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Patent Searching and Data


Title:
金属めっき方法
Document Type and Number:
Japanese Patent JP6871574
Kind Code:
B2
Abstract:
To provide a metal plated product having a plating layer having high adhesion strength on a base material having a ceramic surface and a metal surface.SOLUTION: A metal plated product in the present invention has a base material having a ceramic surface and a metal surface, and a metal plating layer provided on the ceramic surface and the metal surface. The metal plating layer has metal nanoparticles at a portion near the base material. A silicon compound, which is a degradation product or reaction product of a first binder for fixing the metal nanoparticles to the ceramic surface, exists at an interface between the ceramic surface and the metal plating layer, and sulfur or a sulfur-containing compound, which is a degradation product or reaction product of a second binder for fixing the metal nanoparticles to the metal surface, exists at an interface between the metal surface and the metal plating layer.SELECTED DRAWING: Figure 1

Inventors:
Tsutomu Nagaoka
Hiroshi Shiiki
Yojiro Yamamoto
Shinji Harui
Hiromichi Katsuyama
Daiki Hamano
Yoshiharu Waku
Application Number:
JP2017211957A
Publication Date:
May 12, 2021
Filing Date:
November 01, 2017
Export Citation:
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Assignee:
Public University Corporation Osaka
Suzuki Alloy Co., Ltd.
International Classes:
C23C18/18; C23C18/52; C25D5/34; C25D5/54
Domestic Patent References:
JP2017019685A
JP2014033241A
JP2008133535A
Foreign References:
WO2013186941A1
WO2016098680A1
WO2008032839A1
Attorney, Agent or Firm:
Shintaro Nogawa
Shinji Kai
Yusuke Kaneko
Kiyoshi Inamoto