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WO/2003/041209A2 |
The invention relates to a device and a method for the temporally and spatially dependent measuring of at least one operating parameter of an electrochemical cell, in which several electrodes are provided. An electrolyte solution is loca...
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WO/2003/038159A2 |
In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents...
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WO/2003/036693A2 |
Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
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WO/2003/035943A1 |
An electrolytic copper plating method characterized by carrying out electrolytic copper plating by using phosphorus−containing copper as an anode, wherein the crystal particle size of the phosphorus−containing copper anode is 10−15...
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WO/2003/033774A1 |
A submerged transfer plating device for plating sheet−like rectangular products (W) while the products are transferred in plating fluid (A), comprising a plating fluid jetting device for jetting plating fluid toward the sheet−like re...
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WO/2003/033770A2 |
The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of...
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WO/2003/029779A2 |
Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order to obtain acceptable copper deposits. C...
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WO/2003/028534A2 |
A novel visual field test utilizing oscillating visual stimuli is proposed, which may be used to diagnose for eye disorders, such as glaucoma or macular degeneration. Such visual stimuli oscillate in color, polarity, saturation, luminanc...
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WO/2003/025255A2 |
The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper (40), that preferential...
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WO2002070144A9 |
An improved method and plating system (100) comprising a plurality of non-electrically conductive shields (130) forming an elongated upper channel (122) and an elongated lower channel (121); a plating solution sparger comprising a series...
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WO/2003/018874A2 |
A processing chamber comprising a reaction vessel having an electro−reaction cell (420) including a virtual electrode (430) unit, an electrode assembly (414) disposed relative to the electro−reaction cell to be in fluid communication...
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WO/2003/018878A2 |
In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for b...
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WO/2003/018879A1 |
An electroforming apparatus and an electroforming method for performing a highly precise electroforming. An electrolyte (3) is continuously fed from a control bath (5) to an electroforming bath (1) housed in an outer bath (2), so that th...
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WO/2003/010359A1 |
Fluid flow processing equipment, wherein plating solution (17) at the portion other than near a fluid level is prevented from flowing by a first partition plate (15) having a lower end fitted to the bottom part of a plating bath (11) and...
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WO/2003/010366A1 |
An apparatus for plating treatment, characterized in that at least a part of the portion contacting with a plating solution is made from a material which exhibits a lower rate of the change in surface roughness during the contact with a ...
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WO/2003/006193A1 |
The invention relates to a continuous casting roll for casting molten baths, especially steel molten baths. Said casting roll comprises a roll barrel (2) consisting of a metallic material, to which a layer (4) of metallic material is app...
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WO/2003/005430A2 |
A method for a controlling a plating process layer (160) on a wafer in accordance with a recipe; measuring a thickness of the process layer (160); and determining at least one plating parameter of the recipe for subsequently formed proce...
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WO/2003/002784A2 |
It is described an electrolysis cell wherein the anodic dissolution of metals is carried out, in particular of metals characterised by a relatively high oxidation potential, such as coppere, or metals with high hydrogen overpotential, fo...
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WO/2003/000395A1 |
An insulated vibratingly stirring apparatus (16), comprising a vibration generating means having a vibrating motor (16d) and a vibrating member (16c) fitted to the motor, a vibrating bar fitted to the vibrating member through a mounting ...
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WO/2002/097165A2 |
An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel (204). The reaction vessel includes: an outer container (220) having an outer wall (222); a fist outlet configured to introduce a p...
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WO/2002/096807A2 |
An electrodeionization apparatus and method for purifying a fluid. A fluid, such as water, can be purified by removing weakly ionizable species from the fluid. Weakly ionizable species may be dissociated at different pH levels to facilit...
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WO/2002/083995A1 |
A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fi...
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WO/2002/084212A1 |
The inventive method for measuring micro-galvanically produced components (23') comprising a three-dimensional structure produced by deep lithography is characterised as follows: a single or multilayer component (23') is constructed by g...
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WO/2002/077328A1 |
A phosphate film processing device for forming a phosphate film on a metal blank by electrolyzing the metal blank in a predetermined electrolytic solution, wherein one of the positive and negative electrodes abuts against the metal blank...
