Title:
電子制御装置
Document Type and Number:
Japanese Patent JP6921710
Kind Code:
B2
Abstract:
An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.
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Inventors:
Isamu Yoshida
Kamoshida Masaru
Execution Toshikazu
Shiro Yamashita
Kamoshida Masaru
Execution Toshikazu
Shiro Yamashita
Application Number:
JP2017209463A
Publication Date:
August 18, 2021
Filing Date:
October 30, 2017
Export Citation:
Assignee:
Hitachi Astemo, Ltd.
International Classes:
H05K7/20; H01L23/36
Domestic Patent References:
| JP2009158796A | ||||
| JP2003289191A | ||||
| JP2013093372A | ||||
| JP2017130514A | ||||
| JP2013197405A | ||||
| JP2017162860A |
Foreign References:
| WO2015008326A1 |
Attorney, Agent or Firm:
Patent Business Corporation Sunnext International Patent Office