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JP7369777B2 |
Provided are: a resin composition for polarizer protection that has excellent adhesion to a polarizer and can prevent defects such as decoloration from an edge or whitening of a protective layer; and a polarizing plate comprising a prote...
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JP7365574B2 |
To provide a maleimide compound that expresses excellent adhesiveness to a chip, a substrate or the like, and a method of producing the same.The present invention relates to a maleimide compound represented by the formula (1) (where, R1 ...
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JP2023154881A |
To achieve a composition for forming low-dielectric-constant resin, which is suitable for use in the next-generation communication devices that are advancing toward higher frequencies, or radars and the like, and also possesses high work...
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JP7359215B2 |
A curable composition containing: a methylene malonate compound, and a Lewis acidic compound. The methylene malonate compound is preferably a compound represented by formula (1) or formula (2). In the formulae (1) and (2), X1 to X4 each ...
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JP2023145204A |
To provide a composition for forming a cured film that may use carbon dioxide as a starting material for the production; a cured film and a multilayer body; and a method for separating the multilayer body.The present invention provides a...
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JP2023136077A |
To provide a polyimide resin which can be easily taken up in a rolled form when formed into a film and has excellent ultraviolet curability and further to provide a curable resin composition comprising the polyimide resin.There is provid...
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JP7351297B2 |
A thermosetting resin composition for a semiconductor sealing material contains a polyimide compound obtained by copolymerizing at least a compound having two or more N-substituted maleimide groups and a compound having two or more amino...
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JP7344471B2 |
A resin composition that has excellent flux activity, flexibility and storage stability and that is suitable for a pre-applied underfill material is provided. The resin composition of the present invention contains a compound (A) having ...
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JP7343912B2 |
An object of the present invention is to provide a resin composition that can be manufactured consistently with reduced variability in properties and leads to improved productivity and that is suitable for use as a one-part adhesive used...
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JP7340151B2 |
An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays, in particular, an active energy ray including an h-line at a wavelength of 405 nm, without inhibitin...
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JP2023124226A |
To provide a rotaxane that can give a crosslinked polymer having excellent mechanical properties when used as a crosslinker and a method for producing the same, a crosslinked polymer including the rotaxane as a crosslinker, a polymer fin...
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JP7336078B2 |
An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embed...
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JP7333638B2 |
It is an object of the present invention to provide a curing agent composition capable of curing, without inconvenience, a base resin containing a 2-methylene-1,3-dicarbonyl compound, and a two-part mixing adhesive and the like containin...
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JP2023118665A |
To provide a method for efficiently producing an N-alkylmaleimide-based polymer.A method for producing an N-alkylmaleimide-based polymer includes suspension-polymerizing a monomer mixture composed of 20-100 wt.% of N-alkylmaleimide repre...
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JP2023116404A |
To provide a novel bismaleimide compound.The present invention provides a bismaleimide compound represented by the formula (1), where, A1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3) (w...
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JP2023116403A |
To provide a novel bismaleimide compound.The present invention provides a bismaleimide compound represented by the formula (1), where, A1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3) (w...
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JP7329513B2 |
This resin sheet is formed from a resin composition that contains a thermosetting component (A). The resin sheet is characterized in that the thermosetting component (A) contains a compound having a maleimide resin (A1) and a triazine sk...
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JP7325886B2 |
The present disclosure relates to an electrode binder composition for a rechargeable battery and an electrode mixture comprising the same. The electrode binder composition for a rechargeable battery of the present disclosure not only has...
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JP2023534712A |
(Meth)acrylate functional copolymers are useful as solid particulate dispersants in paints, inks and coatings. The copolymer has a (meth)acrylate functional group placed pendant to the polymer chain. Non-(meth)acrylate functional hydroph...
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JP7322894B2 |
Provided is a liquid crystal aligning agent with which a liquid crystal aligning agent that exhibits good applicability to a substrate can obtained, and with which a liquid crystal element that has a reduced amount of residual electric c...
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JP2023102267A |
To provide a laminated film having a low dielectric loss tangent, a low linear expansion coefficient, and an adhesion property with a metal layer, a flexible metal-clad laminate obtained using the laminated film, and a method for produci...
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JP7312532B2 |
To provide an epilamization agent which has increased resistance to cleaning, can be used for any type of material, and is simple to manufacture.A substrate includes a surface coated with an epilamization agent. The epilamization agent i...
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JP7311002B2 |
A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photos...
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JP7305110B2 |
An object of the present invention is to provide a resin composition and a resin sheet which have excellent photocurability for an active energy ray including an i-line with a wavelength of 365 nm in an exposure step, and can confer exce...
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JP2023097345A |
To provide a coating liquid that can suppress gelation without using a chlorine-based solvent, and when formed into a film, can be dried at a low temperature and yield a film of small amount of residual solvent.The present invention prov...
