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WO/2022/195122A1 |
The invention relates to a silver-copper-gold alloy for an electrical, electronic and/or electrical engineering component and/or an apparatus for sound reproduction and/or recording and/or for sound signal processing, emission, reception...
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WO/2022/194882A1 |
The invention relates to a soldering alloy, comprising: - a mass fraction of at least 35% and at most 62% of silver, - a mass fraction of at least 10% and at most 30% of copper, and - a mass fraction of at least 10% and at most 26% of zi...
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WO/2022/180650A1 |
A galvanic electrodeposition process, comprising a step of coating with a layer of yellow gold alloy at least one object immersed in a galvanic bath which comprises an aqueous solution. The aqueous solution comprises at least: - gold in ...
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WO/2022/158231A1 |
This Ag alloy film is composed of an Ag alloy having a composition containing 0.3-3.5 mass% of Ga and the remainder comprising Ag and inevitable impurities, and has, in a surface-side region of the Ag alloy film, a Ga segregated portion ...
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WO/2022/148817A1 |
The invention relates to an alloy comprising 375 to 917 parts of gold, 83 to 625 parts of titanium, and 30 to 200 ppm of a grain refiner selected from iridium, bore, vanadium, iron, cobalt, barium, yttrium, zirconium, and mixtures thereo...
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WO/2022/136265A1 |
The present invention relates to a cutting tool comprising a supporting body and a cBN, or PCD, cutting edge tip, wherein the cBN, or PCD, cutting edge tip is attached to the supporting body via a 5-150 µm thick braze joint, the support...
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WO/2022/128178A1 |
The invention relates to a gold alloy comprising by weight between 73% and 77% gold, between 5% and 11% silver, between 1% and 7% palladium and between 10% and 18% copper. The present invention also relates to the timepiece, ornament or ...
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WO/2022/122242A1 |
The invention relates to a piece of jewelry having a copper-containing gold alloy which consists of 75.0 to 75.2 wt.% gold, 16.5 to 17.0 wt.% copper, 3.1 to 7.1 wt.% silver, 1.2 to 3.2 wt.% palladium, and a remainder containing 0.5 to 2....
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WO/2022/116380A1 |
A method for preparing a ruthenium iridium nano alloy by means of laser irradiation and acoustic suspension of droplets, the method comprising the following steps: dissolving a ruthenium salt, an iridium salt and polyvinylpyrrolidone in ...
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WO/2022/116405A1 |
A low-silver-content filler material for brazing a vacuum electronic device. The filler material is composed of Ag, Cu, Ni, and a trace element R. The mass percentages of the respective components are: 65-71% of Ag, 0-1.0% of Ni, 0-0.1% ...
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WO/2022/114144A1 |
A ball for check valves according to the present disclosure comprises: a spherical body that is mainly composed of tungsten or platinum; and a film that is positioned on the surface of the spherical body, while being mainly composed of a...
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WO/2022/114239A1 |
This thermoelectric material is characterized by: having a NaCl-type crystal structure, the cation site of which includes, as chemical components, at least three elements selected from the group consisting of 5-90 at% of Ag, 5-90 at% of ...
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WO/2022/102238A1 |
Provided is a contact material that is less likely to cause contact damage due to an arc occurring when a contact is opened and closed. The contact material containing a Ag alloy as a main component includes: a Ag alloy; and at least one...
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WO/2022/102765A1 |
The present invention relates to a platinum-base sputtering target formed from platinum or a platinum alloy. This platinum-base sputtering target has a characteristic material composition in the thickness-direction cross-section. Specifi...
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WO/2022/091988A1 |
The present invention pertains to a bonding structure to be formed when, for example, a Si semiconductor or the like and a substrate are materials to be bonded and said pair of materials to be bonded are bonded by liquid phase diffusion ...
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WO/2022/085365A1 |
Provided is a novel Ag alloy bonding wire for a semiconductor device, the wire being required for high-density mounting and having an excellent performance for deforming into a pressed-ball during the ball bonding. The Ag alloy bonding w...
