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WO/2011/133414A2 |
The invention comprises an aqueous phenol-formaldehyde resole resin liquid fortified with powdered (e.g., spray dried) phenol-formaldehyde resole resin, preparing wood composites, particularly oriented strand board (OSB), waferboard, par...
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WO/2011/107365A1 |
Process for producing a lignocellulosic substance, in which, based in each case on the lignocellulosic substance: A) 30% to 95% by weight of lignocellulose particles; B) 1% to 25% by weight of expanded plastics particles having a bulk de...
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WO/2011/066385A2 |
The invention relates to polymeric latexes that can be used in adhesive compositions, which provide improved bonding of rubber articles to rubber reinforcing articles. The adhesive composition includes a single or a blend of polymeric la...
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WO/2011/055735A1 |
Disclosed is a layered rubber/metal product obtained by bonding an NBR to a metal with an adhesive which comprises a phenolic novolak resin, a resol resin, an NBR, white carbon, and a vinyltrialkoxysilane coupling agent in which each alk...
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WO/2011/043937A1 |
The invention relates to a new binder composition which is particularly suitable for the manufacture of composite materials utilizing such new binder composition in the required nonwoven materials. Composite materials using such new bind...
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WO/2011/042377A1 |
The invention relates to silylated melamine formaldehyde resins, a method for the production thereof, the use thereof, and coating compounds containing such resins.
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WO/2011/039948A1 |
An adhesive resin composition for silicon wafers which, when in a cured state, exhibits excellent adhesiveness to silicon wafers, characterized by comprising an epoxy resin and a compound having a urea structure in such amounts that the ...
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WO/2011/034303A2 |
The present invention relates to a melamine/formaldehyde (MF) resin composition containing a condensed tannin, and to the use thereof. The resin composition of the present invention, in which 20 wt % or less of condensed tannin is blende...
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WO/2011/024917A1 |
Provided is a hot melt adhesive composition which uses thermoplastic polyurethane and which exhibits high adhesive strength even with respect to nylon cloth and even under low-temperature and short-duration adhesion conditions, and which...
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WO/2011/022668A1 |
Binder compositions for making fiberglass products and methods for making and using same are provided. The binder composition can include a phenol-aldehyde resin or a mixture of Maillard reactants and one or more modifiers selected from ...
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WO/2011/010716A1 |
Disclosed are a highly saturated nitrile rubber latex, which contains 30-55 wt% of an α,β-ethylenically unsaturated nitrile monomer unit and 3-20 wt% of an acid group-containing α,β-ethylenically unsaturated monomer unit, has an iodi...
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WO/2011/010495A1 |
Disclosed is an antiseptic composition for engineering wood production, which contains epoxyconazole and a thermosetting resin. Also disclosed is engineering wood which is obtained using the antiseptic composition. The antiseptic composi...
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WO/2011/004710A1 |
Disclosed is a heat-curable adhesive tape or sheet provided with a heat-curable adhesive layer, which has a good storage stability at room temperature and can exert an excellent adhesiveness and a high heat resistance after a high temper...
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WO/2011/004659A1 |
A film for a semiconductor comprises a support film, a second adhesive layer, a first adhesive layer, and a bonding layer stacked in this order. The film for a semiconductor allows a semiconductor wafer to be stacked on the bonding layer...
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WO/2010/145945A1 |
The invention relates to the use of a heat-activated adhesive tape for the adhesion of flexible circuit boards. The adhesive tape comprises an adhesive layer comprising at least a) one acrylnitrile butadiene copolymer, b) a novolak resin...
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WO/2010/130411A1 |
The invention relates to resin compositions that may be used as binder for a wide variety of bonded structures including cellulosic materials such as particle board and plywood, veneer sheets, and non-woven materials such as mineral wool...
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WO/2010/131973A1 |
The present invention relates to a heat crucible glue or coating for use in connection with refractory materials and ceramics. The glue or coating comprises 25 to 50 weight % silicon powder, 5 to 20 weight % SiC powder, 20 to 60 weight %...
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WO/2010/127422A1 |
BINDER EXTENDER FOR PRODUCING CHIPBOARDS AND WOOD FIBERBOARDS, whose main characteristic is the use of black liquor as binder extender in the production of boards made of cellulosic materials, notably those traditionally called chipboard...
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WO/2010/092831A1 |
Disclosed is a hydrogen energy storage system (30) which comprises a power generation unit for generating electrical power using hydrogen and an oxidant gas, and an electrolysis unit (electrical energy/hydrogen conversion device (11)) fo...
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WO/2010/074060A1 |
Provide are a thermosetting die-bonding film having both high adhesive force and a storage elastic modulus required for semiconductor device manufacturing, as well as a dicing/die-bonding film equipped with said thermosetting die-bonding...
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WO/2010/073583A1 |
Disclosed is an adhesive film characterized by containing: a thermosetting resin with a weight-average molecular weight of less than 1000; a film-forming resin; an oligomer compound having a weight-average molecular weight smaller than t...
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WO/2010/071532A1 |
Disclosed is an acetylenic phenol-aldehyde resin having at least one carbon-carbon triple bond. The resin is obtained by subjecting at least one phenolic compound (1), at least one acetylenic phenolic compound (2), having at least one ca...
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WO/2010/060826A1 |
This invention relates to alkaline resol phenol-aldehyde binder compositions and their use in the production of articles of bonded particulate material such as foundry moulds, foundry cores, or feeders.
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WO/2010/056213A1 |
The topic of the invention is an adhesive with the addition of liquid wood - that is liquefied lignocellulosic materials and/or wood, as a component of adhesives for the mass production of products made of bonded wood with a lower conten...