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JP2023529055A |
A cyanoacrylate composition is provided that includes at least one rubber reinforcing compound and at least one β-alkoxyalkyl cyanoacrylate. Rubber reinforcing compounds and β-alkoxyalkyl cyanoacrylates are well compatible with each ot...
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JP2023094103A |
To provide a method for producing a thermoplastic resin to which ion crosslinking is introduced without requiring a high temperature condition.A method for producing a thermoplastic resin includes a step of mixing a polymer (A) containin...
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JP7302760B2 |
An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline develo...
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JP2023093385A |
To provide a method for efficiently producing an N-alkylmaleimide-based polymer having excellent optical characteristics, heat resistance and mechanical strength.A method for producing an N-alkylmaleimide-based polymer includes suspensio...
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JP7298798B2 |
An object of the present invention is to provide a resin composition which does not inhibit photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of...
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JP7297127B2 |
The invention relates to a solid single-ion conductive polymer comprising a repeat unit of formula (Ia):wherein R1 is H, or C1 to C16 linear or branched alkyl, alkenyl, alkinyl;m is 1 to 5;each M+ is independently selected from Li+, Na+ ...
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JP7295546B2 |
To provide a resin composition which can be cured in a comparatively short time at low temperature that is approximately room temperature, prevents contamination in the periphery due to resin volatile, and is suitable as a one-liquid typ...
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JP7285486B2 |
Provided is a photoreactive composition which, even when used for producing a molded object that poorly transmits light, can be efficiently hardened to the deep portion thereof. The photoreactive composition comprises a vinyl monomer and...
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JP7283409B2 |
Provided is a bismaleimide compound having a favorable compatibility with other resins and contributing to a higher Tg. The compound is represented by the following formulawherein A independently represents a tetravalent organic group ha...
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JP7280830B2 |
Provided is an interlayer film for laminated glass having increased tanδ and excellent sound insulating property in an interlayer film having a low glass transition temperature. An interlayer film for laminated glass according to the pr...
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JP2023070657A |
To provide a salt and the like and a resist composition which allow a resist pattern having good line edge roughness to be produced.There are provided: a salt having a specific structure; and an acid generator, a resin, and a resist comp...
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JP7275121B2 |
A process for producing superabsorbents, comprising the steps of i) classifying the superabsorbent particles by means of one or more sieves and ii) removing metallic impurities by means of one or more magnetic separators, wherein classif...
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JP7274114B2 |
To provide a thermosetting resin composition that is halogen-free and prevents a decrease of heat resistance and a deterioration of dielectric properties and has flame retardancy, and is excellent in heat resistance, low thermal expansib...
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JP7256209B2 |
An automatic dishwashing composition is provided including a builder; a phosphonate; a nonionic surfactant; and a dispersant polymer, comprising: 10 to 65 wt % of structural units of formula Iwherein each R1 and R2 is independently selec...
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JP2023038989A |
To provide a novel resin composition having excellent transparency, toughness, and moldability.A resin composition is provided, including: a polycarbonate resin having an alicyclic skeleton; and an N-vinyllactam-based copolymer, and/or a...
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JP2023038915A |
To provide a photocurable coating agent that has high electric insulation property and low viscosity without the use of solvent in insulation coating such as a coil or the like.Provided is a photocurable coating agent that contains (A) c...
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JP7240587B2 |
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in ...
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JP7240586B2 |
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in ...
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JP7236794B1 |
Kind Code: A1 The present invention provides a maleimide compound, a curable resin composition, which exhibits excellent heat resistance and electrical properties and has good curability, and an amine compound as a raw material thereof. ...
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JP7236773B2 |
[Problem]To provide a photopolymerization initiator that has high compatibility with monomers used in combination, suppresses the problems of offensive odors and bleeding-out, and has high sensitivity to long-wavelength light.[Solution]A...
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JP2023026106A |
To provide a polymerizable compound that has excellent biocompatibility, high polymerizability and curability to heat and active energy rays, and has a phosphorylcholine group or analog group, and to provide a method for producing the sa...
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JP7219822B2 |
An active light sensitive or radiation sensitive resin composition which contains (A) an acid-decomposable resin, (B) a compound represented by general formula (bl), and (C) a compound represented by general formula (c1), wherein the rat...
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JP2023016520A |
To provide a polymer having excellent curability and also excellent thermostability, and an adhesive composition comprising the polymer, which can provide a cured product having resistance to coloration under a use environment.A polymer ...
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JP7215188B2 |
To provide a resin composition excellent in moldability, a cured product, a molding, a prepreg, a resin sheet, a metal foil-clad laminate, a printed wiring board, a semiconductor device, an encapsulant, a fiber-reinforced composite mater...
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JP7212301B2 |
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multila...
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