Title:
LAND GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2002313995
Kind Code:
A
Abstract:
To provide a land grid array semiconductor device which is reformed to improve the positioning accuracy of the external electrode of a mounting board.
An external electrode 11 is arranged in an area array form on one side of the board 2. The external electrode 11 includes an external electrode pad 11a and a external electrode wire 6. The external electrode pad 11a includes a first pad layer 12 made in a columnar form, and a second pad layer 13 made conically to cover the surface of the first pad layer 12.
Inventors:
OKADA MAKIO
KASATANI TAIJI
HASHIMOTO TOMOAKI
KASATANI TAIJI
HASHIMOTO TOMOAKI
Application Number:
JP2001120717A
Publication Date:
October 25, 2002
Filing Date:
April 19, 2001
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/12; H01L21/52; H01L23/498; H05K3/34; H05K1/11; H05K3/32; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Hisami Fukami (4 outside)
Previous Patent: SEMICONDUCTOR DEVICE AND ITS MOUNTING STRUCTURE
Next Patent: SUBSTRATE FOR SEMICONDUCTOR PACKAGE, AND ITS MANUFACTURING METHOD
Next Patent: SUBSTRATE FOR SEMICONDUCTOR PACKAGE, AND ITS MANUFACTURING METHOD