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Matches 751 - 800 out of 2,566

Document Document Title
JP4647094B2  
JP4644770B2
A hot melt adhesive composition comprises 5-40 wt.% hydroxyl compounds with a hydroxyl number greater than 100 mg KOH/g and optionally above 40 wt.% polymeric component.  
JP4643142B2
A curable hot melt adhesive is used as a primer on a book block. A conventional thermoplastic hot melt is then applied on top of the reactive hot melt before the cover material is positioned.  
JP4628534B2  
JP4618893B2
Water-swellable hot-melt adhesives based on a tackifying resin, a water-dispersible EVA wax, an ethylene/acrylic ester copolymer, a water-soluble homo- or co-polymer and a super absorber polymer powder having an average particle size of ...  
JP4615875B2  
JP4617287B2
Preparation of polymer dispersions stabilized by polyvinyl alcohol or protective colloid involves: polymerizing a composition comprising a base polymer and a polyvinyl alcohol or protective colloid by emulsion polymerization (where at le...  
JP4609788B2
Disclosed is an aqueous dispersion containing (A) an ethylene-alpha-olefin copolymer, (B) a modified ethylene-vinyl acetate copolymer, (C) a photopolymerization initiator and (D) an ethylenically unsaturated monomer, and if necessary (E)...  
JP4608759B2
To provide a pressure-sensitive adhesive sheet for semiconductor wafer processing which reduces imperfections and, at the same time, excels in resistance to chipping and prevents the scattering of chips on dicing in the semiconductor waf...  
JP4605521B2  
JP4602519B2  
JP4601794B2  
JP4601290B2  
JP4603781B2
A polymer consists of by wt. (a) vinyl acetate (0.5-30%); (b) a monomer with an acid or anhydride group (0.1-10%); (c) a monomer other than (A) or (B) with water solubility above 5 g/l at 21degreesC and 1 bar and a glass transition tempe...  
JP4601045B2
To provide a thermally adhesive label and a thermally adhesive label for a thermosensitive recording, which have a high adhesion to various materials to be adhered, in particular, to corrugated paper, are long in delayed time and is exce...  
JP4599536B2  
JP2010275456A
To provide an information-hiding black adhesive which does not need any special device for use, can exhibit sufficient hiding performance even on characters printed on an art paper or the like or large characters, can be easily removed f...  
JP2010270285A
To provide a thermosetting adhesive which can be stored at room temperature and contains an acrylic acid component.A thermosetting adhesive composition photopolymerizing a mixture of a photopolymerizable monomer including 38-98 wt.% 4-12...  
JP4592298B2  
JP2010265482A
To provide a composition of a hot-melt processable adhesive such as a pressure-sensitive-adhesive (PSA) or a heat-activatable adhesive having a broad degree of formulation freedom and adequate cohesive strength after application for use ...  
JP4587343B2  
JP4581437B2  
JPWO2009022516A1
Provided are a method for producing an adhesive resin composition, a resin film, and a laminate. The method for producing an adhesive resin composition of the present invention is a saturated polyester resin having a melt index of 10 to ...  
JP2010253708A
To provide an ultrahigh molecular weight polyetylene film/vitreous cloth laminate featuring not only superior slidability and wear resistance but also superb adhesive strength between a vitreous cloth and ultrahigh molecular weight polye...  
JP4578659B2  
JP4569043B2  
JP2010532809A
Two-component or multicomponent system which cures by means of a redox initiator system and has a controllable pot life and comprises A) 0.8-69.94% by weight of an emulsion polymer which can be obtained by polymerization of a mixture; B)...  
JP2010532183A
A body waste collecting device comprising a collecting pouch and an adhesive wafer for attachment to the body, said adhesive wafer comprising a backing layer and a first adhesive layer, said first adhesive layer comprising a liquid imper...  
JP2010532397A
The present invention relates to a pressure sensitive, hot melt processable adhesive composition comprising a polar plasticising oil and a polar polyethylene copolymer, and a layered adhesive construct and a medical device comprising the...  
JP4554308B2  
JP2010209326A
To provide an aqueous adhesive composition reducing the consumption of a resin emulsion/rubber latex, having excellent initial adhesive strength and normal-state adhesive strength, directly usable in a conventional coating step, and havi...  
JP4548993B2  
JP4544852B2  
JP4543365B2  
JP4540790B2  
JP2010530060A
Adhesive compositions useful for bonding fluorescent material-containing cellulosic substrates such as envelopes may be formulated using an adhesive polymer such as an emulsion of polyvinyl acetate in water and one or more compounds capa...  
JP4536660B2
The invention provides a dicing and die bonding pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer that exhibits excellent embedding properties in die bonding and thereby can prevent formation of voids between d...  
JP2010528153A
The present invention concerns adhesive compositions that provide corrosion-preventative properties and improved adhesive bonding on corrodible surfaces, such as may be found in electronic components. These compositions provide the subst...  
JP2010527397A
The invention provides a polymer composition comprising (a) a copolymer comprising in polymerized form at least one vinyl ester (i) of a monocarboxylic acid having 2 to 4 carbon atoms and at least one vinyl ester (ii) of a monocarboxylic...  
JP4514851B2  
JP4507234B2
To provide a method for adhering an ethylene-vinyl acetate copolymer resin molded product, by which a highly safe and good hygienic environment can be obtained. This method for adhering the ethylene-vinyl acetate copolymer resin molded p...  
JP2010523769A
Low application temperature hot melt packaging adhesives comprising a vegetable derived wax such as a soy wax are described.  
JP4502628B2  
JPWO2008114711A1
To mount a solder ball on a printed circuit board. However, in a fine solder ball having a particle size of 0.2 mm or less, the weight of the solder ball is light, so that when static electricity is generated, air is generated. The neces...  
JP4491665B2  
JP4490574B2  
JP4488561B2  
JP2010129751A
To provide an adhesive composite for a wiring board, which is free of a fall of powder and has superior adhesive strength and high rigidity, and to provide: an adhesive film for the wiring board using the adhesive composite for the wirin...  
JP2010126555A
To provide an adhesive composition that is an aqueous polymer-isocyanate-based adhesive composition and has excellent initial adhesiveness, normal state strength, boiling water resistance and pot life at the same time.The adhesive compos...  
JP4477767B2  

Matches 751 - 800 out of 2,566