To obtain a large number of circuit boards from one ceramic substrate.
One large ceramic substrate 11 and a patterned metal pattern plate 12 of the substantially same size are prepared. They are bonded as shown on Fig. 1(c). The metal pattern plate 12 is divided into a central circuit pattern 12a where the same pattern of 2 columns×3 rows is arranged (unit pattern), and a peripheral part 12b. In both the circuit pattern 12a and the peripheral part 12b, individual patterns making up them are coupled by a coupling part 13 smaller than them. Thereafter, a plating layer 14 is formed on the entire surface of the metal pattern plate 12. Six split units 15, the top view of which is shown on Fig. 1(e), are obtained by splitting the ceramic substrate 11. The coupling part 13 can be cut easily after the splitting by using a cutter or a nipper.
WATANABE JUNICHI
TAKADA MASAYOSHI
ASADA MASARU
| JPH03102892A | 1991-04-30 | |||
| JPS63196065A | 1988-08-15 | |||
| JP2003229656A | 2003-08-15 | |||
| JP2000022307A | 2000-01-21 | |||
| JP2001168503A | 2001-06-22 | |||
| JP2007019123A | 2007-01-25 | |||
| JPH0918096A | 1997-01-17 |
Yukihiko Maejima
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