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JP4343407B2 |
Thermoplastic resin composition comprises: (A) a polyacetal resin or thermoplastic aromatic polyester resin (100 parts by weight, (pbw)); (B) a graft copolymer containing olefin polymer as the main branch and vinyl component grafted ther...
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JP4340286B2 |
Thermoplastic molding compositions, comprising A) from 15 to 99.94% by weight of a polyoxymethylene homo- or copolymer B) from 0.05 to 10% by weight of a nonpolar polypropylene wax, C) from 0.01 to 5% by weight of at least one ester or a...
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JP2009215513A |
To provide a polylactic acid resin composition excellent in hydrolysis resistance and, in a more desirable embodiment, a polylactic acid resin composition also excellent in heat resistance, and a molding molded therefrom.The resin compos...
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JP2009191113A |
To provide a highly rigid and tough polyacetal resin composition and a resin slide member produced by molding the polyacetal resin composition, which has less limitation of a sliding counterpart material and can cope with a friction/abra...
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JP4317916B1 |
Provided is an injection molding composition which is high in thermal decomposability and is not easily deformed by debinding when the composition is heated and which can further give a satisfactory debound body in a short period even wh...
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JP4316321B2 |
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JP4316320B2 |
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JP2009167426A |
To provide a polyacetal molding material having very low polyacetal decomposition level, comparatively high heat stability and aging resistance, a low formaldehyde emission level, comparatively high strength and impact strength, high ten...
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JP4306262B2 |
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JP4306258B2 |
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JP4306199B2 |
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JP4302394B2 |
A stretched product comprising a polyoxymethylene copolymer and having high strength and high elastic modulas is provided. A polyoxymethylene copolymer having a melt index (190° C., load: 2160 g) of from 0.3 to 20 g/10 min and containin...
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JP4280972B2 |
Polyacetal molded articles are effectively stabilized against unwanted discoloration comprising by incorporating a synergistic combination of antioxidants selected from the group consisting of (i) Pentaerythritol tetrakis [3-(3,5-di-tert...
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JP4270787B2 |
A polyoxymethylene resin composition is provided which comprises a polyoxymethylene resin (A), a silicone compound-grafted polyolefinic resin (B-1) and a silicone compound (B-2), the amount of the silicone compound-grafted polyolefinic r...
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JP2009084359A |
To provide a thermosetting resin composition that has a very high curing rate and exhibits excellent thermal stability, a thermosetting resin molding material and a cured product thereof.The thermosetting resin composition comprises a no...
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JP2009084358A |
To provide a phenolic resin composition and phenolic resin molding material cured at high speed and having satisfactory thermal stability upon injection molding, and to provide its cured product.The phenolic resin composition contains a ...
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JP4255838B2 |
The invention provides chain extenders made from epoxy-functional (meth)acrylic monomers and styrenic and/or (meth)acrylic monomers. The invention further provides polymeric compositions made from the chain extenders and plastic articles...
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JP4251240B2 |
The present invention relates to synergistic mixtures of at least one 2,4-dimethyl-6-s-alkyl phenol and at least one selected sterically hindered phenol according to formula II (II) The variable "n" is 1, 2 or 4. X1 is tert-butyl. X2 is ...
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JP4248712B2 |
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JP4248741B2 |
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JP2009062532A |
To provide a thermoplastic poly (hydroxyalkanoic acid) composition modified by a polyoxymethylene polymer, and a thermally molded product prepared from the composition.A poly (hydroxyalkanoic acid) resin composition containing poly (hydr...
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JPWO2007032406A1 |
Resin compositions for sealing fillers that do not induce electrode corrosion of wiring circuit boards in continuous voltage application tests under high temperature and high humidity, have a low elastic modulus, and have good stability ...
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JPWO2007032081A1 |
The present application limits the amount of comonomer and thermal stability of the polyoxymethylene resin copolymer, and further steps into the method of feeding polyoxymethylene resin and carbon in the extrusion process to produce a ma...