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WO/2002/072924A2 |
The invention relates a device for chroming, whereby various electrodes are used as operating anodes for separating chrome and for oxidising formed chrome III-ions into chrome VI-ions, and an electrode is used as an oxidation anode which...
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WO2002045476A9 |
A process and reactor for electrochemical processing of at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positio...
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WO/2002/063069A2 |
Methods of electrodeposition and electroless deposition are disclosed which afford super-filling of high-aspect ratio features on wafers by exposing wafers and electrolytic solutions in which they are immersed to conditions effective to ...
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WO/2002/063072A1 |
An apparatus (100) which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate (108) is provided. The apparatus has an anode (112) which can be contacted...
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WO/2002/062446A1 |
A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surface...
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WO/2002/059398A2 |
The present invention relates to a plating apparatus and method which smoothly perform contact of a plating liquid with a surface of the substrate and which can prevent air bubbles from remaining on the surface to be plated. The plating ...
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WO/2002/057514A2 |
A system for depositing materials on a surface of a wafer includes an anode, a shaping plate, a liquid electrolyte contained between the anode and the surface of the wafer, and electrical contact members contacting selected locations on ...
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WO/2002/053809A1 |
A spouted bed electrochemical reator (100) for treating a plurality of objects (114) with a fluid is set forth. The apparatus comprises a vessel (119) for contacting the plurality of objects (114). An upwardly directed stream of fluid an...
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WO/2002/053806A2 |
The invention relates to a device and method, with which it is possible to electrochemically deposit thin layers with a nearly homogeneous layer thickness on large-surface substrates having relatively high resistances. These thin layers ...
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WO/2002/038827A1 |
A method for depositing a film of an advanced material on a surface of an article is disclosed. The method comprises placing the article within a bath having a pair of spaced electrodes one of which is formed by said article and an elect...
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WO/2002/036839A1 |
The invention concerns a method or procedure and an installation of metal retrieving from used water chroming solutions, with high content of Cr and other impurifying metals as Fe, Cr?3+¿, Cu, using as reactive the gas ammonia, introduc...
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WO/2002/036860A1 |
A process is provided for electrolytically depositing copper onto a workpiece. The process includes the steps of providing a copper generation vessel and generating a copper plating solution from solid-state copper in the vessel. The pla...
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WO/2002/033150A2 |
The present invention discloses a power supply device, particularly for supplying a controlled electrical signal in an electrochemical process, e.g. plating, etching, etc. The power delivery device provides an electrical signal with opti...
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WO/2002/031227A2 |
A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate i...
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WO/2002/029875A2 |
The present invention provides an electroplating system (50) for semiconductor wafers (66) including a plating chamber (52) connected by a circulating system (52, 56, 58) to a plating solution reservoir (60). The semiconductor wafer (66)...
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WO/2002/026381A2 |
Ionic compounds having a freezing point of no more than 50 °C, formed by the reaction of at least one amine salt of the formula R?1¿R?2¿R?3¿R?4¿N?+¿X?-¿ (I) with at least one hydrated salts, which is a chloride, nitrate, sulphate ...
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WO/2002/004711A2 |
An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in...
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WO/2002/004715A2 |
A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate i...
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WO/2002/001610A2 |
A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be...
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WO2000061837A9 |
A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microeletronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (50...
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WO/2001/096632A2 |
An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a...
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WO/2001/096973A2 |
Methods, systems and computer program products for controlling plating pulse rectifiers are provided by identifying one of the plurality of plating pulse rectifiers as a master plating pulse rectifier and identifying at least one of the ...
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WO/2001/094656A2 |
A programmable/controllable anode and related methods of operation. An anode to be used with an electroplating system containing a substrate (48) acting as a cathode. The anode includes a plurality of anode segments (203a, ..., 203d) and...
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WO/2001/092607A1 |
The present invention provides a system and method for selectively removing one or more organic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a sou...
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WO/2001/092604A2 |
The invention is relative to an electrolysis cell for the anodic dissolution of metals, in particular of metals characterised by a relatively high oxidation potential, such as copper, or metals with high hydrogen overpotential, having th...
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WO/2001/091163A2 |
The facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber. The optimizer (step 70) utilizes two sets of input parameters along with the sensitivity table/matrix to ca...
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