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JP7234317B2 |
To improve a transfer rate and the processability of truing, and to improve the accuracy of a groove formed at a truer.In a truing method for forming a groove of a grinding stone 55 for grinding a chamfer part of a wafer W by using a dis...
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JP7232763B2 |
A pad conditioner includes a carrier, at least one abrasive element, and a spacer. The carrier includes a surface with an exposed region and a plurality of mounting regions. The abrasive element is disposed on the mounting region of the ...
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JP2023025727A |
To reduce a time required for work of replacing a workpiece and a dressing board when dressing is performed on a grinding wheel.A dressing ring having a ring-shaped dressing member for dressing a processing stone is provided. Preferably,...
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JP2023025889A |
To provide a cutting blade shaping method capable of shaping the shape of a cutting blade easily at low cost.The cutting blade shaping method comprises: a shaping preparation step of configuring a state where a tip of a cutting blade 21 ...
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JP7226818B2 |
To provide a dressing tool truing method which can perform highly accurate truing for a dressing gear used for dressing a grinding tool which grinds a tooth surface of a gear as a product, and a dressing tool truing program for performin...
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JP7226286B2 |
The present invention provides a method of reworking a wire saw, which, in cutting a work by a wire saw using a fixed grain wire and resuming the cutting of the work, which has been stopped because of a disorder such as disconnection of ...
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JP7222635B2 |
To provide an ultrasonic washing nozzle, which allows ultrasonic vibration with large amplitude to be propagated to washing water.An ultrasonic water jet device 2, which is a device for jetting water to which ultrasonic vibration is prop...
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JP2023018319A |
To simplify input of information regarding dressing for an operator.A cutting device has: a chuck table for holding a dressing board; and a cutting unit which has a spindle and in which a cutting blade is attached to a tip of the spindle...
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JP2023017278A |
To enable a grinding stone causing blinding to be subjected to dressing, so that a hard wafer can be ground into a predetermined thickness.In a finish grinding step, areas of an annular area to be ground of an outer peripheral part of a ...
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JP7209344B2 |
Provided in the present invention is a dressing apparatus for a double-sided polisher capable of reducing the effect of a horizontal load with respect to a piston rod pressurizing a dressing member. To this end, a dressing apparatus (1),...
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JP2023007543A |
To provide a dressing plate capable of suppressing the change of a shape of a polishing cloth due to dressing.A dressing plate for dressing an upper platen side polishing cloth and/or a lower platen side a polishing cloth is sandwiched b...
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JP7206041B2 |
Provided is a cutting apparatus capable of suppressing the misrecognition of the type of a dressing board with a cut surface. The cutting apparatus (1) includes: a dressing board (90) including a two-dimensional code comprising a plurali...
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JP7202403B2 |
A truing device includes a housing and a truing mandrel (1) with a shaft (10) used to mount a circular tool having a concentric opening, in particular a grinding disc (3), and with a first bearing (11) fixed on the housing (4) and locate...
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JP2023000610A |
To suppress adhesion of a processed waste to an exposed holding surface.In a first grinding device 1 including a first chuck table 21 for sucking and holding a workpiece on a suction surface 610, and a grinding mechanism 3 for grinding t...
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JP7198801B2 |
The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic ex...
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JP2022187203A |
To provide a grinding device in which the frequency of replacement of dress grindstones is reduced.A grinding device 1 comprises: a table 30 that holds a work-piece on a holding surface; a grinding mechanism 5 that rotates an annular gri...
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JP7191153B2 |
A composite material can include: a substrate of a first reaction-bonded silicon carbide (first RB-SiC) material; and a reaction-bonded diamond-retaining silicon carbide (RB-DSiC) layer bonded to a surface of the substrate. In some aspec...
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JP7187119B2 |
To discriminate a variety of a dressing board.A grinding device includes a grinding unit to which a grinding wheel having a grinding abrasives wheel on an under surface is mounted and which is capable of grinding a workpiece with the gri...
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JP7184542B2 |
The present invention provides a chemical mechanical (CMP) polishing pad for polishing three dimensional semiconductor or memory substrates comprising a polishing layer of a polyurethane reaction product of a thermosetting reaction mixtu...
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JP2022178329A |
To suppress fluctuation of a locus of a grindstone on an outer peripheral side during rotation of a spindle.A shape correction method for a grindstone executes dressing and truing for a plurality of grindstones. This method comprises: a ...
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JP2022178739A |
To provide a grinding device, which can prevent a dress grindstone not corresponding to a type of a grinding grindstone from being used for dressing.It can be discriminated whether a dresser board held by a holding surface is a first dre...
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JP2022177625A |
To provide a dresser board which can simply perform a work for specifying a region on the surface of the dresser board served to dressing.A mark as a reference of a distance from a first side on a rectangular surface of a dresser board i...
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JP2022177587A |
To provide a technology that removes loose abrasive grains occurring on a surface of a ground surface due to dressing (grind stone correction) in which an outer peripheral surface of a grind stone is ground with a dresser.A grind stone c...
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JP7179984B2 |
A device for producing a curved lateral surface on a rolling element for a rolling bearing includes a grinding apparatus for grinding the curved lateral surface and a retaining apparatus having a control wheel with a convexly profiled pe...
