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WO/2021/191955A1 |
This hot-stamp molded article is provided with a base material and, as an upper layer of the base material, a Zn-based plating layer that is provided in contact with the base material and that contains Zn and Ni. The area of the Zn-based...
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WO/2021/193038A1 |
Provided are: a raw cold-rolled steel plate with an iron-based coating that has excellent plating appearance and plating adhesion when molten zinc plating is applied after annealing, and that also has excellent chemical treatability when...
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WO/2021/192698A1 |
Provided is a porous metal body in the shape of a flat plate having a three-dimensional net-like skeleton, the porous metal body comprising a plurality of cells, wherein expressions (1) and (2) below are satisfied. (1): 0.4≤cell diamet...
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WO/2021/191334A1 |
The invention relates to a method for electrodepositing a grey or black layer on an electrical circuit. Said electrical circuit is, for example, a printed circuit-type electrical circuit for producing a module designed to be integrated i...
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WO/2021/190804A1 |
The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate. The method for a chemic...
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WO/2021/193863A1 |
A surface-treated copper foil for printed wiring boards according to the present invention has a surface-treated coating film which has a roughened layer comprising roughening particles formed on at least one surface of a copper foil bas...
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WO/2021/193781A1 |
Provided is a PCB terminal including a rod-like base material and a plating layer covering a predetermined region of the base material, wherein the base material is composed of a copper alloy containing more than 20 mass% of zinc, the pl...
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WO/2021/184114A1 |
An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits ...
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WO/2021/185914A1 |
The invention relates to a method for producing markings on galvanized steel strip or steel plate, wherein a metal salt solution, more particularly an inorganic metal salt solution, is applied to regions of the steel surface, and the ste...
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WO/2021/182240A1 |
Provided are a metal material and connection terminal that are resistant to sulfide blackening even with the surfacemost exposure of an Ag-Sn alloy layer. Also provided is a method for producing a metal material that is capable of produc...
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WO/2021/180375A1 |
The invention relates to an electrical contact part comprising a carrier substrate made from a metal material, a metal coating applied to the carrier substrate, and a coating blocker material applied to the carrier substrate in a sub-reg...
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WO/2021/180980A1 |
This invention relates to a method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing sa...
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WO/2021/181901A1 |
Provided are: a silver-plated material having superior fretting wear properties than ever before; and a method for manufacturing the silver-plated material. The silver-plated material is manufactured by forming a base plating layer 12 ma...
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WO/2021/177013A1 |
Provided are a filled microstructure and a conveyance method whereby damage during conveyance is inhibited and both ease of processing and filling defect prevention are achieved. The filled microstructure has: a first metal portion that ...
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WO/2021/177231A1 |
A Ni-plated steel sheet according to one embodiment of the present invention comprises a base steel sheet and a Ni-plated layer provided to a surface of the base steel sheet. The Ni-plated layer includes a Ni-Fe alloy layer formed on the...
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WO/2021/177035A1 |
A plating treatment device (1) according to one aspect of the present disclosure comprises a substrate holding part (10), a first electrode, a second electrode, and a voltage application part (30). The substrate holding part (10) holds a...
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WO/2021/171551A1 |
An object with a metal film is provided with a substrate containing a resin or a glass, a metal film covering at least part of the substrate, a first layer that is between the substrate and the metal film and contains an oxide of a metal...
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WO/2021/171818A1 |
The present invention provides: a silver-plated material which has higher hardness than ever before, while having excellent wear resistance; and a method for producing this silver-plated material. A method for producing a silver-plated m...
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WO/2021/171808A1 |
Provided are: a metal-filled microstructure that suppresses defects in the filling of a plurality of pores with metal as well as defects in the structure of conductors formed from the metal; a production method for the metal-filled micro...
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WO/2021/170851A1 |
The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a subst...
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WO/2021/170460A1 |
The invention relates to a piston ring having a main body. The main body has an inner peripheral surface, a first flank surface, a second flank surface and an outer peripheral surface. A first hard chromium layer having a network of crac...
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WO/2021/170861A1 |
The invention relates to a method of conditioning the surface of a steel strip coated with an electrolytically deposited zinc alloy anticorrosion layer, which is subjected to an increase in temperature to alter the steel microstructure, ...
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WO/2021/166467A1 |
Provided are: a metal body for which whisker generation as a result of being subjected to external stress is suppressed, and which can be easily manufactured; a fitting-type connection terminal; and a metal body formation method. This me...
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WO/2021/166581A1 |
A terminal material for a connector, the terminal material comprising a substrate in which at least a surface layer thereof comprises copper or a copper alloy, a nickel plating layer that comprises nickel or a nickel alloy and is formed ...
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WO/2021/164474A1 |
Provided are a coating conductive device, a coating system and a coating method for a conductive film (50), belonging to the technical field of preparation of conductive thin films. The coating conductive device is used for electrically ...
