Title:
DOUBLE-SIDED PRINTED BOARD
Document Type and Number:
Japanese Patent JPH05299800
Kind Code:
A
Abstract:
PURPOSE: To simplify land-to-land connections on a board by means of a through hole definitely and enhance reliability.
CONSTITUTION: Lands 4 and 5 are installed to both sides of a board 2 where the space between the lands 4 and 5 is penetrated with a through hole 6. A plurality of conductive small gage wires are inserted into the through hole 6. After the penetration of the gage wires, the board 2 is submerged in a solder tank where the solder is absorbed by a capillary phenomenon of the small gage wire into the through hole and filled in.
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Inventors:
KAWAKAMI SHIN
Application Number:
JP12687192A
Publication Date:
November 12, 1993
Filing Date:
April 20, 1992
Export Citation:
Assignee:
NIPPON CMK KK
International Classes:
H05K1/11; H05K3/34; H05K3/40; (IPC1-7): H05K1/11
Attorney, Agent or Firm:
Takeshi Nara