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JP4239017B2 |
The invention relates to vibration-damping engineering plastics which can be used in a wide variety of fields such as electronic equipments, electronic materials, household appliances, automobile/other transport instruments, industrial m...
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JP2009046549A |
To provide a polyacetal resin composition which can obtain a molded article such as a film and a fiber having excellent productivity and the inherent rigidity of polyacetal without utilizing alloying.The polyacetal resin composition comp...
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JP4232503B2 |
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JP4232473B2 |
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JP4234683B2 |
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JP4232416B2 |
To provide a blow-molded article having excellent mechanical properties, heat-resistance, impact resistance, gas-barrierness and transparency and provide a method for the production of the article. The blow-molded article of a resin comp...
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JP4232466B2 |
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JP4226782B2 |
A process for the continuous preparation of a thermoplastic molding composition with narrow scatter of the melt flow index, which comprises mixing two or more chemically identical starting materials of different melt flow index in a pell...
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JP2009029863A |
To provide a thermoplastic resin composition which excels in thermal stability and reduces the amount of formaldehyde generated in molding and in product usage to thereby improve a work environment in molding and a product usage environm...
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JP4222555B2 |
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JP2009030005A |
To provide a slide member which uses a polyacetal resin having the good slide characteristics and mechanical characteristics given by finely-dispersing a fluorine-based resin into a polyacetal resin.The slide member is such one dispersin...
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JP4204876B2 |
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JP4200340B2 |
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JP4201388B2 |
A thermoplastic moulding composition (I) contains (A) a thermoplastic polymer and (B) an inorganic or organic pigment having a coating of an alkali metal salt of a fatty acid containing at least 12 C atoms.
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JP2008545871A |
Composition comprising high molecular weight polyacetal and ultrahigh molecular weight polyethylene having improved wear resistance, high melt viscosity, and good mechanical properties. Articles comprising the compositions are disclosed.
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JP4198164B2 |
PCT No. PCT/JP96/02440 Sec. 371 Date Feb. 12, 1998 Sec. 102(e) Date Feb. 12, 1998 PCT Filed Aug. 30, 1996 PCT Pub. No. WO97/09381 PCT Pub. Date Mar. 13, 1997A polyacetal resin molded article excellent in thermal aging resistance and surf...
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JP4197480B2 |
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JP4187265B2 |
The present invention relates to biodegradable biocompatible polyacetals, methods for their preparation, and methods for treating mammals by administration of biodegradable biocompatible polyacetals. A method for forming the biodegradabl...
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JP4183622B2 |
Disclosed is a polyxymethylene composite resin composition, including 40-99 parts by weight of a polyoxymethylene resin, and 1-60 parts by weight of a thermoplastic polyurethane resin containing 0.05-1 part by weight of an active isocyan...
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JP4180211B2 |
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JP2008266486A |
To provide a polyacetal resin composition for a sliding member which is easy to mold and has excellent friction/abrasion characteristics especially under low-speed high-load conditions and provide a sliding member formed from the composi...
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JP4176514B2 |
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JP4172274B2 |
A polyoxymethylene copolymer which is a polyoxymethylene copolymer obtained by copolymerizing trioxane and 8 to 20 mol, per 100 mol of the trioxane, of 1,3-dioxolane and which (i) has a crystallization time period of 10 to 2,000 seconds ...
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JP4172953B2 |
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JP4170397B2 |
An electrically conductive polyacetal composition having improved toughness and flexibility, as well as good fluidity and processability. The composition includes an oxymethylene polymer, an elastomeric polyurethane, and an electrically ...
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JP4167341B2 |
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JP2008239716A |
To provide a thermosetting resin composition having a very high curing rate, to provide a thermosetting resin molding material using the same, and to provide cured products thereof.The thermosetting resin composition comprises a novolac ...
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