| Document |
Document Title |
|
WO/2017/058103A1 |
An alloyed silver wire comprising or consisting of a wire core, the wire core itself consisting of: (a) palladium in an amount in the range of from 0.1 to 3 wt.-%, (b) gold in an amount in the range of from 0.1 to 3 wt.-%, (c) nickel in ...
|
|
WO/2017/058104A1 |
An alloyed silver wire comprising or consisting of a wire core, the wire core itself consisting of: (a) palladium in an amount in the range of from 3 to 6 wt.-%, (b) gold in an amount in the range of from 0.2 to 2 wt.-%, (c) nickel in an...
|
|
WO/2017/051798A1 |
This light-emitting module substrate has a circuit layer to which a light-emitting element is mounted, formed on one surface of an insulation layer. A metal layer comprising Al or an Al alloy and a heat sink are laminated, in order, on t...
|
|
WO/2017/051794A1 |
This light-emission module having a cooler is characterized by: having a circuit layer to which a light-emitting element is mounted, formed on one surface side of an insulation layer; a metal layer and a cooler being laminated, in order,...
|
|
WO/2017/038465A1 |
The present invention relates to a silver-coated copper powder, especially to a silver-coated copper powder having a dendrite shape, and provides a novel silver-coated copper powder which is able to have enhanced conductivity without bei...
|
|
WO/2017/026509A1 |
The present invention is an electrode material used as an electrode contact for a vacuum interrupter, the electrode material containing heat-resistant elements at a weight ratio of 1 or more with respect to Cr 1, the remainder being Cu a...
|
|
WO/2017/021818A2 |
The present invention relates to a sterling silver alloy, copper -free in its basic embodiment, age-hardenable, with improved resistance to tarnishing, thanks to the presence of palladium in combination with zinc and indium, this alloy b...
|
|
WO/2017/022799A1 |
The present invention provides a method for homogenizing a Ru-containing Cu alloy, the method being capable of improving the solubility of Ru in the Ru-containing Cu alloy and accurately measuring the noble metal content in the Cu alloy....
|
|
WO/2017/018310A1 |
This Ag alloy film contains: 0.1 to 5.0 at% of Ti; at least one element selected from Cu, Sn, Mg, In, Sb, Al, Zn, Ge, and Ga in a total amount of at least 0.1 at% such that the combined total amount with the Ti is within a range that is ...
|
|
WO/2017/011150A1 |
The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, in...
|
|
WO/2017/002851A1 |
The purpose of the present invention is to provide a sintered alloy having high mechanical strength (particularly high toughness suitable for a sputtering target material) and a sputtering target material which includes the sintered allo...
|
|
WO/2016/208552A1 |
The present invention is a platinum alloy sputtering target which is constituted of a Pt-Hf alloy, the Pt-Hf alloy having an Hf content of 10-90 mass%. In the present invention, electrical properties were improved by adding Hf from the s...
|
|
WO/2016/208091A1 |
Because high quality alloys are preferred in jewelry items made of a Pt alloy, alloys containing 95 mass% of Pt (Pt950) are required, but Pt950 alloys exhibit low hardness, and therefore suffer from problems such as being easily damaged ...
|
|
WO/2016/208517A1 |
The purpose of the present invention is to provide a method for manufacturing a molded material that can form metallic glass material in a state of lower viscosity, and can manufacture a small structure of several 10 µm or less in a com...
|
|
WO/2016/194451A1 |
Provided is an Au-based soldering alloy which has high bonding reliability even when having a lower Au content than conventional ones. The present invention is an Au-based soldering ball which is to be used for sealing or bonding ceramic...
|
|
WO/2016/195032A1 |
Provided are: a metal microparticle aggregate in which selectivity of absorbed wavelengths of light is controlled, the metal microparticle aggregate having characteristics adequate for an insolation-shielding material for shielding a wid...
|
|
WO/2016/180359A1 |
A strong-permanent-magnetic nano-porous Fe-Pt alloy and a method for preparing same. The composition of the alloy is FewCoxPtyPdz. During preparation, electric-arc smelting or induction smelting is used to prepare a master alloy ingot; s...
