Title:
高周波モジュール
Document Type and Number:
Japanese Patent JP5664829
Kind Code:
B2
Abstract:
A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an IC chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies.
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Inventors:
多胡 茂
Application Number:
JP2014521768A
Publication Date:
February 04, 2015
Filing Date:
September 05, 2013
Export Citation:
Assignee:
株式会社村田製作所
International Classes:
H05K3/46; H01L23/12; H05K1/11
Domestic Patent References:
| JP2008270479A | 2008-11-06 | |||
| JP2011003584A | 2011-01-06 | |||
| JP2012195468A | 2012-10-11 | |||
| JP2009071094A | 2009-04-02 | |||
| JP2008130612A | 2008-06-05 |
Attorney, Agent or Firm:
Patent business corporation Kaede Patent Attorneys' Office