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WO/2001/090434A2 |
A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerica...
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WO/2001/088228A1 |
An electrolysis apparatus equipped with a circulating system, wherein an adjusted copper sulfate solution containing thiourea added thereto is electrolyzed in an electrolysis vessel to produce an electrolytic copper foil, a copper sulfat...
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WO/2001/088211A2 |
The invention relates to a method for the treatment of work pieces with a palladium colloid solution by bringing the work pieces into contact with the colloid solution, palladium being recovered after the use of the colloid solution. Thi...
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WO/2001/083857A1 |
Method for the elctrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in th...
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WO/2001/081657A2 |
A rotation element (9,10), especially a contact cylinder is used to electrically contact printed circuit boards and conductor films in order to produce printed circuit boards and conductor films (7) wherein there is only a low amount of ...
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WO/2001/079589A1 |
In a method for processing a substrate (S), for instance by etching or plating, use is made of an apparatus comprising a chamber (1) for receiving the substrate (S), a unit (10) for feeding a processing fluid to the chamber (1) before an...
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WO/2001/079591A1 |
In a method for electrochemical processing of a substrate (S), use is made of an apparatus which comprises a container (1) having a chamber for holding an electrolyte, an electrode member (8) arranged in the chamber, and a substrate hold...
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WO/2001/071066A1 |
Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device whi...
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WO/2001/072096A1 |
The wetting, removal of gas bubbles and improvement of material exchange in both through and blind holes in circuit boards (LP) is not possible with conventional devices and methods without further application. In particular, very narrow...
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WO/2001/068952A1 |
The invention relates to an electroplating device adapted to plate thin grooves and plugs for wiring in a semiconductor wafer surface, and openings in a resist layer, and adapted to form bumps (projecting electrodes) in a semiconductor w...
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WO/2001/068949A1 |
A single delivery channel is formed by, and between, inner wall (2) and baffle (3). Electrolyte (5) is pumped up the interior of channel (1) and is directed onto substrate (4) being a cathode maintained at -10 volts. The upper part of th...
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WO/2001/068953A1 |
The regulation of the concentration of metal ions in an electrolyte, for the electrolytic separation of metals, containing additional substances of an electrochemically reversible redox system is conventionally achieved by passing at lea...
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WO/2001/066830A2 |
The invention relates to a method for applying a metal layer to surfaces of light metals. Iron of an aqueous deposition bath that contains Fe(II)-compounds is electrolytically deposited on the surfaces by means of dimensionally stable an...
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WO2000033356A9 |
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck ...
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WO/2001/054179A1 |
A method and apparatus is disclosed for reclaiming a metal from the effluent of a chemical mechanical planarization (CMP) process and using the reclaimed metal in an electroplating process. The steps of the method include using a chemica...
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WO/2001/053204A1 |
The invention relates to a method for treating hexavalent chromium compounds occurring in effluents originating from the treatment of metals. In this method, hexavalent chromium compounds are reduced in acid conditions, and then the chro...
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WO/2001/050505A2 |
An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjustin...
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WO/2001/048275A1 |
A plating device and a plating method, for plating electronic parts boards, etc., while preventing metal pollution from spreading inside and outside the plating device, preventing the seed layer from dissolving, and preventing the washin...
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WO/2001/038610A1 |
The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially,...
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WO/2001/032362A1 |
The present invention system and method facilitates efficient material deposition and wafer planarization during IC wafer fabrication. The present invention is particularly useful in facilitating efficient copper deposition and manufactu...
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WO/2001/029548A1 |
An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features...
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WO/2001/027358A1 |
The invention relates to carriers serving for supplying current to workpieces or counter electrodes that are to be treated electrolytically. The invention also relates to a method for electrolytically treating workpieces. The inventive c...
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WO2000036737A9 |
A power supply for producing complex non-periodic waveforms from a sum of periodic waveforms is disclosed. The power supply includes a controller which measures the output signal and compares it to the desired signal in order to produce ...
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WO/2001/016405A1 |
A method for measuring the concentration of a leveler in a plating solution for a plating apparatus being used for filling a metal such as copper into a groove or hole formed for wiring in the surface of, for example, a semiconductor sub...
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WO/2001/009409A1 |
A process for dissolving metals, in particular tin, and a plant for dissolving metals (50) operating according to said process allow to minimize the quantity of metal in the sludge and the oxygen consumption, and entail a first step in w...
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WO/2001/009399A1 |
A method of recovering silver from an acidic brine solution produced by brine leaching a silver and copper bearing bio-leach residue wherein copper (1) is added to the solution to cement silver (1) and to produce a slurry, and silver is ...
