Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3862294
Kind Code:
B2
Abstract:
PURPOSE: To prevent the generation of the mutual shortcircuit of conductors by extending a groove packed with an insulated material onto an edge part in the active area of a semiconductor main body surrounded by a field insulated area so as to form the pattern of a conductor.
CONSTITUTION: A semiconductor device with a conductor main body with a field insulated area 14 formed by packing an insulated material 13 into a groove 10 is manufactured. Especially before etch-forming the groove 10 in the main body 1, an auxiliary layer 6 is removed from a part of a surface positioned adjacent to an etching mask 9 formed on the layer 6 on the surface of the main body 1. After etch-forming the groove 10 in the main body 1, the layer 6 is removed from the edge part 12 of a surface positioned on the lower side of the mask 9. Thereby it is possible to surely prevent the generation of the mutual shortcircuit of conductors by extending onto the area 14 and an active area 15.
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Inventors:
Armando Pull Aim Boom
Ronald Costel
Cornelis Eustatius Timerink
Ronald Deckel
Ronald Costel
Cornelis Eustatius Timerink
Ronald Deckel
Application Number:
JP22815194A
Publication Date:
December 27, 2006
Filing Date:
September 22, 1994
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L21/31; H01L21/76; H01L21/308; (IPC1-7): H01L21/76; H01L21/31
Domestic Patent References:
| JP2231739A |
Attorney, Agent or Firm:
Susumu Tsugaru
Kosaku Sugimura
Yasunori Sato
Norita Tomita
Umemoto Masao
Takashi Nihei
Kosaku Sugimura
Yasunori Sato
Norita Tomita
Umemoto Masao
Takashi Nihei