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WO/2022/074363A1 |
A platinum alloy composition consisting, in weight percent, of: 0.0 to 10.0 gold, 0.0 to 5.0 cobalt, 0.0 to 10.0 copper, 0.0 to 7.0 iron, 0.0 to 4.0 gallium, 0.0 to 3.0 indium, 0.0 to 5.0 iridium, 0.0 to 10.0 manganese, 0.0 to 7.0 nickel...
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WO/2022/076343A1 |
A powder comprising one or more of silver, zinc, copper, titanium, or alloys thereof; having a mean particle size of 0.05 to 1,000 micrometers, excluding particles less than one-tenth the mean size from the determination of the mean part...
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WO/2022/044940A1 |
Provided is a technique for improving durability of a noble-metal tip. The spark plug comprises a center electrode having a cylindrical noble-metal tip on one end and a ground electrode for forming a spark gap with a circular discharge s...
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WO/2022/034873A1 |
The present invention addresses the problem regarding particle generation in a Fe-Pt-BN-based sputtering target having a high relative density. This Fe-Pt-BN-based sputtering target is characterized by containing carbon (C) and boron oxi...
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WO/2022/033749A1 |
The invention relates to a piece of jewelry having a copper-containing gold alloy which consists of - 58.5 to 58.7 wt.% gold, - 26.9 to 32.6 wt.% copper, - 5.7 to 10.7 wt.% silver, - 1.0 to 3.0 wt.% palladium, and a remainder containing ...
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WO/2022/030333A1 |
The present invention addresses the problem of providing a countermeasure against deposition of an alkali metal in cases where the alkali metal is used as a negative electrode. The above-described problem is solved by a negative electrod...
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WO/2022/009871A1 |
Provided is a novel alloy configured from two elements, wherein: the standard deviation of the distributions, within the alloy, of the elements constituting the alloy is equal to or less than 18 at%; and the alloy has high solid-solution...
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WO/2022/009870A1 |
Provided is a novel alloy configured from three or more elements, wherein: the standard deviation of the distributions, within the alloy, of the elements constituting the alloy is equal to or less than 15 at%; and the alloy has high soli...
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WO/2022/004355A1 |
The purpose of the present invention is to provide: a sputtering target that makes it possible to perform film formation in which contamination by particles is suppressed on the occasion of sputtering; and a method for producing the sput...
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WO/2022/004354A1 |
The purpose of the present disclosure is to provide: a sputtering target that enables obtaining of a uniform compositional distribution in the in-plane direction and in the film thickness direction regarding the compositional makeup of a...
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WO/2021/259135A1 |
A high-purity fine platinum wire preparation method. By means of casting, hot forging, and wire processing, obtaining a high-purity fine platinum wire that has high uniformity, high precision, and high stability. The high-purity fine pla...
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WO/2021/259139A1 |
The present invention relates to a micro-fine platinum wire for a nuclear-grade platinum resistance thermometer, and a preparation method therefor. High-cleanliness vacuum melting and bottom pouring casting processes are used, such that ...
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WO/2021/256061A1 |
One purpose of the present invention is to provide solid solution particles of platinum and tungsten, which can be suitably used for a catalyst, etc. Another purpose of the present invention is to provide a catalyst having a higher catal...
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WO/2021/240839A1 |
This Ag alloy sputtering target comprises an Ag alloy that includes Ge and In, and the crystallite diameter thereof as derived by the Scherrer equation is 220 Å or less. The Ag alloy preferably has a composition containing In in a range...
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WO/2021/221575A1 |
It is related to obtaining silver clays, suitable for production of tarnish-resistant silver objects and jewelry, when it is molded or formed by hand and then dried and fired at appropriate temperatures.
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WO/2021/214110A1 |
The present document discloses a glazing in the form of a window glass which comprises a transparent glass substrate, and a coating, which comprises, in order outward from the transparent glass substrate, a seed layer and a functional me...
