Title:
LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2020047470
Kind Code:
A
Abstract:
To provide a light emitting device which can inhibit cracks of a sealing resin and adhesion of foreign objects while sufficiently cooling a light emitting module.SOLUTION: As one embodiment of the invention, a light emitting device 1 is provided that includes: a light emitting module 5 in which multiple LED chips 51 are sealed by a sealing resin 54 containing a phosphor; a heat sink 6 having a plate-like base 61 having a mounting surface 61a on which the light emitting module 5 is mounted and multiple heat radiation fins 62 extending from a base surface 61b of the base 61; a blower fan 7 which blows wind to an area near the light emitting module 5 along at least the mounting surface 61a; and a wind shield plate 10 which is provided so as to enclose the lateral side of the sealing resin 54 of the light emitting module 5 and shields wind so as to prevent the wind from the blower fan 7 from hitting the sealing resin 54.SELECTED DRAWING: Figure 6
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Inventors:
TAKEDA SHIGEO
SHIMONISHI SHOTA
KATO HIDEAKI
ASAOKU MASAKI
SHIMONISHI SHOTA
KATO HIDEAKI
ASAOKU MASAKI
Application Number:
JP2018174956A
Publication Date:
March 26, 2020
Filing Date:
September 19, 2018
Export Citation:
Assignee:
TOYODA GOSEI KK
MARUMO DENKI KK
MARUMO DENKI KK
International Classes:
F21S2/00; F21V29/503; F21V29/67; H01L33/00; H01L33/64
Domestic Patent References:
| JP2011077155A | 2011-04-14 | |||
| JP2009302077A | 2009-12-24 | |||
| JP2007123946A | 2007-05-17 | |||
| JP2015097187A | 2015-05-21 | |||
| JP2011175771A | 2011-09-08 | |||
| JP2002314143A | 2002-10-25 |
Foreign References:
| US20100027270A1 | 2010-02-04 | |||
| CN206514266U | 2017-09-22 |
Attorney, Agent or Firm:
Hirata International Patent Office