発光装置の製造方法および発光装置

Title:

発光装置の製造方法および発光装置

Document Type and Number:

Japanese Patent JP7328560

Kind Code:

B2

Abstract:

A method of manufacturing a light emitting device includes: providing a light emitting element including a p-side electrode and a n-side electrode on a same surface side; providing a substrate on which first and second wiring seed layers are formed; forming a resist pattern within an area on the substrate where the light emitting element is to be placed; placing the light emitting element on the resist pattern such that the p-side electrode and the first wiring seed layer are separated from and face each other, and the n-side electrode and the second wiring seed layer are separated from and face each other; joining the first wiring seed layer with the p-side electrode, and joining the second wiring seed layer with the n-side electrode, by plating using the resist pattern as a mask; and removing the resist pattern.

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Inventors:

Daisuke Miga

Application Number:

JP2020214106A

Publication Date:

August 17, 2023

Filing Date:

December 23, 2020

Export Citation:

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Assignee:

Nichia Corporation

International Classes:

H01L33/62; H01L21/60; H01L25/04; H01L25/18

Domestic Patent References:

JP2015184600A
JP2011233733A
JP2017183458A
JP8148531A
JP7183304A
JP2014013818A

Foreign References:

US20150187746
US20170092631

Attorney, Agent or Firm:

Norito Yamao
Haruhiko Ema
Ken Takaoka

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