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WO/2009/098756A1 |
A process and apparatus for producing an aqueous copper sulfate solution or aqueous copper sulfate solution containing iron sulfate. By the process and apparatus, copper ions can be efficiently dissolved away and a high-purity aqueous co...
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WO/2009/097360A1 |
Indium (In) electroplating solutions which are used to deposit compositionally pure, uniform, substantially defect free and smooth In films with near 100% plating efficiency and repeatability. In one embodiment the plating solution inclu...
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WO/2009/087637A2 |
Method for manufacturing an electrocoated medical device; method for quality control testing a coated medical device using an electrical cell; method for setting process parameters for electrocoating a medical device; method for validati...
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WO/2009/080654A1 |
Disclosed is a method for depositing an alloy and/or chemical compounds on a substrate immersed in an electrolyte (1), comprising the steps of: I) applying a first constant or varying potential to the substrate under voltage control for ...
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WO/2009/075885A2 |
A plating system comprises a plating solution and an apparatus for control of the plating solution, the apparatus including a Raman spectrometer for measurement of organic components, a visible light spectrometer for measurement of metal...
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WO/2009/055992A1 |
The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose su...
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WO/2009/055116A2 |
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide...
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WO/2009/040250A2 |
A power control device (1) of a power network (2), which comprises a number of anodes (5) and a number of cathodes (3), of an electrochemical coating facility is disclosed, having a plurality of control modules (6), each control module (...
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WO/2009/040483A1 |
The invention relates to an equipment (1) for the electrolytic tinning of a continuously running steel strip (2) in at least one electrodeposition tank (30) containing an acidic electrolyte. The equipment (1) further includes a tin disso...
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WO/2009/031508A1 |
A treatment bath provided with a noncontact liquid seal section is used. The noncontact liquid seal section is not brought into contact with a web and suppresses liquid leakage.
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WO/2009/032238A1 |
The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurem...
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WO/2009/019333A1 |
The present invention relates to a plant (1) for the electrolytic tinning of a steel strip (2) travelling continuously in at least one electrodeposition tank (30) containing an acid electrolyte. The plant (1) comprises, in addition, a ti...
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WO/2009/016292A2 |
The invention relates to a method for the electrolytic tinning of steel bands (2), using a soluble anode (600, 6000). The invention also relates to an electrotinning unit (1) and a removable, renewable soluble anode (600, 6000) for imple...
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WO/2009/016291A2 |
The invention relates to a method for the electrolytic tinning of steel bands (20), using an insoluble anode (60). The invention also relates to a unit (1) for implementing same and a module (80, 800) for recovering acid from the electro...
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WO/2009/013398A2 |
The invention relates to equipment for the electrolytic tinning (1) of a continuously running steel strip (2) in at least one coating tank (30) fitted with at least one non-soluble anode (60) and containing an acidic electrolyte. The equ...
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WO/2009/012891A1 |
A description is given of a process for producing a metallic coating on a substrate, which comprises deposition of at least one metal in an electroplating bath comprising an aqueous electrolyte containing organic additives and at least o...
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WO/2009/002385A2 |
An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (...
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WO/2008/152506A2 |
The invention relates, inter alia, to a method for depositing or removing a layer on/from a workpiece, wherein an electrolyte is present between said workpiece and at least one counter electrode and a potential difference is applied betw...
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WO/2008/148578A1 |
An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparat...
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WO2007115318B1 |
The present invention provides methods of electroplating a film or films onto a top surface of a sheet, preferably a continuously moving roll-to-roll sheet. In certain aspects of the invention, there are provided methods in which the mol...
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WO/2008/136223A1 |
Disclosed is a chromium hydroxide which is characterized by having an average particle diameter D of 40-200 nm and an aggregation degree, which is represented by the ratio D50/D between the volume average particle diameter D50 measured b...
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WO/2008/137459A2 |
In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the...
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WO/2008/137951A2 |
A plating computer having a plating cell with an interior processing volume configured to contain a plating solution for a plating process, a cell mounting platform connected at least at a first point to an actuator and at a second point...
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WO/2008/108341A1 |
[PROBLEMS] To provide a method for roughening the both sides of a copper plate by forming minute nodular protrusions on the both sides of the copper plate in which progress of deterioration of electrolytic copper plating liquid is retard...
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WO/2008/105489A1 |
Disclosed is an apparatus for removing a cation from a plating solution additive comprising an aqueous solution containing an organic or inorganic acid salt, which can remove an undesirable cationic component such as sodium and potassium...
