Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003147054
Kind Code:
A
Abstract:
To provide an epoxy resin composition excellent in low dielectric property, flame retardance and heat resistance, not using a halogen flame retardant and capable of being used for printed circuit boards.
This epoxy resin composition consists essentially of a phosphorated epoxy resin, a phenol-modified polybutadiene and a compound having oxazoline ring.
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Inventors:
YAMADA MICHIICHI
NISHIZAKI YOSHIKAZU
NISHIZAKI YOSHIKAZU
Application Number:
JP2001351870A
Publication Date:
May 21, 2003
Filing Date:
November 16, 2001
Export Citation:
Assignee:
RISHO KOGYO KK
International Classes:
C08J5/24; C08G59/62; (IPC1-7): C08G59/62; C08J5/24
Attorney, Agent or Firm:
Bunji Kamata (2 outside)