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WO/2021/157504A1 |
A plating method according to one embodiment of the present invention includes a substrate holding step, a first supply step, a second supply step and a voltage applying step. The substrate holding step is for holding a substrate. The fi...
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WO/2021/158402A1 |
Methods, inks, apparatus, and systems for forming metal features on semiconductor substrates are provided herein. Advantageously, the techniques herein do not require the use of photoresist, and can be accomplished without many of the pr...
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WO/2021/157362A1 |
Provided is a roughened copper foil which can achieve both of excellent etching properties and high share strength in the processing of a copper clad laminate plate or the manufacture of a printed wiring board. The roughened copper foil ...
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WO/2021/153160A1 |
One mode of this tin or tin alloy electroplating solution contains: a soluble salt (A) including at least a first tin salt; one or more compounds (B) selected from the group consisting of organic acids, inorganic acids, and salts thereof...
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WO/2021/151652A1 |
The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coat...
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WO/2021/154240A1 |
The present disclosure relates to a coating of a press hardened steel strip, the coating providing cathodic protection. The coating of the post-press hardened steel strip comprises zinc, aluminum, and at least one element selected from m...
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WO/2021/153112A1 |
Provided is a method for manufacturing a metal-filled microstructure in which metal filling defects in a plurality of pores are suppressed when the metal is filled in the plurality of pores. The method for manufacturing a metal-filled mi...
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WO/2021/149821A1 |
Provided is a roughened nickel-plated sheet that has, as the surfacemost layer on at least one side of a metal substrate, a roughened nickel layer formed from a plurality of nickel projections. In observation using a focused ion beam mil...
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WO/2021/149725A1 |
Provided is a stainless steel material which contains Cu that is an antibacterial component, has excellent antibacterial properties and excellent antiviral properties, and has a color tone of a stainless steel. The present invention is...
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WO/2021/150849A1 |
A decorative component includes a plateable resin body portion that is light- transmissive. A thin intermediate layer of material is electrolessly deposited over the body portion. The intermediate layer is laser ablated to selectively re...
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WO/2021/144375A1 |
The invention relates to a method for etching or dissolving a hard material coating on a base body, characterised in that the hard material coating is treated in an aqueous solution. The aqueous solution comprises ferrate and a strong base.
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WO/2021/144481A1 |
The present invention relates to a method for platinum-plating titanium lugs, which comprises steps of pre-treating the surface of the titanium lug before a step of electrodepositing the platinum, and to an electrochemical cell in which ...
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WO/2021/142357A1 |
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of...
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WO/2021/140855A1 |
Provided is a flexible printed circuit board comprising a base film that has a hole for forming a through hole and further comprising a coil shaped circuit layer that is laminated on at least one surface side of the base film, wherein: t...
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WO/2021/142187A1 |
A system for printing metal interconnects on a substrate includes an anode substrate. A plurality of anodes are arranged on one side of the anode substrate with a first predetermined gap between adjacent ones of the plurality of anodes. ...
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WO/2021/140688A1 |
Provided are: composite plated materials in which a composite plating layer formed from a composite material in which carbon particles are contained within an Ag layer is formed on a base material, the composite plated material being suc...
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WO/2021/134794A1 |
An array substrate, a manufacturing method therefor, and a backlight module. Before electroplating a first metal layer (15) on a pattern of a seed layer (11), the method further comprises: forming, on a side of a base substrate (10) havi...
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WO/2021/131359A1 |
In order to avoid damage to an electronic component caused by corrosion, there are provided a surface-treated copper foil and a method for manufacturing the same, the surface-treated copper foil being such that it is possible to maintain...
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WO/2021/132191A1 |
The purpose of the present invention is to provide a novel composite copper member which is treated with a silane coupling agent. This composite copper member comprises a layer, which contains needle-like copper oxide, in at least a part...
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WO/2021/133455A2 |
A process of enhancing surface adhesion of polyetherimides for metal plating includes contacting sulfuric acid with a surface of a polyetherimide substrate for a first dwell time to form a pre-etched polyetherimide substrate, contacting ...
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WO/2021/125635A1 |
The present invention provides an electrogalvanized steel sheet and a method for manufacturing same, the electrogalvanized steel sheet having superb whiteness, and an attractive exterior surface due to reduction in surface scales.
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WO/2021/125525A1 |
The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50mg/m 2 o...
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WO/2021/125410A1 |
Disclosed are: a surface-treated copper foil for a secondary battery negative electrode collector; a method for producing same; and a negative electrode for a secondary battery including same, wherein needle-shaped copper particles havin...
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WO/2021/123312A1 |
This invention relates to a method for manufacturing a laminated tinplate for packaging applications, the laminated tinplate comprising a tinplate sheet and a thermoplastic laminate layer that covers at least one side of the tinplate ste...
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WO/2021/125959A1 |
Process of electroforming a metal structure, in particular a structure with a tip protruding from adjacent outer layers. The process comprises the following steps; - a first layer is deposited on a substrate followed by one or more next ...
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