PURPOSE: To make it possible to recognize in what position a chip is positioned on a wafer even when it is brought into a chip state by a method wherein a mark, identifying the position of the chip on the wafer, is attached to all semiconductor chips.

CONSTITUTION: A chip 15 is surrounded by vertical scribe lines A9 and horizontal scribe lines B4 and B5, and it has glass coat forming part 13 and a mask alignment mark 14. A raw indicating identification mark 18 and a column indicating identification mark 19 indicating the position of the chip 15, are formed inside the glass coat forming part 13. As the chip is positioned, for example, between vertical scribe lines A9 and A10, the vertical scribe lines are indicated by the mark 18 of a number 0910, and the mark 18 is put at the upper left corner. As the chip is positioned between the horizontal scribe lines B4 and B5, the scribe lines are indicated by the mark 19 of a number 0404, and the number is at the lower right corner of the chip.