To provide a lamination-type thin-film capacitor that can be packaged easily and has a large-capacity and low-impedance structure.

In a thin-film capacitor, a capacitor body 3 where an electrode layer 1 and a dielectric layer 2 are alternately laminated is formed on a substrate 4, odd-numbered electrode layers 1a starting from the side of the substrate 4 of the electrode layer 1 are connected each other by an inner conductor 7, at the same time an insertion hole 8 where the inner conductor 7 is inserted without any contact is formed at an even-numbered electrode layer 1b starting from the side of the substrate 4 of the electrode layer 1, and the even-numbered electrode layers 1b are connected by an external conductor 9 that is formed on the outer surface of the capacitor body 3.