Title:
IMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH04142327
Kind Code:
A
Abstract:
PURPOSE:To obtain an imide resin composition which can give a cured product having high heat resistance, a low coefficient of thermal expansion and low elastic modulus by mixing a trismaleimide with a bismaleimide, a triamine and a glycidyl-terminated siloxane oligomer. CONSTITUTION:The title composition is obtained by mixing a trismaleimide of formula I (wherein R<1>, R<2> and R<3> are each H or a lower alkyl; n and s are each 0-4; and m is 0-3), e.g. 1,3-bis[(N-4-maleimidophenyl)methyl]-N-4- maleimido-benzene, with a bismaleimide (e.g. N,N'-3,4'-diphenyl ether bismaleimide), a triamine of formula II (wherein R<4>, R<5> and R<6> are each II or lower alkyl; t and x are each 0-4; and w is 0-3) {e.g. 1,3-bis[(4-aminophenyl) methyl]-4-aminobenzene} and a glycidyl-terminated siloxane oligomer, desirably a reactive siloxane oligomer of formula III wherein n is 0-20; and R is H, CH3 or phenyl. This composition can give a cured product of high heat resistance and low elastic modulus and therefore it is desirable as a sealing material for IC or the like.
Inventors:
SUGA KOUJIROU
TAKEUCHI KUNIHIKO
TAKEUCHI KUNIHIKO
Application Number:
JP26699290A
Publication Date:
May 15, 1992
Filing Date:
October 04, 1990
Export Citation:
Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
C08L63/00; C08G59/00; C08G59/30; C08G59/40; C08G73/12; C08L83/04; C08L83/06; H01L23/29; H01L23/31; (IPC1-7): C08G59/30; C08G59/40; C08G73/12; C08L63/00; C08L83/06; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Nobuto Watanabe (1 person outside)