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JP2023517570A |
The present invention relates to a disulfide-containing benzoxazine monomer represented by (I) below, wherein R in formula (I) is represented by -XSSX'-. The present invention also relates to methods for synthesizing the disulfide-contai...
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JP2023048546A |
To provide a thermally conductive adhesive sheet which can form a cured sheet having excellent adhesiveness to an adherend when pressure bonded at low pressure and has excellent thermal conductivity of the cured sheet formed.There is pro...
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JP7248397B2 |
To prevent yellow discoloration of a chloroprene rubber adhesive with time or after a heat resistance test.The present invention relates to a chloroprene rubber adhesive composition, comprising a chloroprene rubber adhesive, containing a...
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JP2023014072A |
To provide a protective cover member to be arranged on a surface of an object having an opening in the surface so as to prevent foreign matters entering the opening, the protective cover member suppressing deformation by a high temperatu...
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JP7212591B2 |
Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an ...
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JP7212593B2 |
Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparti...
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JP7176536B2 |
Disclosed is an adhesive composition which comprises one or more thermosetting resins, a hardener, and an elastomer, wherein the thermosetting resins comprise an epoxy resin having an alicyclic ring. Also disclosed is a filmy adhesive ob...
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JP7172422B2 |
To provide an adhesive composition for wet friction material having excellent adhesive strength and excellent workability and coatability.An adhesive composition for wet friction material has a resol type phenol resin (excluding a resol ...
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JP2022167565A |
To provide a cyanate resin that gives a cured product having both of sufficiently low dielectric loss tangents and low dielectric constant properties, a resin composition including the resin, and a method for producing the cyanate resin....
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JP7154905B2 |
The present invention provides: a bus bar insulating film that is adhered through brief heating and exerts excellent adhesive power with respect to metal; and a bus bar equipped with such a film. More specifically, the present invention ...
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JP7146301B2 |
An insulating medium rubber film and a production method thereof, and a multi-layer printed-circuit board. The insulating medium rubber film includes a release film and an insulating medium layer arranged on the surface of the release fi...
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JP7138398B2 |
The present invention relates to an adhesive film for a multilayer printed-wiring board, in which a property of filling irregularities is excellent even when silica filler is highly filled. Specifically, there is provided an adhesive fil...
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JP2022133876A |
To provide an adhesive that suppresses the reaction between tannin and formaldehyde and stabilizes the curing reaction, and that improves water resistance, and to provide a method for producing the same.By using tannin as the main ingred...
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JP7132048B2 |
The present invention provides a hot-melt adhesive resin composition that adheres by heating in a short time, can exert a high adhesive force, and is easy to store. More particularly, the present invention relates to a hot-melt adhesive ...
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JP7120498B1 |
[PROBLEMS] To provide an adhesive composition excellent in heat resistance, adhesive strength, low relative permittivity and dielectric loss tangent, and excellent dielectric properties, and an adhesive sheet, laminate, and printed wirin...
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JP7120497B1 |
[PROBLEMS] To provide an adhesive composition excellent in heat resistance, adhesive strength, low relative permittivity and dielectric loss tangent, and excellent dielectric properties, and an adhesive sheet, laminate, and printed wirin...
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JP7115120B2 |
To provide a photosensitive adhesive composition that can be bonded at low temperature.A photosensitive adhesive composition for film formation has a polymer containing a cyclic olefin-derived structural unit in a molecule, a photosensit...
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JP2022102458A |
To provide a manufacturing method of a semiconductor device having excellent heat dissipation.A manufacturing method of a semiconductor device includes the steps of: preparing a dicing/die bonding integrated film 100 including a base mat...
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JP2022095302A |
To provide a dicing tape that suppresses the floating of a die-bonding film from an adhesive tape, ensures a sufficient kerf width, and exhibits good pick-up performance, in a manufacturing step of a semiconductor wafer at low temperatur...
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JP7088423B1 |
Adhesive composition containing an acid-modified polyolefin (a), a phenol resin (b) having a polycyclic structure, an epoxy resin (c), and further containing at least one of an inorganic filler (d) and a flame retardant (e). thing. Not o...
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JP7076049B1 |
To provide an adhesive composition for wood capable of exhibiting sufficient adhesive strength even at cold pressure or hot pressure at a low temperature in the production of wood-based materials such as plywood. A secondary reaction res...
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JP7072948B1 |
[Task] Provided is a method for producing a filler which is a material for an adhesive for plywood from the combustion ash without wasting the entire amount of woody biomass combustion ash. The woody biomass combustion ash (M) discharged...
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JP7064636B2 |
Disclosed is an adhesive sheet having an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the base is composed of a laminate having a laminated structure in which a resin film and a non-woven fabric, or a resin ...
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JP7061944B2 |
To provide a resin composition with a small influence of melting temperature on the solubility of a resin composition into a low-boiling solvent, with improved solubility in a wide range of melting temperatures, and with excellent produc...
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JP2022061962A |
To provide a resol type phenol resin capable of sufficiently suppressing a blowout phenomenon and maintaining productivity even when a high moisture content veneer such as the moisture content of 10% or larger is used, when manufacturing...
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JP7055474B2 |
The present invention relates to an adhesive film for a semiconductor, comprising: a first layer including a first adhesive binder and a heat-dissipating filler; and a second layer including a second adhesive binder and a magnetic filler...
