide a cleaning tool that can efficiently and reliably clean a polishing pad which is fitted to a polishing device for a CMP, in which at least one of the groove and hole is formed and to which a residue such as a slurry aggregate ...
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JP2023160318A |
To provide a dressing tool which dispenses with an adhesive tape, and causes less adhesion of cutting chips.A dressing tool includes a support substrate containing a thermoplastic resin layer, and a dressing member which is supported on ...
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JP2023159885A |
To provide a conditioner capable of restoring a polishing pad with reduced polishing performance to be reusable.The invention includes a conditioner and a method of controlling the same. In particular, according to one embodiment of the ...
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JP2023158692A |
To provide a grinding method for a workpiece, the grinding method enabling reduction of consumption amount of a grinding stone.A grinding method for a workpiece is provided, for grinding a workpiece by using a grinding device. The grindi...
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JP7370584B2 |
To enable a dress timing to be set during grinding processing.In a grinding machine 11, a state of a grinding surface 19a of a rotary grindstone 19 is photographed with a camera 38 during grinding processing by the rotary grindstone 19. ...
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JP7368492B2 |
A pad conditioner and chemical mechanical planarization (CMP) pad conditioner assembly for a CMP assembly are disclosed. The pad conditioner includes a substrate having a first surface and a second surface opposite the first surface. A p...
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JP7368204B2 |
To make it possible to simultaneously perform a dressing process for two different kinds of blades.A dress unit 70 is prepared such that to a surface of a tape 76 stuck to cover an opening of an annular frame 78, a first dress board 71 f...
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JP2023155541A |
To provide a cutting device which is configured to cut a cut object and enables automatic exchange of a dress board, and to provide a manufacturing method of a cut product.A cutting device includes a cutting table, a cutting mechanism, a...
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JP2023155151A |
To provide a substrate treatment system capable of supplying a treatment liquid including highly concentrated microbubbles to a substrate to be treated without generating large bubbles on the way to a supply line of the treatment liquid....
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JP7364430B2 |
To measure a dress grindstone height of a dresser board and shorten a dress time.A height of a top face 61a of a dress grindstone 61 is measured by performing the following processes: a holding process in which a dresser board 6 is held ...
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JP2023153782A |
To provide: abrasive surfaces and pad conditioners that contain high-precision shaped surfaces, including pad conditioners useful for conditioning a chemical-mechanical processing (CMP) pad; and related methods.A pad conditioner useful f...
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JP2023148227A |
To provide a polishing method that can suppress polishing liquid such as slurry from influencing accuracy in measuring a film thickness of a work-piece, so as to enable the film-thickness to be measured accurately.In a polishing method, ...
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JP2023148880A |
To suppress a grinding stone that constitutes a ground region from vibrating during grinding of a work-piece.A correction method, which corrects shapes of an inner peripheral surface side and an outer peripheral surface side of a plurali...
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JP2023542458A |
A chemical mechanical polishing system includes a platen supporting a polishing pad, a carrier head, a motor generating relative motion between the platen and the carrier head, a vessel having a water inlet and one or more steam outlets,...
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JP2023141940A |
To provide a coupling device for easily attaching and detaching a rotating body to and from a rotating shaft.A coupling device 40 is used to couple a rotating body 7 to a rotating shaft 23. The coupling device 40 comprises: a flange 45 w...
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JP2023142654A |
To provide a workpiece cutting method capable of suppressing the occurrence of machining defects.A workpiece cutting method of cutting a workpiece with a cutting blade includes: a dividing line selection step of selecting a specific divi...
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JP7356996B2 |
A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a cons...
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JP2023134918A |
To provide polishing method capable of stabilizing a polishing process of a substrate.In this polishing method, once a substrate W has been polished, a fine bubble liquid is supplied onto a polishing pad 1.SELECTED DRAWING: Figure 6
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JP7351611B2 |
To prevent, in a beveling device, a decrease in productivity resulting from, for example, correction of a projecting shape of a truing grind stone.A wafer beveling device comprises: means 6 that brings a recess 63a in an external surface...
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JP7349975B2 |
To provide a CMP polishing device which has high detection accuracy of wear of a polished surface while validating a polishing effect of an object to be polished.In a CMP polishing device, a polishing pad 15 has a polished surface 15a co...
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JP7345867B2 |
To highly accurately determine a state of an abrasive plane for a short time.An abrasive plane determination device determines a state of an abrasive plane in a grindstone having such a structure that a plurality of abrasive grains is fa...
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JP2023128351A |
To flatness a protective member by grinding, and prevent adhesion of a bond material of a dressing board to a grindstone and a wafer.A processing method of a protective member and a grindstone bonded to a front side of a wafer, includes:...
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JP7338924B1 |
An object of the present invention is to realize a diamond dresser that is low in cost and excellent in wear resistance. [Solution] A diamond dresser 11 for forming a grinding wheel, comprising a square prismatic single crystal diamond 1...
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JP7337449B2 |
To use instead of a dummy wafer, a dressing plate that allows information on thickness to be obtained easily when an unused cutting blade is dressed.When a cutting blade fixed with abrasive grains via a bond is dressed, a dressing plate ...
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JP7336501B2 |
Provided is a composite dresser. The composite dresser includes a dressing surface; wherein the dressing surface comprises one first dressing area and one second dressing area. The material of the first dressing area comprises: copper me...
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JP2023121221A |
To provide a dressing tool capable of suppressing adhesion of copper to a polishing whetstone.A dressing tool used for dressing of a polishing whetstone includes: a base; and a dressing portion containing multiple abrasive grains scatter...
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JP7335097B2 |
To prevent grinding dust from adhering to a space between a dressing grindstone and an annular member.In a first dresser board 6 which comprises a disc base 60, an annular member 61 having a toric measurement region 610 and a toric outer...
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JP7334225B2 |
A chemical mechanical polishing pad conditioner includes a bottom substrate, an intermediate substrate and a diamond film. The intermediate substrate is arranged on the bottom substrate; the intermediate substrate includes a hollow porti...
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JP7331258B2 |
The present invention discloses a planogrinder including a measuring device, wherein the measuring device can move along the X-axis direction, an optical probe is provided at one end of the measuring device close to a bed base, and the o...
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JP2023116523A |
To provide a disclosure relating to monitoring the cut rate through a polishing pad by a pad conditioner in chemical mechanical polishing.An apparatus for chemical mechanical polishing is provided, including: a platen having a surface to...
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JP7324889B2 |
To keeping uniform quality and maintain high productivity by making the shape accuracy of a processed wafer end surface fall within a prescribed range even if processing conditions of respective wafer chamfering machines are different.A ...
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JP7317279B2 |
To provide a method of reproducing a grinding face of rubber grinding stone or else which applies erosion action (cavitation peening) of fine air bubble, and to provide a grinding technique which gives excellent results of grinding for i...
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JP7317441B2 |
To provide a chamfering device that can prevent a work-piece from being damaged and polluted by dust and the like generated during truing.A chamfering device 2, which chamfers an outer periphery part of a disk-like work-piece 11 having a...
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JP7317440B2 |
A dressing tool for dressing an annular array of grinding tones disposed on a surface of a grinding wheel includes a dressing board for dressing the grinding stones and a support plate supporting a reverse side of the dressing board. The...
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JP2023532465A |
The pad conditioner head cleaning tool includes a first clamp configured to removably engage a first portion of the sponge at a first position against an outer surface of the disc-shaped pad conditioner head; a second clamp configured to...
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