Title:
MANUFACTURING METHOD OF ELEMENT CHIP
Document Type and Number:
Japanese Patent JP2020150167
Kind Code:
A
Abstract:
To improve quality of element chips to be obtained, in a manufacturing method of element chips including a step of dicing a laminate having a board and a resin layer by plasma etching.SOLUTION: A manufacturing method of element chips comprises: a preparation step of preparing a laminate including a first board including multiple element regions and divided areas, and having a first face and a second face, and a resin layer placed on the second face side; a protection film formation step of covering the first face with a protection film; an opening formation step of forming an opening by removing at least the protection film in the divided areas; a board etching step of exposing the first board, exposed from the opening, to the first plasma and etching the first board; and a resin etching step of exposing the resin layer exposed to the bottom of the groove formed by etching of the first board, after the board etching step, and etching the resin layer, where the second plasma is generated by process gas containing the carbon oxide gas.SELECTED DRAWING: Figure 2
Inventors:
OKITA SHOGO
HARIGAI ATSUSHI
ITO AKIHIRO
HARIGAI ATSUSHI
ITO AKIHIRO
Application Number:
JP2019047433A
Publication Date:
September 17, 2020
Filing Date:
March 14, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L21/301
Domestic Patent References:
| JP2014523111A | 2014-09-08 | |||
| JP2018093116A | 2018-06-14 |
Attorney, Agent or Firm:
Kawasaki/Hashimoto Patent Office