Title:
成膜装置、成膜方法、および電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP7229014
Kind Code:
B2
Abstract:
An objective of the present invention is to provide technology for suppressing degradation in quality of sputtering even when sputtering is performed while moving a sputtering region in a chamber having non-uniform pressure distribution. A film forming device comprises: a chamber in which an object for film formation and a target are disposed therein; and a moving means moving a sputtering region for generating sputter particles from the target in the chamber. The film forming device deposits sputter particles on the object for film formation to form a film while moving the sputtering region by the moving means. The moving means uses the film forming device changing a distance between the sputtering region and the object for film formation according to the pressure in the vicinity of the sputtering region.
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Inventors:
Hiroki Sugawara
Matsumoto Yukio
Matsumoto Yukio
Application Number:
JP2018244314A
Publication Date:
February 27, 2023
Filing Date:
December 27, 2018
Export Citation:
Assignee:
Canon Tokki Co., Ltd.
International Classes:
C23C14/34; C23C14/35
Domestic Patent References:
| JP2017521560A | ||||
| JP2007182617A | ||||
| JP59070775A | ||||
| JP11061401A | ||||
| JP2007138275A | ||||
| JP2004091858A | ||||
| JP2014125649A | ||||
| JP3271369A | ||||
| JP2011246788A | ||||
| JP2013100568A | ||||
| JP2014074188A |
Other References:
田尻修一 他,スパッタリングプロセスにおける静的圧力分布、および動的圧力変化の実測,J.Vac.Soc.Jpn,2017年,Vol.60 No.6,220-227
Attorney, Agent or Firm:
Patent Attorney Corporation Shuwa Patent Office
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