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JP2012233131A |
To provide a polyacetal resin composition containing polylactic acid excellent in flexural modulus, hydrolysis resistance, and surface smoothness, and a molding.The polyacetal resin composition includes: more than 50 mass% and at most 90...
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JP2012233120A |
To provide a resin composition having practically sufficient heat resistance, biodegradability, mechanical characteristics, and in particular, excellent toughness.In the polyoxymethylene resin composition consisting of a polyoxymethylene...
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JP5085061B2 |
The present invention provides a polyacetal resin composition having an excellent processability and stability, significantly suppressing the generation of formaldehyde from molded articles thereof, preventing exudation of components, an...
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JP2012219269A |
To provide a method of fabricating a container for a VOC or a compressed gas by extrusion blow molding by using a molding composition based on polyoxymethylene, by which uniform extrusion property and reduced hanging down of parison are ...
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JP5068741B2 |
The invention relates to compositions containing: a) polyoxymethylene; b) thermoplastic elastomer with active hydrogen atoms; c) polyoxymethylene, which contains active hydrogen atoms and which differs from constituent a); d) a reagent f...
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JP5067961B2 |
The present invention provides a polyacetal resin composition comprising (I) a polyacetal resin; and per 100 parts by weight thereof, (II) more than 5 parts by weight but less than 100 parts by weight of calcium carbonate, wherein the ca...
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JP5062843B2 |
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JP5063849B2 |
A binder B for inorganic powders comprises a mixture of b1 from 80 to 99.5% by weight of a polyoxymethlene homopolymer or copolymer B1 and b2 from 0.5 to 20% by weight of a polymer system B2 which is not miscible with B1 and comprises b2...
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JP5048020B2 |
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JP5049138B2 |
A conductive polyoxymethylene composition comprising a first polyoxymethylene component, a conductive filler, at least one boron oxyacid or salt thereof, and at least one first polyamide oligomer is disclosed. The first polyoxymethylene ...
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JP5050201B2 |
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JP5036016B2 |
To obtain a resin composition for sliding members that always manifests excellent friction wear properties even in the case that it is used in a high-temperature atmosphere and a sliding counter part material is made of a soft metal and ...
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JP5036973B2 |
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JP5035885B2 |
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JP5032212B2 |
A polyacetal resin composition which has improved friction-wear characteristics as compared with conventional polyacetal resin compositions and which is less restricted in counter sliding members and can conform to a wide range of fricti...
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JP5031196B2 |
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JP5031198B2 |
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JP5027663B2 |
Process for preparing shaped articles from a powder comprising high molecular weight polyacetal and, optionally, non-melt processable polymer. Sintering the powder under heat and pressure in a batch or continuous process forms the articles.
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JP5028758B2 |
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JP5031188B2 |
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JP5028793B2 |
To provide an oxymethylene copolymer being excellent in the color tone, giving few mold deposits, exhibiting an amount of formaldehyde generated upon molding and during actual use being remarkably reduced, while satisfying problems in vi...
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JP5025161B2 |
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JP5016308B2 |
Multiblock copolymers are described and contain the structural unit of formula I -A-O—R1—O—CO—(R2—CO—)m—X-D-X—(CO—R2)m—CO
—X— (I), where A is a radical derived from a homo- or copolyoxymethylene, R1 is an alk...
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JP5018697B2 |
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JP2012162589A |
To provide a polyoxymethylene resin composition which is excellent in conductivity and is also excellent in the balance of physical properties such as tensile strength, elongation, and impact strength.The polyoxymethylene resin compositi...
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JP5009954B2 |
To provide a polyacetal resin composition formable of a molded article which excels in the balance of mechanical properties typified by rigidity and toughness, and even after long-time exposure in a hydrothermal environment, retains the ...
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JP5015563B2 |
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JP5013497B2 |
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JP5004262B2 |
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JP5005159B2 |
It is a purpose of the present invention to provide a polyacetal resin composition that contains a glass inorganic filler, improves adhesiveness between the glass inorganic filler and the polyacetal resin, and attains excellent mechanica...
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JP5009336B2 |
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JP5008256B2 |
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JP2012153769A |
To provide an aqueous polyether resin dispersion excellent in water resistance of a dry film thereof as well as in dispersion stability.The aqueous polyether resin dispersion comprises a polyether resin (F) which is at least one resin se...
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JP5000340B2 |
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JP4999764B2 |
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JP5002156B2 |
A polyacetal resin composition comprises a polyacetal resin having a trioxane content of not more than 100 ppm (preferably not more than 50 ppm, and more preferably not more than 10 ppm) and at least one stabilizer selected from the grou...
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JP5001496B2 |
Polyoxymethylene with improved resistance to acids, comprising A from 84 to 99.79% by weight of at least one polyoxymethylene homo- or copolymer, B from 0.1 to 5% by weight of at least one polyalkylene glycol, C from 0.1 to 10% by weight...
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JP4994029B2 |
A molding composition exhibiting bleach resistance includes a polyoxymethylene matrix polymer, from about 0.5 to about 10 weight percent of a bleach stabilizer selected from alkali metal or alkaline earth element carbonates or phosphates...
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JP4994486B2 |
A molding composition exhibiting bleach resistance includes a polyoxymethylene matrix polymer, from about 0.5 to about 10 weight percent of a bleach stabilizer selected from alkali metal or alkaline earth element carbonates or phosphates...
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JP4990324B2 |
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JP2012140482A |
To provide a POM/CNT conductive resin composite material which is prepared by blending stably a sufficient amount of CNT without damaging excellent physical properties that POM has, and has a desired conductivity.The conductive resin com...
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JP4982947B2 |
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JP4982043B2 |
To suppress the occurrence of formaldehyde by improving stability of a polyacetal resin. The subject polyacetal resin composition is composed of the polyacetal resin and a hydrazide of a hetero atom-containing aliphatic carboxylic acid. ...
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JP4979856B2 |
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JP4980986B2 |
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JP4976705B2 |
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JP4979857B2 |
TO IMPROVE MORE THE MECHANICAL PROPERTIES OF POLYACETAL RESIN MATERIALS BLENDED WITH A GLASS INORGANIC FILLER. THAT IS, A POLYACETAL RESIN COMPOSITION, PREPARED BY ADDING (B) 3 TO 200 PARTS BY WEIGHT OF A GLASS INORGANIC FILLER AND (C) 0...
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JP4969720B2 |
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JP2012122057A |
To provide a high heat dissipation inorganic organic composite composition which has high thermal conductivity, high insulation, and easy to mold nature.The inorganic organic composite composition includes: thermoplastic resins of two or...
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JP4961679B2 |
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