Title:
LANDING POINT FLATNESS DETECTION METHOD FOR AUTOMATIC LANDING DEVICE
Document Type and Number:
Japanese Patent JP3463721
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an automatic landing device capable of automatically measuring a landing point flatness which becomes a criterion of a possibility for landing on a target point of a moon or planetary probe machine, etc.
SOLUTION: A flatness of a target landing point is detected by providing an irradiation device 15 irradiating different points on a land surface which floodlighting beam from above a landing target point and its periphery, cameras 16, 17 for observing the points on the load irradiated with the floodlighting beams, and processing device 18, 19 for processing observed images, calculating the irradiated points, and judging a flatness thereof; irradiating different points on the land surface with the floodlighting beams simultaneously; observing the irradiation points on the land surface with the floodlight beams by the two cameras 16, 17; calculating the positions of the irradiation points on a principle of a stereoscopic view from the observed images before calculation equations for plural planes configured by the irradiated points with the floodlighting beams; and calculating normal directions of each plane and the distances between each plane and the landing target point and comparing them which each other.
Inventors:
Hiroshi Koyama
Application Number:
JP9270996A
Publication Date:
November 05, 2003
Filing Date:
April 15, 1996
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G01C7/02; B64G1/66; G01B11/24; G01B11/245; G08G5/02; (IPC1-7): G01C7/02; G01B11/24
Domestic Patent References:
| JP663500U |
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)