Title:
回路基板及び導体パターン構造
Document Type and Number:
Japanese Patent JP7027663
Kind Code:
B2
Abstract:
A circuit board includes a first conductive layer, a second conductive layer, and a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer includes a signal line, the second conductive layer includes a ground line, and the ground line of the second conductive layer includes a pattern area patterned in a meander shape.
Inventors:
Kim, Han
Choi, Seon Hee
Park, Dae Hyun
Choi, Seon Hee
Park, Dae Hyun
Application Number:
JP2016134256A
Publication Date:
March 02, 2022
Filing Date:
July 06, 2016
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H05K1/02
Domestic Patent References:
| JP2011061126A | ||||
| JP2013157308A | ||||
| JP2003124586A | ||||
| JP2008198651A |
Foreign References:
| US2963535 | ||||
| US20060152854 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
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