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WO/1999/026763A2 |
A polishing apparatus has two parallel processing lines that enables to carry out efficient parallel processing by minimizing the idle time for the turntable and maximizing the through-put. The polishing apparatus comprises at least two ...
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WO/1999/024218A1 |
Method of manufacturing a memory disk or a semiconductor device using a polishing apparatus (100) having a substrate and a fixed abrasive pad (6), the fixed abrasive pad (6) having a three-dimensional fixed abrasive polishing layer havin...
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WO/1999/019113A1 |
A centerless grinder includes a grinding wheel (17) pivotable through an angle on a carriage (12) which itself has movement about mutually perpendicular axes in the plane of the machine bed. An upper clamp roller (34) is provided to reta...
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WO/1999/012705A1 |
An optically reactive grindstone (1) is irradiated with light from a light irradiation device (2) opposed to the grinding stone (1), undergoes a chemical reaction to change its properties, and is dissolved in a solvent (4) and removed. A...
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WO/1999/011427A1 |
A chemical mechanical polishing system comprising a moving polishing pad and an ultrasonic conditioning head. The head is positioned in close facing relationship to the pad surface and agitates a liquid on the rotating pad surface at an ...
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WO/1999/011433A1 |
The invention relates to a device for cleaning a polishing pad, such as a polishing cloth for polishing wafers. The inventive device is characterised in that it has a distributor (20) for delivering a gas-water mixture at a high pressure...
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WO/1999/011431A1 |
The invention relates to a device and a method for treating a polishing pad, especially a polishing cloth for polishing wafers. The inventive device has a treatment disk which is mounted on a carrying device. Said treatment disk has a ba...
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WO/1999/008837A1 |
The present invention relates to an abrasive means for grinding samples during supply of a liquid lubricant and comprising a binding agent layer having grains of a grinding agent and a soluble material incorporated therein, and where the...
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WO/1999/003639A1 |
A conditioning ring (200) having cutting elements (205) brazed-bonded to the bottom surface (204) of the ring and suitably adopted for conditioning a workpiece polishing pad (126) by contact with the pad. The conditioning ring (200) furt...
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WO/1999/002309A1 |
A flat substrate polishing and polishing pad conditioning head for a chemical-mechanical-planarization apparatus is provided which has been shown to double the useable life of a polishing pad used to planarize and/or polish both oxide an...
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WO/1999/002305A1 |
In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above ...
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WO/1999/001254A1 |
An internal abrasive machine for inner surfaces of annular work pieces, and comprising a rotated driven spindle (16) carrying a tool (18), chucking equipment (14) for a work piece (15) to be machined, and feeding means (10, 11) for relat...
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WO/1999/001253A1 |
An external abrasive machine, in particular an external grinder for removal of material from the outer envelope surface of annular work pieces, and/or from flanges associated therewith, and particularly bearing race rings, and of the typ...
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WO/1998/057779A1 |
The invention relates to a method for cleaning abrasive disks, wherein blunt or loaded abrasive disks are blasted with a powder from a high-pressure cleaning device.
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WO/1998/055265A1 |
A combined cutting and grinding tool comprising columnar diamonds (22) arranged so as to protrude from the surface of the tool and conductive bonding member (24) for integrally bonding the columnar diamonds (22) to the surface of the too...
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WO/1998/055264A1 |
The chemical-mechanical polishing (CMP) of products in general and semiconductor wafers in particular is controlled by monitoring the acoustic emissions generated during CMP. A signal (54) is generated with the acoustic emissions which i...
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WO/1998/055262A1 |
The present invention relates generally to a method for conditioning polishing materials that are generally used to polish disks used for magnetic recording. The polishing material is conditioned by moving a conditioning ring relative to...
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WO/1998/045090A1 |
A polishing media magazine (350) for improved polishing. The polishing media magazine (350) may include a conditioning element (305) for rapid, uniform conditioning and cleaning of the polishing media (310). The polishing media magazine ...
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WO/1998/030360A1 |
An abrasive body for grinding optical glass, precious and natural stones (marble) or other materials such as wood, metal, plastics or the like, consists of a base body (3) made of a woven, knitted or embroidered fabric made of carbon fib...
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WO/1998/030357A1 |
An abrasive body (13) for a grinding disk (11), a grinding wheel or the like for grinding optical glass, precious and natural stones (marble) or the like has a base body (16) made of a sintered hard material upon which a diamond coating ...
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WO/1998/024591A1 |
This invention concerns a sharpening stone surrounded by a handle. The sharpening stone can be inserted into or slid out of the handle and arrested at any point between the end points by means of a locking device. Thus, the sharpening st...
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WO/1998/016347A1 |
A semiconductor substrate polishing pad dresser adapted to be brought into sliding contact with a surface to be polished of a semiconductor substrate polishing pad and thereby subject the polishing pad to a conditioning operation, the dr...
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WO/1998/014307A1 |
A superabrasive tool such as a superabrasive grinding wheel (101; 102), a superabrasive dresser (103; 104; 105), or a superabrasive lap plate (106) has a steel base (20) and a superabrasive layer (10) formed on the base (20). The superab...
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WO/1998/011600A1 |
A method for working a semiconductor wafer by which a highly accurate flat surface of a semiconductor wafer is formed with a high controllability by working a film formed on the uneven surface of a semiconductor wafer with a vertical wor...
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WO/1998/008651A1 |
A conditioning device having (200) cubic boron nitride cutting elements (205) brazed-bonded to the bottom surface of the device and suitably adopted for conditioning a workpiece polishing pad by moving across the pad while in contact wit...