|
|
WO/2016/170906A1 |
The present invention provides a high-temperature Pb-free Au-Sn-Ag based solder paste that is superior in oxidation resistance and wettability, has a suitable melting point as a solder alloy for high temperature, is very low cost since t...
|
|
WO/2016/155879A2 |
The invention relates to a noble metal alloy containing palladium and rhodium, in particular for making pieces of jewelry such as necklaces, bracelets, rings, gems, ornaments and the like, watches and watch cases and/or writing instrumen...
|
|
WO/2016/159315A1 |
This alloy material has a composition of 20-30wt% of silver (Ag), 35-55 wt% vanadium (Pd), and 20-40wt% copper (Cu) in a compositional range for a ternary alloy of Ag, Pd, and Cu, uses said composition as a base, and has added to said ba...
|
|
WO/2016/158693A1 |
A metal nanoparticle dispersion solution for solder paste, containing a reducible dispersion medium and metal nanoparticles comprising an alloy, wherein the average particle size of the metal nanoparticles is 1.0-200 nm, the sintering st...
|
|
WO/2016/151228A1 |
The present invention relates to a single-phase alloy formed, as weight percentages, of N% of gold, M% of tungsten, with N+M=100, M ≥ 8 and N ≥ 60 and also to a process for preparing such an alloy. It also relates to the use of such ...
|
|
WO/2016/151839A1 |
The purpose of the present invention is to provide a silver alloy and a silver alloy accessory which are endowed with both scratch resistance and sulfidation resistance and therefore do not readily discolor, so that the appearance of the...
|
|
WO/2016/146493A1 |
A method for producing an object (3) by means of layered compacting of a powdered starting material (11) by electromagnetic radiation or particle radiation comprises a step of applying a layer of the building material (11) to a building ...
|
|
WO/2016/139848A1 |
Through a solder paste obtained by mixing a solder alloy powder and a flux, the Pb-free Au-Sn-Ag-based solder paste being characterized in that the solder alloy powder contains 27.5% by mass to less than 33.0% by mass of Sn with respect ...
|
|
WO/2016/134787A1 |
The invention relates to a silver alloy composition having improved tarnish resistance and casting quality, which silver alloy composition contains 92.5-96.0 wt% Ag, preferably 93.5-94 wt% Ag, 2.27-4.96 wt% Cu, preferably 2.50-4.40 wt% C...
|
|
WO/2016/136590A1 |
Provided is a Ag alloy sputtering target characterized in having a composition containing one or more elements selected from Cu, Sn, Sb, Mg, In and Ti with the total being in the range of 0.1 atom% to 15.0 atom% and also containing S in ...
|
|
WO/2016/124376A1 |
The invention relates to a sinterable mixture for power electronics, in particular a sinterable mixture for forming sinter layers as binding materials in the automobile, illumination, energy, transportation and medical technical fields, ...
|
|
WO/2016/107755A1 |
A lightweight precious alloy made from titanium and gold, comprising at least 750‰ by weight of gold, characterised in that said alloy has a composition of formula: Tia Aub Mc Td in which a, b, c, d are atomic proportions and such that...
|
|
WO/2016/107752A1 |
An external component (1) for a timepiece or jewellery item, made from lightweight precious alloy comprising titanium and palladium, in the atomic composition TiaPdbMcTd, in which a, b, c and d are atomic fractions of the total, such tha...
|
|
WO/2016/104323A1 |
Provided is a sliding contact point material having a composition comprising 6.0-9.0 mass% inclusive of Cu, 0.1-2.0 mass% inclusive of Ni, 0.1-0.8 mass% inclusive of an added element M and Ag as the balance. The added element M is at lea...
|
|
WO/2016/098707A1 |
Provided is a bonding wire characterized by comprising: a core material that comprises at least one of Ga, In and Sn in a total of 0.1-3.0 at.%, the remainder comprising Ag and inevitable impurities; and a coating layer that is formed on...
|
|
WO/2016/093067A1 |
An electrode structure wherein an electrode layer, a barrier layer, a first metal layer and a second metal layer are sequentially formed on a semiconductor substrate. This electrode structure comprises a wire electrode that is joined to ...
