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Title:
CONDUCTIVE PASTE AND EXTERNAL ELECTRODE OF ELECTRONIC PART FORMED BY USING THIS CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JPH08148029
Kind Code:
A
Abstract:

PURPOSE: To attain increasing flexible dimension by suppressing a reaction layer to be formed between a part main unit and an external electrode.

CONSTITUTION: Conductive paste is formed by dispersing metal powder and glass frit in an organic vehicle. In the glass frit, zinc system frit and lead system frit are compounded, further to set compounding ratio of the zinc system frit to within a range of 20 to 80wt.%, on the other hand to set ratio of the lead system frit to within a range of the rest. An external electrode 2 of an electronic part 1 is formed by using the conductive paste, to contain the glass frit of compounding the zinc system frit with compounding ratio set to within a 20 to 80wt.% range and the lead system frit with compounding ratio set to within a range of the rest.


Inventors:
OTANI AKIRA
Application Number:
JP29007994A
Publication Date:
June 07, 1996
Filing Date:
November 24, 1994
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H05K1/09; C03C8/18; H01B1/16; H01G4/008; H01G4/20; H01G4/232; H01G4/252; H01M4/62; (IPC1-7): H01B1/16; C03C8/18; H01G4/008; H01G4/252; H05K1/09
Attorney, Agent or Firm:
Kazuhide Okada