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WO/1998/006540A1 |
The present invention provides for a method and apparatus for conditioning a polishing pad (202) in a semiconductor polishing arrangement (200) in which slurry (216) is directed under pressure at the polishing pad (202) and by means of a...
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WO/1998/002268A1 |
A precision grinding appartus includes a grinding worm (54) for precision grinding a case-hardened face gear (112). A shaper (18) is first placed in contact with a face gear (112), to thereby shape a surface of the face gear (112) into a...
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WO/1997/048525A1 |
A workpiece alignment and shifting system for moving circular workpieces from a first inspection station to a second machining station, comprises workpiece holding means for attachment to the face of a disc workpiece to move the latter f...
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WO/1997/048526A1 |
A grinding or polishing machine comprises a rigid platform on which a workhead spindle and a grinding wheel spindle are located. The grinding wheel spindle is mounted on a sub-assembly which is attached to the platform by means of flexur...
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WO/1997/048522A1 |
A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been...
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WO/1997/047432A1 |
A lapping machine comprises two concentric and coplanar annular lapping plates (1, 9) disposed adjacent to one another to present a flat, planar lapping surface and mounted for rotation about the common central axis of the plates. A driv...
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WO/1997/040525A1 |
An apparatus (100) for removing surface non-uniformities is provided. This apparatus has a stage (103) for holding a substrate (127) to be processed. This substrate often includes a film thereon, where the film has the non-uniformities. ...
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WO/1997/039856A1 |
A precision grinding apparatus includes a grinding worm (54) for precision grinding a case-hardened face gear (112). A shaper (18) is first placed into contact with a face gear (112), to thereby shape a surface of the face gear (112) int...
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WO/1997/038822A1 |
In a system for deburring a workpiece (8), such as a casting, using a robot (3) provided with gripping means (4) to grip the workpiece to be deburred, said system comprising at least one stationary, rotating deburring means (9, 9a, 11, 1...
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WO/1997/031756A1 |
A machine tool for combined working in which a series of combined working including grinding can be applied to a work by mounting the work once and in which dressing and truing of grindstone can properly be performed. The machine tool co...
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WO/1997/028925A1 |
A method and apparatus for planarizing photoresist and/or metal microstructure layers is provided. Planarization is achieved by removing material from a workpiece (64) by lapping using a diamond containing lapping slurry (58). A lapping ...
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WO/1997/022442A1 |
An apparatus and method for determining the roughness of a polishing pad (14) for endpoint detection during pad conditioning by the measurement of a force related to the surface friction. The apparatus includes a floating head (34) havin...
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WO/1997/020660A1 |
This invention relates to a flexible membrane polishing belt (60) against which a substrate, such as a semiconductor wafer (52), is polished using chemical mechanical polishing principles. A fluidized layer (74) is provided on a surface ...
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WO/1997/014530A1 |
The invention relates to a method of cooling and lubricating a metal-cutting rotating tool with a geometrically defined cutting element and/or the workpiece in the cutting zone. A coolant-lubricant and a carrier gas are fed separately in...
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WO/1997/011484A1 |
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abra...
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WO/1997/006922A1 |
A shape control method comprising the steps of applying a voltage between an electrically conductive grindstone (2) and an electrode (4) spaced from the grindstone (2) while allowing a conductive liquid (7) to flow between the grindstone...
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WO/1997/005988A1 |
A portable electric skate sharpener has a motor body (25) made to accept grinding, honing and conditioning heads (26) to fit various blade types and to perform various finishing operations upon the blade. The appropriate head is fitted t...
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WO/1996/040473A1 |
A vertically stacked planarization machine includes two or more vertically stacked individual platens on which wafers are polished. The wafers are held by wafer holders which may rotate the wafers. The individual platens are orbited in o...
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WO/1996/037327A1 |
The invention concerns a device which comprises a saw blade holder (24) and a grinding slide (30) supporting a profiled grinding wheel (38) and moving in reciprocating strokes relative to the saw blade holder (24). The device also compri...
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WO/1996/037328A1 |
The invention concerns a device which comprises a saw blade holder (24) and a grinding slide (30) supporting a profiled grinding wheel (38) and moving in reciprocating strokes relative to the saw blade holder (24). The device also compri...
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WO/1996/024839A2 |
A measurement of polyurethane pad characteristics is used to predict performance characteristics of polyurethane pads used for chemical mechanical planarization (CMP) of semiconductor wafers, and to adjust process parameters for manufact...
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WO/1996/018759A1 |
There is disclosed a method for edge rounding of cutting tool inserts of cemented carbide or titanium based carbonitride alloys. An electrolytic method is used with an electrolyte which provides an even removal of both binder phase and h...
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WO/1996/016749A1 |
An apparatus for cleaning a buffing pad (13) mounted on a rotary powered buffing machine is adapted to be adjustably mounted by a plurality of support legs within an open container (11) containing a liquid cleaning solution. The buffing ...
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WO/1996/013357A1 |
An internal diameter saw (12), and in particular a method for operation which facilitates the maintenance of quality control of semiconductor wafers sliced from an ingot (I) of source material. The internal diameter saw (12) has a contro...
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WO/1996/005940A1 |
The invention relates to a method and apparatus for dressing the grinding wheels of a dual head grinding machine. To this end a dual wheel head grinding machine is provided having first and second heads (10, 12) respectively carrying fir...
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