|
|
WO/2016/084038A2 |
A master alloy designed to be mixed with a predetermined weight percentage of gold to obtain a white gold alloy containing a predetermined weight percentage of germanium for gold-whitening purposes, a predetermined weight percentage of a...
|
|
WO/2016/080155A1 |
The present invention provides: an alloy material which comprises palladium and 10.2-50.0 mass% iridium, the alloy material being an improvement over conventional palladium alloys, having improved X-ray impermeability and better machinab...
|
|
WO/2016/074796A1 |
The invention relates to an amorphously solidifying noble metal alloy, characterised by the following composition: AaBbCc, wherein: - A represents at least one noble metal from a group consisting of platinum and palladium; - B represents...
|
|
WO/2016/075983A1 |
This Au-Sn-Ag solder alloy is characterized by comprising Sn, Ag, Au, and elements unavoidably included during the manufacturing process, and having a composition adjusted such that the solidus line is within 280-400°C, and the solidus ...
|
|
WO/2016/052746A1 |
The objective of the present invention is to provide a dispersion liquid of composite particles that is for producing an exhaust-gas purifying catalyst in which the poisoning of catalyst metals by sulfur components is suppressed. The afo...
|
|
WO/2016/052728A1 |
The objective of the present invention is to provide a dispersion liquid of metal particles that is for producing an exhaust-gas purifying catalyst in which the aggregation of catalyst metals during high-temperature endurance is suppress...
|
|
WO/2016/052371A1 |
Provided is a master alloy for a sputtering target, such master alloy being characterized in that, if the elements constituting the master alloy are X1, X2, Y1, Y2, and Y3 as defined hereinafter, the master alloy comprises any one combin...
|
|
WO/2016/052362A1 |
A silver powder wherein, in measuring the volume-basis particle diameter distribution by a laser diffraction type particle size distribution measurement method, the requirement D50-IPA>D50-W is satisfied [wherein: D50-IPA stands for the ...
|
|
WO/2016/047236A1 |
An FePt-based sintered body sputtering target containing C and/or BN and characterized by having an AgCu alloy particle area ratio of 0.5%-15% in a polished surface having a vertical cross-section relative to a sputter surface of the tar...
|
|
WO/2016/047578A1 |
An FePt-based sintered body sputtering target containing C and/or BN and characterized by having an AuCu alloy particle area ratio of 0.5%-15% in a polished surface having a vertical cross-section relative to a sputter surface of the tar...
|
|
WO/2016/043183A1 |
The Ag alloy sputtering target according to the present invention has a composition in which Sn is contained in the range of 0.1 atomic% to 3.0 atomic% (inclusive), Cu is contained in the range of 1.0 atomic% to 10.0 atomic% (inclusive),...
|
|
WO/2016/039361A1 |
The present invention provides alloy microparticles containing Pd and Ru, wherein the alloy microparticles are characterized in having at least one first phase richer in Pd than in Ru, and at least one second phase richer in Ru than in P...
|
|
WO/2016/038965A1 |
Provided are a metal material with which the filling rate can be increased, and residual stress within a sintered compact can be reduced; and an electronic component in which said material can be used. This metal material (10) is charact...
|
|
WO/2016/035415A1 |
Provided is a sputtering target containing: an alloy including Co or Fe as a main component; and an oxide including Mn and B. The sputtering target is characterized by having the composition, which satisfies the conditions of 9 at% ≦ M...
|
|
WO/2016/035795A1 |
Provided are: a heat radiating member and a diamond composite material that are dense, exceptionally thermally conductive, and suitable as a material for a heat radiating member; and a method for producing a diamond composite material th...
|
|
WO/2016/028191A1 |
The invention relates to the field of metallurgy of noble metals, and more particularly to platinum alloys intended for the manufacture of catalyst gauzes used in the chemical industry. A platinum-based alloy for catalyst gauzes contains...
|
|
WO/2016/024615A1 |
Provided is a laminated film having low electrical resistance, high luminous transmittance, and excellent environment resistance. A laminated film (10) having an Ag alloy film (11) and a transparent electro-conductive oxide film (12) lam...
|
