To provide a method in which the leaking-out of a sealant to the reverse side through a through-hole in a resin sealing process after a discrete circuit component is loaded on a base body with the through-hole.
The method has (a) a step where the plated through-holes 131 and 132 are filled with paddings; (b) the step where circuit dies are placed on each first conductive partition of die-surface pattern sets 111 and 112, first electrodes for the dies are connected electrically to the partitions, and second electrodes for the dies are connected electrically to the second conductive partitions of the same patterns 111 and 112; (c) the step where the dies and all die-surface pattern sets on the first surface of a base body are sealed hermetically; and (d) the step where each of a plurality of the discrete circuit components is separated physically by removing paddings in the plated through-holes, cutting the hermetically sealed base body, and individualizing the dies.
| JP2000340897 | CIRCUIT BOARD |
| WO/2021/262920 | MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS |
YO SEIKAI
KO SHIRYO
Hideka Tanaka
Yoshiyuki Shiraishi
Kunihiko Shiromura
Tsuyoshi Kumano
Hiroaki Yamane