Title:
分解洗浄組成物、接着性ポリマーの洗浄方法、及びデバイスウェハの製造方法
Document Type and Number:
Japanese Patent JP7405100
Kind Code:
B2
Abstract:
Provided is a decomposing/cleaning composition for an adhesive polymer having a high etching rate and suppressed infiltration into a contact interface between a substrate such as a device wafer and an adhesive layer such as a fixing tape. The decomposing/cleaning composition of one embodiment is a decomposing/cleaning composition for an adhesive polymer containing a quaternary alkylammonium fluoride or a quaternary alkylammonium fluoride hydrate and an aprotic solvent, wherein the aprotic solvent contains (A) an N-substituted amide compound having no active hydrogens on the nitrogen atoms and (B) at least one organic sulfur oxide selected from the group consisting of sulfoxide compounds and sulfone compounds.
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Inventors:
Susumu Nakazaki
Kuniaki Miyahara
Tomoyuki Fukuyo
Kuniaki Miyahara
Tomoyuki Fukuyo
Application Number:
JP2020566112A
Publication Date:
December 26, 2023
Filing Date:
October 31, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
H01L21/304; C11D7/32; C11D7/34; C11D7/50
Domestic Patent References:
| JP2005500408A | ||||
| JP11067632A |
Foreign References:
| WO2014092022A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Masatoshi Takahashi
Hajime Kawahara
Shinji Mihashi
Masatoshi Takahashi
Hajime Kawahara