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JP2022174532A |
To provide a dresser board which enables proper dressing of a cutting blade.A dresser board is used to correct a shape of a cutting blade and includes: a first layer including first abrasive grains and a first binder for fixing the first...
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JP2022548497A |
The present invention relates to a dressing tool comprising profiled elements (11.1, 11.2, 11.1, 11.2, 12.1, 12.2, 12.3, 12.4) and has working surfaces (13, 14) provided with hard material particles. The profiled elements (11.1, 11.2, 12...
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JP7172636B2 |
To provide a maintenance support device for machine tool which can acquire surface roughness with high accuracy even in the case where a measurement result by an in-machine measurement device is used and which supports maintenance of a t...
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JP2022547970A |
The present invention is a machine tool 1 for machining gears, comprising a work spindle 16 for rotating a work 18 around a work axis C1, and a tool spindle 11 for rotating a tool 12 around a tool axis B. Regarding machine tools. An axia...
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JP7169769B2 |
An object of the invention is to prevent cleaning liquid and sludge and the like from splashing onto the surroundings when cleaning and dressing a polishing member that polishes the rear surface of a substrate. A dressing device 200 inco...
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JP7167430B2 |
To obtain a screwed grinding wheel which suppresses a truing amount and has a high lifetime, and to provide a truing device and a truing method for a screwed grinding wheel capable of shortening working time in truing.In a truing device ...
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JP7168113B1 |
Kind Code: A1 A method for polishing both sides of a wafer is provided in which a polishing cloth is dressed by an approach other than a conventional dressing method, edge flatness is maintained, and a wafer with a high degree of flatnes...
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JP7166714B2 |
To provide a cutting blade that can suppress occurrence of poor processing.The cutting blade has a cutting blade part 5 including abrasive grain 13 and a bond material 11 that bonds the abrasive grain. On a surface of the bond material i...
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JP2022168720A |
To provide a processing method which can suppress formation of a level difference on a polishing surface of a polishing pad due to polishing of a surface to be polished of work-piece, so as to maintain a shape of the polishing pad which ...
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JP7160725B2 |
A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing a...
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JP7157990B1 |
Provided are an electrolytic dressing device and an electrolytic dressing method suitable for cylindrical grinding of steel rolls. Equipped with a conductive grinding wheel used for grinding a steel roll for rolling, an electrode facing ...
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JP7154690B2 |
The present invention provides a method for dressing grinding stone, which can reduce the number of sheets of dummy wafer used for dressing work and can efficiently dress grinding stone. The method for dressing grinding stone uses a grin...
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JP7152937B2 |
To make it possible for ground chips to be appropriately removed continuously from a grinding surface of a grinding stone while preventing deformation of the jetting port of a nozzle, when removing the ground chips by spraying a mixture ...
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JP7152279B2 |
A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and ...
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JP7150400B2 |
To provide a dressing method for a cutting blade, by which the cutting blade can appropriately be shaped.A dressing method for a cutting blade, in which dressing of the cutting blade is carried out using a dresser board having a first dr...
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JP2022147687A |
To provide a processing state estimation method and a processing state estimation system that can accurately estimate a processing state.A processing state estimation system 1 includes an observation device 20 and an estimation arithmeti...
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JP2022147691A |
To provide a processing state estimation method and a processing state estimation system that can accurately estimate a processing state of a workpiece.A processing state estimation system 1 includes an observation device 20 and an estim...
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JP2022148902A |
To facilitate a device configuration of a processing device having a blade exchange mechanism and reduce footprint.A processing device comprises: cutting tables 2A, 2B on which a sealed substrate W is processed by a cutting mechanism 4; ...
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JP7146206B2 |
To provide a method for polishing semiconductor wafers, capable of improving processing efficiency.In a method for polishing semiconductor wafers, a semiconductor wafer W is polished by being brought into sliding contact with a polishing...
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JP7146355B2 |
To provide a condition check method for a grinding wheel, whereby dressing state of a grinding stone can be checked.A condition check method for a grinding wheel comprises: a holding step in which a workpiece is held by a holding table o...
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JP2022145008A |
To enable obtaining of a grind stone for processing that can perform highly accurate processing.A grinding stone for processing 101 is disposed on a correction surface 110 of a grinding stone for correction 100 such that an axial line β...
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JP2022144190A |
To provide a grinding wheel modifying device and method capable of suppressing the occurrence of chatter shape on a circumferential face of a grinding wheel.A grinding wheel modifying device 10 includes a modification tool T which is sup...
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JP2022142022A |
To provide a grinding device, which dresses a grinding stone while suppressing work efficiency from deteriorating, in creep feed grinding.A grinding device, which applies creep feed grinding to a workpiece, comprises: a chuck table havin...
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JP2022139255A |
To provide a semiconductor device manufacturing method and manufacturing apparatus which can obtain a trimming shape stably and can process a high functional wafer of a semiconductor device at high yield.The semiconductor device manufact...
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JP2022136373A |
To provide a grinding method of workpiece which enables reduction of a probability that grinding marks are formed at workpiece even if creep-feed grinding is performed to the workpiece after dressing of grinding wheels.In a grinding meth...
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JP2022133198A |
To provide a polishing method which is a dry polishing method without use of slurry, but can prevent decrease in a polishing speed due to "glazing" or "clogging" without dressing, and enables improvement of processing efficiency and redu...
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