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WO/2020/012952A1 |
This flat cable comprises: a plurality of conductors which are arranged in parallel to each other; insulating layers which are formed on first surfaces and second surfaces of the plurality of conductors, said second surfaces being on the...
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WO/2020/009212A1 |
A surface-treated steel sheet according to the present invention comprises a base material steel sheet and a Ni-Co-Fe alloy plating layer formed on at least one surface of the base material steel sheet, wherein the alloy plating layer ha...
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WO/2020/009161A1 |
Provided is a double-pipe-structure pressure contact roll having an outer tube member made from at least a carbon-fiber-reinforced resin, wherein the pressure contact roll is configured so that a metal plating layer is uniformly and firm...
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WO/2020/009213A1 |
A surface-treated steel sheet according to the present invention includes an Ni-Co-Fe alloy plated layer provided on at least one face of a base steel sheet, and the alloy plated layer has an Ni deposition amount of 7.1-18.5 g/m2, a Co d...
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WO/2020/009379A1 |
The present invention provides a manufacturing method of a surface-treated Zn-Ni alloy electroplated steel sheet, the method comprising the steps of: preparing a Zn-Ni alloy electroplated steel sheet including a steel sheet and a Zn-Ni a...
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WO/2020/006042A1 |
A cable (10) includes at least one inner conductor (12) and an insulation layer (14) surrounding the inner conductor (12). An outer conductive layer (16) surrounds the insulation layer (14) and center conductor and includes a carbon nano...
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WO/2020/002060A1 |
The invention relates to a method for producing a part (1) comprising a support (2) made of a non-electroconductive material, said support (2) being provided with at least one cavity (4) filled with an aesthetic element (3) made of an el...
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WO/2020/005949A1 |
A high-strength coatings and methods of fabrication yield single-crystal-like nickel containing nanotwins and stacking faults are disclosed. By using two steps having sputtering and electrochemically depositing Ni on (111) orientation co...
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WO/2020/002402A1 |
The invention relates to a method for producing a part (1) comprising a support (2) provided with at least one cavity (4) filled with an aesthetic element (3) forming a decoration on a face (2a) of the part (1), which is intended to be v...
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WO/2020/006457A1 |
A method of forming a lithium metal film is provided. In a general embodiment, the present disclosure provides a deposition cell comprising an anode and a substrate provided within the deposition cell. A lithium ion containing electrolyt...
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WO/2020/003879A1 |
The present invention provides a method for producing a molded body having a metal pattern on an insulating molded body, which is characterized by comprising: a step 1 for forming a conductive metal layer (M1), which contains silver part...
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WO/2019/239440A1 |
Described is a cathodic treatment for the electrode position of a metal layer securely adherent to the surface of stainless steel objects in an electrolytic bath comprising one or more metals belonging exclusively to the groups from 3 to...
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WO/2019/233053A1 |
The present invention provides a microporous foamed nickel. The microporous foamed nickel uses a polyurethane sponge as a matrix, has an overall three-dimensional porous network structure, and has a micropore density of ≥ 10/μm2, a sp...
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WO/2019/228902A1 |
The invention relates to a method for producing metal decorative elements on a curved watch dial made of an insulating material, characterised in that it comprises the steps of forming, using a UV LIGA method, a mould made of a photosens...
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WO/2019/230137A1 |
Provided is a surface-treated metal material of which contact resistance and insertion force are suppressed finely. This surface-treated metal material is provided with: a base material; a lower layer comprising Ni and formed on the base...
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WO/2019/217388A1 |
A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based d...
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WO/2019/217673A1 |
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operatio...
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WO/2019/216012A1 |
A printed wiring board according to an embodiment of the present disclosure comprises an insulating base film and a conductive pattern that is laminated upon at least one surface of the base film and that includes a plurality of parallel...
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WO/2019/215287A1 |
The present invention concerns a new nickel comprising layer array preferably having a reduced nickel ion release and a method for its manufacture. Further, it relates to the use of the layer array as decorative coating on a surface of t...
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WO/2019/206682A1 |
Method of forming a metallic plating (9) on a substrate (1), comprising the steps of: - providing a substrate (1) comprising a hydrocarbon-based polymer containing C-C and either or both of C-H and N-H bonds; - covalently bonding an azid...
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WO/2019/208522A1 |
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 has an L* value of 44.0 to 84.0...
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WO/2019/208521A1 |
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 has an Ni coating weight of 20 ...
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WO/2019/208525A1 |
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The root-mean-square slope R∆q of a roughness curve element of the first surface-treated layer 3 of t...
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WO/2019/208368A1 |
Provided is a surface-treated copper foil which has such fine wiring pattern processability that a fine wring pattern having an L & S value of 30/30 μm or less, for example, can be formed by a subtractive process having excellent proces...
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WO/2019/208520A1 |
The surface-treated copper foil 1 has a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of this surface-treated copper foil 1 is such that an XPS depth profi...
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WO/2019/210264A1 |
Provided herein are apparatuses, systems, and methods for the electrodeposition of nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance, on a plurality of workpieces.
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WO/2019/209342A1 |
In an example, techniques of waterborne emulsion based electroplating of magnesium substrates are described. In an example method, the magnesium substrate is electroplated with a layer of first metal, in a mixture of a non-aqueous ionic ...
