Title:
【発明の名称】均一エチレンインターポリマーとブロックコポリマーを含んで成るホットメルト接着剤組成物
Document Type and Number:
Japanese Patent JP2002519474
Kind Code:
A
Abstract:
A hot melt adhesive composition comprising a) from about 5 wt-% to about 50 wt-% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm3; b) from about 1 wt-% to about 40 wt-% of at least one block copolymer; and c) from about 10 wt-% to about 75 wt-% of at least one tackifying resin wherein said adhesive does not fail cohesively.
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Inventors:
Quinn, Thomas H
Canon, cannel
Essyuller-The Youngson, Beth M
Keel, microphone
Lindkist, jeffrey
Marcomb, David
Matsukei, kevin
Parique, daypak
Canon, cannel
Essyuller-The Youngson, Beth M
Keel, microphone
Lindkist, jeffrey
Marcomb, David
Matsukei, kevin
Parique, daypak
Application Number:
JP2000557320A
Publication Date:
July 02, 2002
Filing Date:
June 30, 1999
Export Citation:
Assignee:
H.B. Fuller Licensing and Financing Incorporated
The Dow Chemical Company
The Dow Chemical Company
International Classes:
C09J7/02; C08F210/16; C08J9/12; C08L23/04; C09J5/08; C09J123/08; C09J153/00; C09J153/02; C08L23/08; C08L53/02; C08L93/00; (IPC1-7): C09J123/08; C09J7/02; C09J153/00
Domestic Patent References:
| JPH09302319A | 1997-11-25 |
Foreign References:
| WO1997033921A1 | 1997-09-18 | |||
| WO1998003603A1 | 1998-01-29 | |||
| WO1997044404A1 | 1997-11-27 |
Attorney, Agent or Firm:
Heiyoshi Odashima