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WO/2021/214107A1 |
The present document discloses a glazing in the form of a window glass or vehicle glass which comprises a transparent substrate, and a coating. The coating comprises, in order outward from the transparent substrate, an optional diffusion...
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WO/2021/214109A1 |
The present document discloses a glazing in the form of a window glass or vehicle glass which comprises a transparent substrate, and a coating. The coating comprises, in order outward from the transparent substrate, an optional diffusion...
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WO/2021/214108A1 |
The present document discloses a glazing in the form of a window glass which comprises a transparent glass substrate, and a coating, which comprises, in order outward from the transparent glass substrate, a seed layer and a functional me...
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WO/2021/214111A1 |
The present document discloses a planar sputter target comprising at least a first target segment comprising a Ag alloy. The Ag alloy consists essentially of Ag and an alloying agent selected from a group consisting of Li, C, Na, Mg, Al,...
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WO/2021/208232A1 |
Disclosed are a nano silver-copper alloy material and a preparation method therefor. The nano silver-copper alloy material is composed of a mixture of nano silver-copper alloy particles with a particle size of 15-50 nm, and the copper me...
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WO/2021/206096A1 |
A production method for solder particles, the production method including a preparation step for preparing a substrate that has a plurality of protrusions, a solder layer formation step for forming a solder layer on at least a portion of...
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WO/2021/200242A1 |
Provided is a brazing material in paste form and a technology related to the same, the brazing material containing a vehicle and a powder comprising 0.7 to 2.0 mass% of titanium powder having an average particle diameter (D50) of 20 μm ...
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WO/2021/200801A1 |
Provided is a ceramic circuit board formed by joining a plate-shaped metal member to at least one surface of a ceramic board (10) by means of a brazing material (20), wherein the metal member (30) has a first surface (31) which faces the...
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WO/2021/194846A1 |
A process for efficiently and economically recovering palladium from a colloidal suspension of tin and palladium involves the use of centrifugation to obtain a sediment enriched in tin and a centrifugate enriched in palladium. An aggrega...
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WO/2021/180421A1 |
The invention relates to a wire (1) or strip for production of test needles or slide contacts, the wire (1) or strip including a material or consisting of a material, the material having a matrix composed of copper, palladium, rhodium, o...
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WO/2021/164339A1 |
Disclosed are an AgPdCu alloy and a preparation method therefor, and an AgPdCu alloy sputtering target material and a preparation method therefor. The AgPdCu alloy comprises the following components by atomic percentage: 0.1-1.5% of Pd; ...
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WO/2021/166762A1 |
According to one embodiment of the present invention, a brazing filler material for bonding a ceramic substrate and a metal plate to each other is characterized by having an endothermic peak within the range of from 550°C to 700°C in t...
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WO/2021/161845A1 |
A precious metal chip (32) for a spark plug according to the present invention contains at least 50 mass% of iridium (Ir) and 0.1-5 mass% of aluminum (Al), and further contains rhodium (Rh), wherein a fibrous metal structure R is observe...
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WO/2021/154771A1 |
A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may h...
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WO/2021/148862A1 |
Tarnishing resistant Gold alloy for jewellery, comprising: - Gold in the amount comprised in the range [815-846] %o by weight, - Copper in the amount comprised in the range [120-154] %o by weight, - Silver in the amount comprised in the ...
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WO/2021/141987A1 |
Nickel-gold alloys as well as methods of forming the same are provided. In one aspect, an article is provided. The article comprises a nickel-gold alloy. Gold is present in the nickel-gold alloy at a gold concentration no greater than 10...
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WO/2021/121863A1 |
The invention relates to a device (1) consisting of at least one first (2) and one second (3) component, wherein the first (2) and the second component (3) are components of a field device for processing and automation technology, which ...
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WO/2021/112004A1 |
A Ag alloy sputtering target characterized by comprising a Ag alloy that has a compositional makeup in which Ge, In, and S are contained and the remaining portion is Ag and unavoidable impurities, wherein the contained amount of S in the...
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