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WO/2010/055956A1 |
Disclosed is a colored laminate metal sheet for containers, wherein one or both surfaces of a metal sheet are covered with a lamination film that is obtained by forming a colored adhesive layer on a polyester resin film. The colored adh...
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WO/2010/054287A1 |
A powder primer composition particularly useful as a primer intended to be used in conjunction with an adhesive topcoat in rubber to metal bonding. And a method for bonding an elastomeric substrate to a metallic substrate comprising, app...
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WO/2010/028951A1 |
The invention relates to a method for gluing two plastic surfaces together. The adhesion is produced by a heat-activatable adhesive. Said invention is characterised in that an adhesive of said type, which is used as a heat-activatable ad...
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WO/2010/018202A1 |
The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements...
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WO/2009/139120A1 |
Provided is a two-sided adhesive tape which has an adhesive layer on both sides of a non-woven fabric including at least manila hemp having a thickness less than 18 μm and a tensile strength in the lengthwise direction of at least 4 N/1...
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WO/2009/136105A2 |
The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content of less than or equal to 0.1% by total weight of liqu...
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WO/2009/136106A2 |
The present invention relates to a sizing composition for mineral fibers, especially glass fibers or rock fibers, containing a liquid phenolic resin having a free formaldehyde content of less than or equal to 0.1% by total weight of liqu...
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WO/2009/130335A2 |
The invention relates to modified phenolic resins containing silicic acid ester units. The modified phenolic resins can be used, for example, as components of foundry binder systems. The invention also relates to a method for producing s...
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WO/2009/127343A1 |
The present invention relates to an adhesive formulation in the form of an aqueous dispersion having a solids content of from 10 to 40% by weight based on the adhesive formulation for the treatment of reinforcing inserts for producing re...
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WO/2009/104372A1 |
Disclosed is a resin composition which forms an adhesive layer between a polylactic acid resin base layer and a polyolefin resin base layer. The resin composition contains a modified polyolefin resin (A) and a terpene resin (B), and the ...
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WO/2009/096164A1 |
Disclosed is an adhesive composition containing an aqueous formaldehyde resin solution and a formaldehyde scavenger which is composed of a bisulfite salt coated with a higher fatty acid that is reactive with formaldehyde. The bisulfite s...
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WO/2009/080748A1 |
The invention relates to a method for producing wood products wherein (A) wood particles are glued with a liquid glue solution, said glue solution containing one or more binding agents according to the general formula and hemiacetals and...
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WO/2009/081988A1 |
Disclosed is a method for producing an adhesive composition for organic fiber cords, which is characterized in that a liquid mixture containing (A) resorcin and/or a resorcin-formaldehyde resin, (B) an initial condensation product of for...
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WO/2009/077571A1 |
The invention relates to a binder for producing materials based on wood chips and/or wood fibers. The aim of the invention is to design a binder which is used for producing and gluing materials based on wood chips and/or wood fibers, con...
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WO/2009/039381A1 |
A resorcinol-modified phenolic resin composition is formed by reacting a basic catalyst, formaldehyde, water and a benzene-ol to form an intermediate composition to which resorcinol is subsequently added to reduce the presence of free fo...
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WO/2009/005461A1 |
The invention relates to a hardener composition for use in an amino resin based adhesive system, comprising an aliphatic alpha hydroxy- mono-, or di-, carboxylic acid, and polyvinyl alcohol. It also relates to an adhesive system and a me...
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WO/2009/004261A2 |
The invention relates to a sizing composition for thermal and/or acoustic insulating products, based on mineral wool, namely glass or rock, and in the form of an aqueous emulsion comprising at least one product resulting from the oxidisi...
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WO/2008/149642A1 |
Disclosed is an (acrylic rubber)-metal complex comprising an iron-based metal treated with iron phosphate, and an adhesive layer and an acrylic rubber layer both laminated on the surface of the iron-based metal in this order, wherein the...
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WO/2008/114696A1 |
Disclosed is an adhesive composition for optical waveguides, which contains an epoxy resin (a), a curing agent (b) and a polymer compound (c). This adhesive composition for optical waveguides has both transparency and heat resistance, an...
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WO/2008/108119A1 |
Provided is a dicing/die bonding film which is controlled to have both excellent adhesiveness in dicing step and an excellent removal characteristic in a pickup step. A method for manufacturing such dicing/die bonding film is also provid...
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WO/2008/075609A1 |
Disclosed is an adhesive sheet for semiconductor production, which is used for bonding a semiconductor device to an object and subjecting the semiconductor device to wire bonding. This adhesive sheet for semiconductor production is chara...
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WO/2008/058911A1 |
The invention relates to a method and devices for even and separate application of a liquid multi-component adhesive system to the surface of wood materials and the use thereof for the gluing of wood materials. The invention further rela...
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WO/2008/059813A1 |
Disclosed is an aqueous thermosetting composition containing an amino resin (A) which is obtained by addition dehydration condensation of an amino compound (a), an aldehyde (b) and an alcohol (c), and a urethane resin (B) which is obtain...
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WO/2008/047700A1 |
Disclosed is a non-thermofusible granular phenol resin having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible granular phenol resin preferably has a chlorine c...
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WO/2008/043960A1 |
The present invention relates to a liquid phenolic resin intended to be incorporated into the constitution of a sizing composition for mineral fibres, which is mainly composed of phenol/formaldehyde and phenol/formaldehyde/amine condensa...
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WO/2008/045706A1 |
A thermosetting urea-formaldehyde (UF) resin composition containing a rheological-enhancing amount of a thickening agent, the use of the resin composition for formulating an adhesive binder for preparing fiber mats and the fiber mats mad...
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