Title:
超音波計測装置
Document Type and Number:
Japanese Patent JP6800734
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic measuring device capable of reducing a size of the ultrasonic measuring device, in particular, the size in a thickness direction of a circuit board by simplifying electrical connection and a fixing structure between an ultrasonic transducer and a circuit board.SOLUTION: An ultrasonic measuring device includes: an ultrasonic transducer 22; and an analog PCB 21 for driving the ultrasonic transducer 22. The analog PCB 21 individually has circuit wiring 21b and 21c to which the ultrasonic transducer 22 is electrically connected on both surfaces of an end thereof. The ultrasonic transducer 22 has connection pins 22a1, 22a2 and 22a3, which are connected to circuit wiring 21b, 21b and 21c on a front surface of the analog PCB 21, and connection pins 22a4 and 22a5, which are connected to the circuit wiring 21c, 21c on a rear surface of the analog PCB 21. The connection pin 22a1, 22a2 and 22a3 and the connection pin 22a4, 22a5 extend parallel to one another with the analog PCB21 interposed thereamong.SELECTED DRAWING: Figure 3
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Inventors:
Nakamura Erio
Ken Sekimori
Yasuhiro Toriyama
Katsushige Matsubayashi
Ken Sekimori
Yasuhiro Toriyama
Katsushige Matsubayashi
Application Number:
JP2016247424A
Publication Date:
December 16, 2020
Filing Date:
December 21, 2016
Export Citation:
Assignee:
Ueda Japan Radio Co., Ltd.
Japan Radio Co., Ltd.
Nisshinbo Holdings Inc.
Japan Radio Co., Ltd.
Nisshinbo Holdings Inc.
International Classes:
G01N29/24; H04R1/06; H04R17/00
Domestic Patent References:
| JP2011066921A | ||||
| JP2002224104A | ||||
| JP2001333494A | ||||
| JP2010158522A | ||||
| JP2009194155A | ||||
| JP55047846A |
Foreign References:
| WO2010092908A1 | ||||
| US20160066885 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office