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JP6611424B2 |
Provided is a thermosetting adhesive composition capable of temporarily fixing a member easily, comprising: an acrylic rubber having a glass transition temperature of -50 to -30 °C; a liquid epoxy resin; a solid epoxy resin comprising a...
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JP6602016B2 |
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JP6603479B2 |
The objective of the present invention is to provide an adhesive film capable of reducing voids around a bonding wire, and resistant to being emptied out. The present invention also aims at providing a dicing tape-integrated adhesive fil...
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JP6598186B2 |
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JP6600745B2 |
The present invention relates to an inflation film and a method for manufacturing the inflation film, wherein the inflation film includes a base film, including: a polyamide-based resin; a copolymer containing polyamide-based segments an...
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JP6597280B2 |
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JP6589232B2 |
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JP6553066B2 |
The steel reinforcing element is coated with an adhesive layer coating at least a portion of the reinforcing element. The adhesive layer comprises an adhesive composition comprising: at least one unsaturated elastomer latex, and at least...
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JP6557424B2 |
The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-b...
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JP6547220B2 |
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JP6547408B2 |
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JP6547221B2 |
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JP6549902B2 |
The present invention provides a dicing die bond film which can prevent a separation defect of a cover film, and prevent electrostatic destruction of a semiconductor chip. The present invention relates to a dicing die bond film forming a...
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JP2019116619A |
To provide an adhesive composition for printed wiring board excellent in heat resistance.An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an...
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JP6547017B2 |
The present invention provides a tire innerliner film coated with a new rubber adhesive liquid containing a specific component in a specific admixing ratio, a pneumatic tire manufactured using the innerliner film, and a method of manufac...
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JP2019111696A |
To provide a rubber metal composite body which satisfies 90° peeling test, has a remaining rubber area ratio of 100% or approximately 100%, and prevents interfacial peeling.A rubber metal composite body has: (1) a silane coupling agent ...
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JP2019518623A |
The present invention relates to a method for producing a wet-bonded wood article, a wet-bonded article obtained by the method, and also relates to the use of a wet-bonded article. The method involves the following steps: a) Two actively...
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JP6536919B2 |
The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied...
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JP6537501B2 |
The present invention relates to a method for increasing the reactivity of lignin, wherein the method comprises the following steps:a) forming, under heating at a temperature of 71 - 94 °C, an aqueous dispersion comprising alkali and li...
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JP2019106492A |
To provide: a sealing film which imparts excellent followability for the difference in height resulting from the mounting of an electronic component that an electronic component-mounted substrate is to have, and which can retain the foll...
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JP6520418B2 |
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JP2019079971A |
To achieve a satisfactory bonding strength while increasing the productivity in a bonding step in electronic device manufacturing, and to suppress the deformation of a photosensitive adhesive resin composition.An electronic device manufa...
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JP6515193B2 |
Provided is an adhesive using bark, which is advantageous not only in that the proportion of the bark is increased so as to effectively utilize the bark, and the proportion of the phenolic resin is reduced to lower the adhesive solids co...
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JP6505120B2 |
The rubber composite comprises a steel reinforcing element coated with an adhesive layer coating at least a portion of the reinforcing element. The adhesive layer comprises an adhesive composition comprising at least one phenol/aldehyde ...
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JP6508442B1 |
1 to 5 parts by weight of silane coupling agent and 15 to 30 parts by weight of unvulcanized NBR are added per 100 parts by weight of high ortho-type novolak phenol resin having an ortho-type content of 65% or more calculated from the me...
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JP2019065258A |
To provide an aqueous adhesive composition excellent in adhesive strength and water resistance.The aqueous adhesive composition contains a polyamine (salt) (A), a resin (B), and water. The resin (B) is a resin containing formaldehyde and...
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JP6502578B2 |
The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermin...
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JP2019048981A |
To provide a surface protective film that has a high adhesive force (initial adhesive force) against a self-recovering prism sheet and the like, and can keep the high adhesive force even with the lapse of time; and a prism sheet with a s...
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JP2019508535A |
The present disclosure generally relates to an adhesive composition, an adhesive article containing an adhesive composition, a method for producing an adhesive composition and an article, and a method for using the adhesive composition a...
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JP6489118B2 |
A latex of a highly saturated nitrile rubber wherein the highly saturated nitrile rubber contains ±,²-ethylenically unsaturated nitrile monomer units in a ratio of 10 to 60 wt%, has an iodine value of 120 or less, and has a weight aver...
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JP6480937B2 |
A blank and/or diecut permanently closes of holes in metal sheets and/or in plastic parts. The blank and/or diecut comprises at least one carrier having a laminate of at least two polymeric films, wherein the lower film has a basis weigh...
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JP6476517B2 |
Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor dev...
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JPWO2017183722A1 |
Provided is an adhesive film for a multilayer printed wiring board, which is excellent in embedding of unevenness even when the silica filler is highly filled. Specifically, the adhesive film includes (A) a novolak type phenol resin havi...
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JPWO2017183721A1 |
(a) A novolak type phenol resin having a dispersion ratio (Mw / Mn) of a weight average molecular weight (Mw) and a number average molecular weight (Mn) of 1.05 to 1.8, and (b) represented by the general formula (1). It has a resin compo...
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JP2019026813A |
To provide a resin composition which is further excellent in gas barrier property, in particular, water vapor barrier property and oxygen barrier property, compared to a conventional resin composition.A resin composition contains an amin...
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JP6467843B2 |
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JP6470848B2 |
The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied...
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JP6468440B2 |
The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.
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JP6465339B2 |
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JPWO2017209242A1 |
An object to be solved by the present invention is to provide a resin bond wire saw having good machinability, less falling of abrasive grains, and suppressing the occurrence of scratches on the wafer surface that occur during cutting. T...
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JP6443521B2 |
To provide a film adhesive exhibiting satisfactory connection reliability even when a thinned semiconductor element is used and a dicing die bonding integrated type adhesive sheet.A film adhesive 10 used in a wire embedded type semicondu...
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JP6417711B2 |
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JP6420626B2 |
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JP6420526B2 |
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JP2018168313A |
To solve the problem that a conventional adhesive composition cannot cope with high density of a laminated flexible printed wiring board.An interlayer adhesive composition for laminated flexible printed wiring board contains an epoxy res...
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JP6414296B2 |
The adhesive sheet of the invention comprises a resin composition containing (A) a high-molecular-weight component, (B1) a thermosetting component having a softening point of below 50° C., (B2) a thermosetting component having a softeni...
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JP6402860B2 |
Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of R1 and R2 is independently a hydrogen atom, a C...
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JP6402448B2 |
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JP2018148124A |
To provide a sealing sheet which is superior in storage stability depending on thermal curing, and which allows an adhesive layer to be cured in a short time.A sealing sheet is a sealing sheet to be used for encapsulating a semiconductor...
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JP6384622B2 |
The purpose of the present invention is to provide: an adhesive which brings about excellent moldability and which, even after a long-term durability test, neither shows a decrease in interlaminar bonding strength nor causes an appearanc...
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