To provide a dicing die-bonding film which has an adhesive layer and a die-bonding layer easily peeled and never stuck after being peeled, and has an excellent pickup property even when a semiconductor wafer is thin/large in size.

The dicing die-bonding film is characterized in that a pressure-sensitive adhesive layer of a dicing film contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer, which is an acrylic polymer A. The acrylic polymer A is composed of a monomer composition containing 50% by weight or more of an acrylic acid ester such that an alkyl group has 6 to 10 carbon atoms and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer.

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