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WO/2000/079029A2 |
A method and apparatus for maintaining electro-deposition of metal on a cathode in an electrolytic cell. The cell comprises a metal anode, a cathode, an electrolytic bath and a main power supply to apply an electric potential across the ...
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WO/2000/068468A1 |
A copper replenishment system (10) is designed for replenishing copper which is depleted from a coppet plating solution (15). The replenishment is achieved by the use of a compact filter cartridge (30), which is inserted into a recircula...
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WO/2000/061498A2 |
A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make e...
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WO/2000/059605A1 |
The invention relates to a device for cleaning a fluid in the form of a vapor from a circuit consisting of an evaporation chamber in which a given amount of water vapor is produced, that is fed to a separator (1), delivered thereafter to...
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WO/2000/056453A1 |
The invention relates to a method for producing a catalyst. A layer consisting of catalytically active metallic material is deposited on a flat substrate by means of electrodeposition, said substrate being immersed in an electrolyte cont...
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WO2000020662A9 |
Methods for depositing a metal into a micro-recessed structure in the surface of a microelectronic workpiece are disclosed. The methods are suitable for use in connection with additive free as well as additive containing electroplating s...
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WO/2000/052229A1 |
A process for recovering copper from an alkaline etch bath from an etching process in which printed boards plated with copper are etched with the alkaline etch bath and then rinsed with water, copper being removed by extraction with an o...
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WO/2000/049206A1 |
A continuous band plating device capable of providing a glossy and beautiful plated surface, wherein an anode is not provided in a continuous band (80) rising section at the final-stage cell (13) of a plating tank (10), nor is provided a...
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WO/2000/032849A1 |
This invention comprises a driven conveyor for transporting work pieces into one or more flood plating cells for electroplating a metal onto the planar surfaces and surfaces of the through holes of the work piece. An electrolyte solution...
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WO/2000/032850A1 |
A plating machine comprising a plating unit and a control unit which are installed in separate rooms so that works which are the dirty polluting ones of maintenance are conducted in the room where the control unit is installed as much as...
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WO/2000/028115A1 |
Plating method and apparatus capable of making a plating liquid enter fine grooves and holes formed in a base to be plated, without adding a surfactant to the plating liquid; and carrying out a plating operation which enables the formati...
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WO/2000/026443A2 |
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area...
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WO/2000/026445A2 |
One electrode is provided in association with the object to be coated, the other electrode. A pre-stretched ion-exchange membrate in a thin tubular form is sandwiched in-between two nonconductive water permeable screen tubular housings. ...
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WO/2000/023639A1 |
Installation for the collection of liquid residues applicable to the treatment of parts through an electrolytic bath, comprising a tank (1) to which are fed through a conduit (2) the residues (30) to be collected and which will be furthe...
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WO/2000/019936A1 |
The invention relates to a method for producing prosthetic moulded parts for dental use with the aid of galvanic metal deposition, whereby said deposition occurs at least partially by means of a pulse current. Preferably, the deposition ...
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WO/2000/014308A1 |
A substrate plating device capable of using an insoluble anode and replenishing metal ions automatically; a substrate plating device capable of making uniform a primary current distribution between a cathode and an anode and downsizing t...
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WO/2000/006809A1 |
In a method for galvanizing, in particular electrolytically coloring an anodized aluminum surface in a bath (1) containing heavy metal ions, in particular tin (II), Ni, Co or Cu (II) ions, the heavy metal is deposited in the anodized sur...
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WO/2000/006807A2 |
The anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath.
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WO/2000/006810A1 |
A method for multilayered coating, whereby hurdles for the item that is to be treated are guided for galavanic dip coating (2) through a tank in a separate circuit. Downstream from the tank, the hurdles are changed over (12) and the item...
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WO/2000/005438A1 |
A method (useful in toxic metal recovery procedures) of converting a transition metal cation to an anionic form where it is in a higher oxidation state, said method comprising or including: i) providing an electrolytic cell having an aci...
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WO/2000/003073A2 |
A method of controlling the content of a chemical bath includes the steps of: determining a replenishment condition for the chemical bath; defining a unit of the replenishment condition; establishing a pacing factor corresponding to a re...
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WO/2000/003074A1 |
A conduction condition detecting means which can detect a conduction condition (contact condition) of a plurality of feeding contacts in contact with the conduction portion of a substrate to be plated, and a plating device which can form...
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WO/2000/001863A2 |
The invention relates to a method for detaching precious metal layers from a correspondingly coated material by dissolving the precious metals in a salt-containing alkali cyanide solution containing oxidizing agents. According to the inv...
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WO/2000/001208A1 |
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with ca...
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