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WO/2019/203709A1 |
The invention relates to a method for surface treatment of an object (1), said method comprising the following steps:applying a surface layer (3, 4) on said object (1) by electrode position of said object (1) in a liquid bath; and formin...
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WO/2019/199498A1 |
A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed w...
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WO/2019/197127A1 |
The invention relates to a device for the selective electrochemical machining of workpieces (14). The device has a machining head (11) which is equipped with an electrolyte transmitter (16). The electrolyte transmitter (16) has a machini...
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WO/2019/198820A1 |
This Ni diffusion plated steel sheet is provided with a base steel sheet and an Fe-Ni diffusion alloy plating layer which is positioned on at least one surface of the base steel sheet. The adhesion amount of Ni in the Fe-Ni diffusion all...
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WO/2019/198819A1 |
This Ni diffusion plated steel sheet is provided with a base steel sheet and an Fe-Ni diffusion alloy plating layer which is positioned on at least one surface of the base steel sheet. The adhesion amount of Ni in the Fe-Ni diffusion all...
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WO/2019/199614A1 |
Void-free bottom-up fill of copper in features is achieved on non-copper liner layers. A non-copper liner layer has a higher resistivity than copper. An electroplating solution for plating copper on a non-copper liner layer includes a lo...
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WO/2019/193960A1 |
Provided is a plated wire rod having excellent salt water corrosion resistance, solder wettability, thermal peeling resistance, and fatigue resistance. A plated wire rod having a wire rod comprising aluminum or aluminum alloy, and a surf...
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WO/2019/194229A1 |
This electrogalvanized steel sheet is provided with a steel sheet, and an electrogalvanization layer which is positioned on at least one surface of the steel sheet and has a hairline extending in a predetermined direction on the surface....
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WO/2019/192070A1 |
Provided is a method for preparing a foam metal. The method comprises: carrying out a conductive treatment on a polyurethane foam, and electrodepositing at least one metal to obtain a foam metal substrate; carrying out a heat treatment o...
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WO/2019/190115A1 |
The present invention relates to an apparatus and a method for plating and, more specifically, to: an apparatus for performing uniform pattern plating on a substrate placed in a horizontal direction and a method therefor, and presents a ...
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WO/2019/189799A1 |
This tin-plated copper terminal material is obtained by laminating a nickel or nickel-alloy layer, a copper-tin alloy layer, and a tin layer, in this order, on a substrate made of copper or copper alloy, wherein: the tin layer has an ave...
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WO/2019/187591A1 |
The present invention provides a method for manufacturing a plated molded article, the method being capable of forming the plated molded article having good adhesion with respect to a metal surface on a substrate using a mold, while form...
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WO/2019/188843A1 |
Disclosed is a wiring board. The wiring board has a board including a first element, a diffusion layer that is in contact with the board and includes a first metal element, and a first metal film that is in contact with the diffusion lay...
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WO/2019/191524A1 |
In one example, an electroplating system comprises a first bath reservoir, a second bath reservoir, a clamp, a first anode in the first bath reservoir, a second anode in the second bath reservoir, and a direct current power supply. The f...
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WO/2019/188712A1 |
Provided is a roughened copper foil having low-roughness suitable for forming a thin-wire circuit and capable, when used in an SAP method, of providing a layered body with a surface profile which allows for not only excellent etching pro...
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WO/2019/188837A1 |
Provided is a surface-treated copper foil which exhibits excellent adhesion to resin, chemical resistance, and heat resistance, is less likely to produce etching residue, and is thus capable of achieving improved reliability of adhesion ...
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WO/2019/191523A1 |
In one example, an electroplating system comprises a bath reservoir, a holding device, an anode, a direct current power supply, and a controller. The bath reservoir contains an electrolyte solution. The holding device holds a wafer subme...
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WO/2019/181906A1 |
Provided is a tin or tin-alloy plating solution containing (A) a soluble salt comprising a stannous salt, (B) an acid selected from among organic acids and inorganic acids, or a salt thereof, (C) a surfactant, (D) benzalacetone, and (E) ...
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WO/2019/179794A1 |
An apparatus that includes:a platform (12) for a substrate (22); a guiding element (8) that is movable with respect to the platform (12) and spreads a liquid over the substrate (22) to form a meniscus (21); an activating element (11, 14,...
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WO/2019/179897A1 |
The present invention relates to a process for the fabrication of cobalt interconnections and to an electrolyte which enables the implementation thereof. The electrolyte which has a pH below 4.0 comprises cobalt ions, chloride ions and a...
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WO/2019/182207A1 |
The present invention relates to a lithium superionic conductor-based ammonia synthesis method. The synthesis method can synthesize ammonia at a high yield by optimizing synthesis conditions of ammonia required for respective steps.
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WO/2019/181924A1 |
A lead frame material of the present invention comprises an electrically conductive substrate and a roughened layer formed on at least one surface of the electrically conductive substrate. As viewed in a cross section of the lead frame m...
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WO/2019/181905A1 |
This tin or tin-alloy plating liquid comprises: (A) a soluble salt including at least a stannous salt; (B) an acid selected from among organic acids and inorganic aids, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) a...
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