Title:
COPPER OR COPPER ALLOY MATERIAL EXCELLENT IN RESIN ADHESIVENESS
Document Type and Number:
Japanese Patent JP3881419
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the copper or copper alloy material to give good adhesiveness with a resin.
SOLUTION: In the copper or copper alloy material given a roughed surface by dull roll rolling at the time of final rolling or temper rolling, or in the copper or copper alloy material given a rouged surface by an acid solution etching, based on the surface enlarged in 1,000 times by an electron three dimensional roughness analyzer, an arithmetic average roughness is 0.05-0.8 μm and a surface area substitutive value, which is defined as (sample surface area obtained from measurement)/(length × width in measurement range), is 1.005-1.08. Or in the copper or copper alloy material having a roughened surface of an oxidized film formed on a surface by immersing in an alkali solution after final rolling, based on the surface enlarged in 3,000 times by an electron three dimensional roughness analyzer, an arithmetic average roughness is 0.03-0.5 μm and a surface area substitutive value is 1.005-1.1. These are excellent in a joining property with a resin.
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Inventors:
Atsushi Kodama
Kazuhiko Fukamachi
Kazuhiko Fukamachi
Application Number:
JP9133497A
Publication Date:
February 14, 2007
Filing Date:
March 27, 1997
Export Citation:
Assignee:
Nikko Metal Co., Ltd.
International Classes:
C22C9/00; C23C22/78; H01L23/50; (IPC1-7): C22C9/00; C23C22/78
Domestic Patent References:
| JP5315511A | ||||
| JP846116A | ||||
| JP8288447A | ||||
| JP3193834A |
Attorney, Agent or Firm:
Motohiro Kurauchi
Hiroshi Kazama
Hiroshi Kazama
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