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Title:
HEAT CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, HEAT CONDUCTIVE FOAMED SHEET-LIKE MOLDED PRODUCT AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2005239744
Kind Code:
A
Abstract:

To obtain a heat conductive pressure-sensitive adhesive composition having excellent balance between hardness and pressure-sensitive adhesiveness and further excellent shape following properties and flame retardance, and to prepare a heat conductive pressure-sensitive adhesive sheet.

The heat conductive pressure-sensitive adhesive composition is composed of 100 pts.wt. of an acrylic or a methacrylic ester copolymer (A) obtained by polymerizing 5 to 70 pts.wt. of a monomer mixture (A2m) composed of a specific amount of an acrylic or a methacrylic ester monomer having a specified structure, a specific amount of a monomer having an organic acid group and a specified amount of a monomer copolymerizable with the monomers in the presence of 100 pts.wt. of a copolymer (A1) containing a specific amount of a unit derived from an acrylic or a methacrylic ester monomer having a specified structure, a specific amount of a monomer unit having the organic acid group, a specified amount of a monomer unit containing a functional group other than the organic acid group and a specific amount of a monomer unit derived from a monomer copolymerizable with the monomers and 70 to 170 pts.wt. of a metal hydroxide (B). The acrylic or methacrylic ester copolymer (A) is foamed.


Inventors:
MIKUNI TAKAMITSU
IWABUCHI SATOSHI
OGIWARA MANABU
Application Number:
JP2004047208A
Publication Date:
September 08, 2005
Filing Date:
February 24, 2004
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C09J7/00; C09J7/02; C09J11/04; C09J151/00; (IPC1-7): C09J151/00; C09J7/00; C09J7/02; C09J11/04
Domestic Patent References:
JP2002285121A2002-10-03
JPH07102232A1995-04-18
JPH07157736A1995-06-20
JP2002322449A2002-11-08
JP2002134666A2002-05-10
JP2002322447A2002-11-08
JP2002128931A2002-05-09