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JP2022055073A |
To provide an adhesive composition for a rubber reinforcement fiber that is excellent in storage stability and contains a resol type resorcinol-formaldehyde resin.An adhesive composition for a rubber reinforcement fiber contains a resol ...
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JP7041505B2 |
To provide an adhesive film appropriate to prevent a crack from occurring, the crack caused by a heat stress in a formed adhesion layer, and also to provide an adhesive film having a dicing tape equipped with such an adhesive film.An adh...
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JP2022518843A |
Composite films for attachment to elastomeric substrates are provided. The composite film includes the following layers: an elastomer layer containing thermoplastic polyurethane, an ink layer, and a pressure sensitive adhesive layer cont...
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JP7028950B2 |
To provide a thermal adhesion tape or the like which promotes hardening of an adhesive layer when heated and prevents the adhesive layer from hardening when not heated during storage or the like.A thermal adhesion tape 1 bonds an adhered...
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JP7028951B2 |
To provide a thermal adhesion tape or the like which promotes hardening of an adhesive layer when heated and prevents the adhesive layer from hardening when not heated during storage or the like.A thermal adhesion tape 1 bonds an adhered...
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JP7026887B2 |
To provide a resin composition exhibiting excellent heat conductivity, a cured article, a monolayer resin sheet, a laminate resin sheet, a prepreg, a meal foil clad laminate, a printed wiring board, an encapsulation material, a fiber rei...
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JP2022029218A |
To provide a thermosetting adhesive film having high adhesive strength and excellent heat resistance and having excellent workability in the production of a grinding wheel, a method for producing a grinding wheel with the thermosetting a...
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JP2022010586A |
To provide a novel epoxy resin composition capable of giving an adhesive having good transparency and excellent adhesive characteristics and mechanical characteristics.The epoxy resin composition contains: an epoxy resin (A); an elastome...
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JP2022010830A |
To provide a chloroprene rubber-based adhesive composition that exhibits high thermal-time strength.A chloroprene rubber-based adhesive composition contains a phenolic resin chelated with a halide of a divalent metal.SELECTED DRAWING: None
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JP6983566B2 |
To provide an aramid fiber cord for rubber reinforcement excellent in adhesiveness between a fiber cord and a rubber at a high temperature (heat resistant adhesiveness).There is provided an aramid fiber cord for rubber reinforcement exce...
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JP2021190695A |
To provide a die-bonding film and a dicing die-bonding film which can comparatively prevent a void from remaining between wiring boards.A die-bonding film contains an acrylic resin, a phenolic resin and a filler, in which the filler has ...
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JP2021176952A |
To provide an adhesive composition for organic fiber cords that contains no resorcin and has thus reduced environmental load, and also has excellent adhesion, a method for producing the adhesive composition for organic fiber cords, and a...
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JP6960629B2 |
To provide a resin composition that achieves further improvement in gas barrier properties, particularly water vapor barrier properties and oxygen barrier properties, as compared to conventional resin compositions.A resin composition con...
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JP2021160159A |
To provide a decorative film which exhibits excellent adhesiveness to adherends including a polypropylene resin.This invention relates to a decorative film including a decorative layer and an adhesive layer, wherein the adhesive layer co...
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JP2021160160A |
To provide a decorative film which exhibits excellent adhesiveness to adherends including a polypropylene resin.This invention relates to a decorative film including a decorative layer and an adhesive layer, wherein the adhesive layer co...
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JP2021161200A |
To provide an adhesive composition for plywood having excellent curability and usability.An adhesive composition for plywood according to one embodiment contains a resol type phenol resin and a dibasic acid ester.SELECTED DRAWING: None
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JP2021160163A |
To provide a decorative film which exhibits excellent adhesiveness to adherends including a polypropylene resin, the decorative film having excellent blocking resistance in molds.This invention relates to a decorative film including a de...
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JP2021160162A |
To provide a decorative film which exhibits excellent adhesiveness to adherends including a polypropylene resin, the decorative film having excellent blocking resistance in molds.This invention relates to a decorative film including a de...
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JP6943601B2 |
An object of the present invention is to provide a substrate-free heat-melt adhesive tape or the like, which enhances the curing of an adhesion layer during heating and hardly cures the adhesion layer when not being heated such as during...
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JP2021143265A |
To provide an adhesive composition that has a low environmental impact and makes it possible to firmly bond rubber and an organic fiber.An adhesive composition contains a polyphenol and an aldehyde. Raw materials derived from renewable s...
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JP2021142849A |
To provide a pneumatic tire capable of achieving a high load bearing capacity and a reduced space in addition to a little load on the environment because an organic fiber cord is coated with an adhesive composition which contains no reso...
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JP2021142843A |
To provide a run-flat tire with excellent rolling resistance in addition to a little load on the environment because an organic fiber cord is coated with an adhesive composition which contains no resorcinol.A run-flat tire includes an or...
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JP6919777B1 |
To have high adhesiveness between a resin base material such as a liquid crystal polymer or syndiotactic polystyrene and a metal base material as well as a conventional polyimide or polyester film, and to obtain high solder heat resistan...
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JP2021109367A |
To provide a method for producing a metal or resin-rubber adhesion body using a novolak type phenol resin composition containing no curing agent, and a novolak type phenol resin composition used in the method for producing the metal or r...
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