To provide a curable resin composition capable of forming a cured material having both of light fast transparency and bonding reliability by curing a modified polyorganosiloxane compound having an epoxy group and/or oxetanyl group in one molecule.
This curable resin composition contains (A) the modified polyorganosiloxane compound having 2 epoxy groups and/or oxetanyl groups in one molecule, which is a hydrosililation reaction material of the following compounds: (1) an organic compound having 2 to 6 carbon-carbon double bonds having a reactivity with SiH group in one molecule, (2) a linear and/or cyclic polyorganosiloxane compound having at least 2 SiH groups in one molecule and (3) an organic compound having at least one epoxy or oxetanyl group and one carbon-carbon double bond having a reactivity with the SiH group, (B) an acid anhydride and (C)a curing accelerator, and its cured material is also provided.
FUJIWARA MASAHIRO
ICHIYANAGI NORIKATSU
FUJITA MASAYUKI
