PURPOSE: To greatly reduce corrosion and deposit by a method wherein the inside wall of a hollow Cu component wherein a cooling liquid flows is provided with an Al layer covered with a film built by chemical formation or anodic oxidation.
CONSTITUTION: An Al pipe 12 is inserted in a Cu pipe 11 and expanded by means of the liquid pressure molding method or the like so that it may adhere tight to the inside wall of the Cu pipe 11. Next, heated solution of Na2CO3 and Na2CrO4, for example, is used to fill the vacancy inside the Al pipe 12. A choice of 1W5mm-thick Cu and 0.3W1mm-thick Al ensures a good result. A chemically formed Al film is far superior to Cu in terms of corrosion-resisting behavior. The subject being designed as such, a liquid-cooled machine experiencing very little corrosion and metal deposit is obtained wherein Cu transmits most of electricity and heat while the Al film stands against corrosion.
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WATANABE HIROSHI
IDA SADAO
KOBAYASHI ATSUO
