Title:
MANUFACTURING METHOD OF ELEMENT CHIP
Document Type and Number:
Japanese Patent JP2020150166
Kind Code:
A
Abstract:
To improve quality of an element chip to be obtained, in a manufacturing method of the element chip including a laser scribe step and a dicing step by plasma.SOLUTION: A manufacturing method of an element chip comprises: a preparation step of preparing a board including multiple element regions and a division region defining the element regions, and having a first face and a second face on the opposite side to the first face; a laser scribe step of irradiating the division region with laser light from the first face side, and forming a groove corresponding to the division region and shallower than the thickness of the board in the board; a cleaning step of exposing the first face of the board to first plasma, and removing debris of the groove; and a dicing step of exposing the board exposed to the bottom of the groove to second plasma, after the cleaning step, and dividing the board into element chips including the element region, where the first plasma is generated by process gas containing carbon oxide gas.SELECTED DRAWING: Figure 4
Inventors:
OKITA SHOGO
HARIGAI ATSUSHI
ITO AKIHIRO
HARIGAI ATSUSHI
ITO AKIHIRO
Application Number:
JP2019047429A
Publication Date:
September 17, 2020
Filing Date:
March 14, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L21/301
Domestic Patent References:
| JP2018006677A | 2018-01-11 |
Attorney, Agent or Firm:
Kawasaki/Hashimoto Patent Office