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WO/2008/102332A1 |
A method of forming an insulator that passes through a metal substrate (302) comprising: anodizing a region (312a, 312b, 314,316a, 316b, 318, 320a, 320b, 322, 324a, 324b) of the substrate to form the insulator; illuminating the region wi...
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WO/2008/101740A1 |
To achieve uniform electroplating of a metal on a work piece a device is provided, which comprises at least one anode and a diaphragm comprising a fill made of packing material. The diaphragm is located in the device such that electric f...
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WO/2008/084524A1 |
A process for producing a semiconductor device, comprising the wiring region forming step of forming a wiring region on a semiconductor substrate; the copper wiring layer forming step of forming a copper wiring layer on the formed wiring...
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WO/2008/081536A1 |
[PROBLEMS] To efficiently derive accurate operating condition parameters most suitable for plating operation. [MEANS FOR SOLVING PROBLEMS] First, preliminary test operation (S12) is carried out in current passage condition. Taking result...
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WO/2008/082004A1 |
This invention provides a plating member which, while adopting a lead-free plating material, can suppress the occurrence of whiskers in a plating layer (16) and, at the same time, can realize good soldability. The plating member comprise...
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WO/2008/080515A2 |
The invention relates to a set for creating a process reactor for forming metallic layers on at least one substrate, the layers being formed by the precipitation of metal ions contained in a fluid onto the substrates. Said set essentiall...
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WO/2008/071371A2 |
Disclosed is a method for the galvanic deposition of a metal coating from an electrolyte bath in which the concentrations of at least two components of the electrolyte bath are monitored and in which the following steps are carried out: ...
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WO/2008/071298A1 |
A method for galvanic coating of workpieces (68, 68') is disclosed, wherein the workpieces (68, 68') are firstly hung on a frame, then pre-treated and passed through a zinc-containing electrolyte bath (46, 48, 50), wherein the workpieces...
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WO/2008/070786A1 |
Methods and systems for screening for the effect of bath composition on the performance of electroplating, electroless-plating, electrochemical-etching, electropolishing, and chemical-etching processes are provided. The methods and syste...
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WO/2008/047509A1 |
This invention provides a plating apparatus which can apply at a high speed a magnetic alloy plating having a uniform thickness and a homogeneous composition on the surface of a shaft-shaped member. A plating apparatus (1) has a plating ...
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WO/2008/023778A1 |
A plating solution regenerating apparatus for electroplating, comprising a circulation tank, a sludge removing unit, a concentrating unit, an iron compound crystallizing unit, an iron compound separating unit, an iron compound re-dissolv...
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WO/2008/014987A2 |
The invention relates to a method for deposition of chromium layers as hard-chrome plating for protection against wear or corrosion and/or for decorative purposes and also an electroplating bath with which chromium layers of this type ca...
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WO/2007/120357A2 |
Embodiments of the invention generally provide a method for electrochemically removing material from a substrate. In one embodiment, a method for electrochemically processing a substrate includes determining a process target for a substr...
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WO/2007/116775A1 |
The present invention provides a washing apparatus which washes a web while conveying the web. The washing apparatus includes a squirting component which ejects fresh washing liquid at the web and a first washing tank which is disposed a...
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WO/2007/102605A1 |
This invention provides a method for electroplating on a mesh pattern on a film having high surface resistivity evenly without increasing the line width, and an electroconductive film having excellent electroconductivity and a light-tran...
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WO/2007/103304A2 |
The present invention relates to a mobile apparatus and/or system that measures the thickness at one or more locations of a surface on at least a part of a substrate and methods of using said apparatus and/or system. The mobile apparatus...
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WO/2007/088008A2 |
The invention relates to a method for coating substrate surfaces with a metal or oxide layer in a coating bath. Said bath has at least one component the concentration of which changes during the coating process and which therefore has to...
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WO/2007/082528A1 |
The invention relates to a method for producing an alloy having a predetermined composition, said alloy having three or more components. The method according to the invention comprises the following steps: (a) determining the selectivity...
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WO/2007/082275A2 |
The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with el...
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WO/2007/058603A1 |
Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple e...
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WO/2007/058605A1 |
A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a...
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WO/2007/055223A1 |
Disclosed is a method for forming a metal film which is characterized by comprising a step (a1) for forming, on a substrate, a polymer layer composed of a polymer which has a functional group interacting with a metal ion or a metal salt ...
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WO/2007/047215A2 |
Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electropro...
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WO2002029137A9 |
An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in...
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WO/2007/024331A1 |
One close loop system and method for electrophoretic deposition (EPD) of phosphor material on light emitting diodes (LEDs) . The system comprises a deposition chamber sealed from- ambient air. A mixture of phosphor material and solution ...
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