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JP4643142B2 |
A curable hot melt adhesive is used as a primer on a book block. A conventional thermoplastic hot melt is then applied on top of the reactive hot melt before the cover material is positioned.
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JP4628534B2 |
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JP4618893B2 |
Water-swellable hot-melt adhesives based on a tackifying resin, a water-dispersible EVA wax, an ethylene/acrylic ester copolymer, a water-soluble homo- or co-polymer and a super absorber polymer powder having an average particle size of ...
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JP4615875B2 |
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JP4617287B2 |
Preparation of polymer dispersions stabilized by polyvinyl alcohol or protective colloid involves: polymerizing a composition comprising a base polymer and a polyvinyl alcohol or protective colloid by emulsion polymerization (where at le...
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JP4609788B2 |
Disclosed is an aqueous dispersion containing (A) an ethylene-alpha-olefin copolymer, (B) a modified ethylene-vinyl acetate copolymer, (C) a photopolymerization initiator and (D) an ethylenically unsaturated monomer, and if necessary (E)...
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JP4608759B2 |
To provide a pressure-sensitive adhesive sheet for semiconductor wafer processing which reduces imperfections and, at the same time, excels in resistance to chipping and prevents the scattering of chips on dicing in the semiconductor waf...
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JP4605521B2 |
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JP4602519B2 |
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JP4601794B2 |
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JP4601290B2 |
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JP4603781B2 |
A polymer consists of by wt. (a) vinyl acetate (0.5-30%); (b) a monomer with an acid or anhydride group (0.1-10%); (c) a monomer other than (A) or (B) with water solubility above 5 g/l at 21degreesC and 1 bar and a glass transition tempe...
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JP4601045B2 |
To provide a thermally adhesive label and a thermally adhesive label for a thermosensitive recording, which have a high adhesion to various materials to be adhered, in particular, to corrugated paper, are long in delayed time and is exce...
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JP4599536B2 |
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JP2010275456A |
To provide an information-hiding black adhesive which does not need any special device for use, can exhibit sufficient hiding performance even on characters printed on an art paper or the like or large characters, can be easily removed f...
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JP2010270285A |
To provide a thermosetting adhesive which can be stored at room temperature and contains an acrylic acid component.A thermosetting adhesive composition photopolymerizing a mixture of a photopolymerizable monomer including 38-98 wt.% 4-12...
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JP4592298B2 |
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JP2010265482A |
To provide a composition of a hot-melt processable adhesive such as a pressure-sensitive-adhesive (PSA) or a heat-activatable adhesive having a broad degree of formulation freedom and adequate cohesive strength after application for use ...
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JP4587343B2 |
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JP4581437B2 |
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JPWO2009022516A1 |
Provided are a method for producing an adhesive resin composition, a resin film, and a laminate. The method for producing an adhesive resin composition of the present invention is a saturated polyester resin having a melt index of 10 to ...
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JP2010253708A |
To provide an ultrahigh molecular weight polyetylene film/vitreous cloth laminate featuring not only superior slidability and wear resistance but also superb adhesive strength between a vitreous cloth and ultrahigh molecular weight polye...
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JP4578659B2 |
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JP4569043B2 |
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JP2010532809A |
Two-component or multicomponent system which cures by means of a redox initiator system and has a controllable pot life and comprises A) 0.8-69.94% by weight of an emulsion polymer which can be obtained by polymerization of a mixture; B)...
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JP2010532183A |
A body waste collecting device comprising a collecting pouch and an adhesive wafer for attachment to the body, said adhesive wafer comprising a backing layer and a first adhesive layer, said first adhesive layer comprising a liquid imper...
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JP2010532397A |
The present invention relates to a pressure sensitive, hot melt processable adhesive composition comprising a polar plasticising oil and a polar polyethylene copolymer, and a layered adhesive construct and a medical device comprising the...
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JP4554308B2 |
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JP2010209326A |
To provide an aqueous adhesive composition reducing the consumption of a resin emulsion/rubber latex, having excellent initial adhesive strength and normal-state adhesive strength, directly usable in a conventional coating step, and havi...
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JP4548993B2 |
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JP4544852B2 |
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JP4543365B2 |
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JP4540790B2 |
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JP2010530060A |
Adhesive compositions useful for bonding fluorescent material-containing cellulosic substrates such as envelopes may be formulated using an adhesive polymer such as an emulsion of polyvinyl acetate in water and one or more compounds capa...
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JP4536660B2 |
The invention provides a dicing and die bonding pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer that exhibits excellent embedding properties in die bonding and thereby can prevent formation of voids between d...
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JP2010528153A |
The present invention concerns adhesive compositions that provide corrosion-preventative properties and improved adhesive bonding on corrodible surfaces, such as may be found in electronic components. These compositions provide the subst...
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JP2010527397A |
The invention provides a polymer composition comprising (a) a copolymer comprising in polymerized form at least one vinyl ester (i) of a monocarboxylic acid having 2 to 4 carbon atoms and at least one vinyl ester (ii) of a monocarboxylic...
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JP4514851B2 |
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JP4507234B2 |
To provide a method for adhering an ethylene-vinyl acetate copolymer resin molded product, by which a highly safe and good hygienic environment can be obtained. This method for adhering the ethylene-vinyl acetate copolymer resin molded p...
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JP2010523769A |
Low application temperature hot melt packaging adhesives comprising a vegetable derived wax such as a soy wax are described.
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JP4502628B2 |
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JPWO2008114711A1 |
To mount a solder ball on a printed circuit board. However, in a fine solder ball having a particle size of 0.2 mm or less, the weight of the solder ball is light, so that when static electricity is generated, air is generated. The neces...
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JP4491665B2 |
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JP4490574B2 |
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JP4488561B2 |
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JP2010129751A |
To provide an adhesive composite for a wiring board, which is free of a fall of powder and has superior adhesive strength and high rigidity, and to provide: an adhesive film for the wiring board using the adhesive composite for the wirin...
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JP2010126555A |
To provide an adhesive composition that is an aqueous polymer-isocyanate-based adhesive composition and has excellent initial adhesiveness, normal state strength, boiling water resistance and pot life at the same time.The adhesive compos...
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JP4477767B2 |
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JP2010121016A |
To provide a protection film for coated plates, wherein the protection films hardly adhere to each other, or the protection film protruded from the coated plate hardly adheres to the back side of the adjacent coated plate, even when the ...
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JP4467222B2 |
To provide a solar battery which has a superior appearance by preventing a colored EVA from creeping in a light reception face side of a solar battery cell in a sealing process, and has an improved power-generation efficiency by enhancin...
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